TECHNICAL FIELD

[0001]

The present invention relates to microdevice manufacturing systems .

BACKGROUND ART

[0002]

Conventionally, as measures against dust in a

semiconductor manufacturing process, there are clean rooms in which dust prevention measures are performed (see, for example, patent document 1) .

[0003]

Patent Document 1: Japanese Unexamined Patent Application, Publication No. H06-342841

DISCLOSURE OF THE INVENTION

Problems to be Solved by the Invention

[0004]

However, in order to manufacture microdevices including semiconductor components, it is necessary to acquire a wide floor area for installing a manufacturing device and to make a large capital investment. Thus, only some large companies can manufacture microdevice components. Hence, there is a

microdevice manufacturing system that is intended to establish a manufacturing line of microdevice components under an environment other than a clean room by putting a small substrate, including a small-diameter wafer having a diameter of about 13 mm, into a small sealed container and thereby performing handling between devices. However, there are requirements for reducing the actual cost of preparing the small sealed container into which the small substrate, including the small-diameter wafer, is put so as to

manufacture microdevice components with a small investment. There are also requirements for reducing the temporal cost of storing the small substrate, including the small-diameter wafer, into the sealed container so as to efficiently

manufacture microdevice components.

[0005]

The present invention is made in view of such conditions and has an object to provide a method with which it is possible to efficiently manufacture the microdevice with a small investment.

Means for Solving the Problems

[0006]

In order to achieve the above object, a microdevice manufacturing system according to an aspect of the present invention includes:

, under an environment where n (n is an arbitrary integer value equal to or more than one) microdevice manufacturing devices perform processing in predetermined one or more steps among a plurality of steps for manufacturing a predetermined type of microdevice having a substrate of a predetermined size as one unit,

a transport portion which transports, in the n microdevice manufacturing devices, from a first microdevice manufacturing device that completes performance of processing on a

predetermined unit to a second microdevice manufacturing device that can perform processing in the subsequent step, the predetermined unit; and

a clean holding portion which shields the transport portion from an outside unclean portion in the outside such that the predetermined unit is transported in a clean portion.

Effects of the Invention

[0007]

In the present invention, it is possible to efficiently manufacture microdevice with a small investment under an environment in which dust prevention measures are performed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008]

Fig. 1 is a diagram showing an example of the

configuration of a semiconductor manufacturing system

according to an embodiment of a microdevice manufacturing system in the present invention;

Fig. 2 is a plan view showing the specific configuration of the semiconductor manufacturing system in Fig. 1;

Fig. 3 is a cross-sectional side view of the semiconductor manufacturing system in Fig. 2;

Fig. 4 is a diagram showing the specific example of a wafer supply portion included in a first semiconductor manufacturing device in the semiconductor manufacturing system of Fig. 2 ;

Fig. 5 is a block diagram showing the hardware

configuration of a server in the semiconductor manufacturing system of Fig. 1;

Fig. 6 is a functional block diagram showing an example of the functional configuration of the server in Fig. 5; and

Fig. 7 is a diagram showing a specific example of the types of semiconductor components and steps for each of the types managed by the server of Fig. 5.

PREFERRED MODE FOR CARRYING OUT THE INVENTION

[0009]

An embodiment of the present invention will be described below with reference to drawings. Fig. 1 is a diagram showing an example of the configuration of a semiconductor

manufacturing system S according to an embodiment of a microdevice manufacturing system in the present invention.

[0010]

The semiconductor manufacturing system S shown in Fig. 1 is configured so as to include a server 1, first semiconductor manufacturing devices 2-1 to 2-8, a second semiconductor manufacturing device 3, a transport device 4, delivery portions 5-1 to 5-11 and a clean tunnel 6. The server 1, the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3 and the transport device 4 are connected to each other through a predetermined network L such as a local area network (LAN) . In the following description, when it is not necessary to distinguish the first semiconductor manufacturing devices 2-1 to 2-8 from each other they are collectively referred to as "first semiconductor manufacturing devices 2". Although the number of first

semiconductor manufacturing devices 2 is eight in the example of Fig. 1, there is no particular limitation to the eight, and the number thereof may be n (n is an arbitrary integer value more than or equal to one) . Although the number of second semiconductor manufacturing devices 3 is one in the example of Fig. 1, there is no particular limitation to the one, and the number thereof may be m (m is an arbitrary integer value which is different from n and which is more than or equal to one) .

[0011]

In the semiconductor manufacturing system S, a

predetermined type of semiconductor component is manufactured in units of a wafer having a predetermined size. In order to manufacture the predetermined type of semiconductor component, predetermined processing in each of a plurality of steps such as washing, exposure and development is sequentially performed The server 1 controls the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3, and thereby individually performs a plurality of steps so as to manufacture the predetermined type of

semiconductor component in units of the wafer having the predetermined size. [0012]

In other words, each of the first semiconductor

manufacturing devices 2-1 to 2-8 performs, among a plurality of steps for manufacturing a predetermined type of

semiconductor component having a wafer of a predetermined size as one unit, processing in predetermined one or more steps which are previously set. Here, the steps necessary for

manufacturing the semiconductor component of the type to be manufactured are limited, and thus only at least one of the first semiconductor manufacturing devices 2 can perform

individual processing in each of the steps. As described above, the semiconductor manufacturing system S can be formed with the necessary minimum number of first semiconductor

manufacturing devices 2 (eight in the example of Fig. 1) .

Furthermore, one first semiconductor manufacturing device 2 is extremely compact and can be procured significantly

inexpensively as compared with a conventional semiconductor device which performs processing in a large number of steps at a time. In this way, even when it is difficult to acquire the cost for procuring the conventional semiconductor device and the place where the conventional semiconductor device is installed, the semiconductor manufacturing system S is adopted, and thus it is possible to efficiently manufacture

semiconductor components with a small investment.

[0013]

The second semiconductor manufacturing device 3 is a semiconductor manufacturing device which performs, as processing in predetermined one or more steps which are different from the steps performed by the first semiconductor manufacturing devices 2, collective processing on two or more units of the wafers at a time. Specifically, for example, the second semiconductor manufacturing device 3 performs

processing such as in a sputtering step, an implant step or a CVD (chemical vapor deposition) step on two or more units of the wafers at a time.

[0014]

The specific configurations of the first semiconductor manufacturing devices 2 and the second semiconductor

manufacturing device 3 will be described later with reference to the example of Figs. 2 to .

[0015]

The transport device 4 is installed according to the layout of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3, and transports, based on an instruction from the server 1, the wafer from a predetermined one of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to another.

[0016]

In the transport device 4, a conveyer on which the wafer is loaded and which transports it in a predetermined direction is arranged on the inner circumference of the first

semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3. In order for the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to be connected to the conveyer, the delivery portions 5-1 to 5-11 are respectively provided. When predetermined steps are performed in the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3, the wafers are

respectively transported from the conveyer through the delivery portions 5-1 to 5-11 to the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3. Then, after the predetermined steps are performed, the wafers are respectively transported from the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 through the delivery portions 5-1 to 5-11 to the conveyer. In the following description, when it is not necessary to distinguish the delivery portions 5-1 to 5-11 from each other, they are collectively referred to as "delivery portions 5".

[0017]

Specifically, as shown in Fig. 2 which will be described later, the delivery portion 5 is formed with a bar-shaped member, and has, at one end portion, a conveyer fixing portion 501 for fixing itself to the conveyer and has, at the other end portion, a wafer loading portion 502 for loading a predetermined one unit of the wafer. For example, when the steps for manufacturing the predetermined type of

semiconductor component include a process in which a first step is performed in the first semiconductor manufacturing device 2-2 and in which thereafter a separate second step is performed in the first semiconductor manufacturing device 2-3, the delivery portions 5 perform the following processing.

Specifically, the delivery portion 5-2 receives the wafer from the first semiconductor manufacturing device 2-2 which

performs the processing in the first step on the predetermined one unit of the wafer. Here, the first semiconductor

manufacturing device 2-2 separates, on the wafer loading portion 502, the wafer sucked by a Bernoulli chuck 202 which will be described later and which is shown in Fig. 2 so as to load the wafer onto the delivery portion 5-2. In this way, the delivery portion 5-2 receives the predetermined one unit of the wafer from the first semiconductor manufacturing device 2- 2. Then, the delivery portion 5-2 loads the wafer onto the wafer loading portion 502. In this way, the wafer is. moved by the conveyer and is stopped in front of the first

semiconductor manufacturing device 2-3. Here, the first semiconductor manufacturing device 2-3 makes the Bernoulli chuck 202 (see Fig. 2) suck the wafer loaded on the wafer loading portion 502 so as to receive it. Then, the first semiconductor manufacturing device 2-3 performs ^' the processing in the second step on the wafer. In this way, the delivery portions 5-1 and 5-2 deliver the predetermined one unit of the wafer from the first semiconductor manufacturing device 2-1 to the first semiconductor manufacturing device 2-2. In other words, the delivery portions 5 perform the processing

described above so as to connect the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to the conveyer.

[0018]

The clean tunnel 6 is arranged so as to cover the entire transport device 4, and shields the transport device 4 from an unclean portion outside the clean tunnel 6 so as to transport, with the transport device 4, the predetermined one unit of the wafer in a clean portion. In other words, the interior of the clean tunnel 6 is completely shielded from the outside of the clean tunnel 6. Hence, within the clean tunnel 6, a clean environment which is suitable for processing the wafer is maintained. For example, the interior of the clean tunnel 6 is put in an atmosphere of nitrogen or a vacuum atmosphere, and thus it is possible to maintain the clean environment. As described above, in the semiconductor manufacturing system S, the transport of the wafer from a predetermined one of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to another is consistently performed in a state where the wafer is shielded from the unclean portion. In this way, it is possible to prevent the wafer from being contaminated by influence of dust and the like present outside the clean tunnel 6. In other words, the clean tunnel 6 is used, and thus the processing in each step can be performed on the wafer without preparation of the same number of small sealed containers whose internal environment is similar to a clean room as the number of wafers while the clean state is maintained. [0019]

The semiconductor manufacturing system S of the

configuration of Fig. 1 described above performs, for example, the following operation (processing) . Specifically, when the semiconductor manufacturing system S manufactures a plurality of types of existing semiconductor components, the server 1 forms a manufacturing plan for efficiently manufacturing one or more pieces of each of the plurality of types of

semiconductor components. Specifically, the server 1 forms, with consideration given to the balance of the entire

semiconductor manufacturing system S, a manufacturing plan for which steps are respectively performed by specific

semiconductor manufacturing devices 2 (the same step may be performed by a plurality of semiconductor manufacturing devices 2) and in which order the transport of the wafer among the first semiconductor manuf cturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 is performed by the transport device 4. In other words, the details of the processing in each of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 are not set by an individual operation on each of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 but are set, based on a manufacturing plan formed by the server 1, under

collective management by the server 1. In this way, it is possible to realize an efficient production process for the entire semiconductor manufacturing system S including the transport device 4. Hence, even when it is difficult to acquire the cost for procuring the conventional semiconductor device and the place where the conventional semiconductor device is installed, the semiconductor manufacturing system S is adopted, and thus it is possible to efficiently manufacture semiconductor components with a small investment. A specific method of forming a manufacturing plan for manufacturing the semiconductor components by the server 1 will be described later with reference to Fig. 6.

[0020]

Based on the formed plan, the server 1 provides, to the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3, the transport device 4 and the delivery portions 5-1 to 5-11, instructions to perform the processing in the individual steps on the wafer to be manufactured in the predetermined order and in a sequential manner. The first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 perform, based on the instructions from the server 1, on the wafer to be manufactured, the processing in the previously allocated steps. The transport device 4 performs, based on the instruction from the server 1, the transport of the wafer among the first semiconductor manufacturing devices

2-1 to 2-8 and the second semiconductor manufacturing device

In this way, an individual operation on each of the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3 and the transport device 4 is not necessary. In other words, the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 can perform the predetermined

processing based on the collective manufacturing instructions from the server 1. The transport device 4 can transport the wafer in an appropriate order.

[0021]

When a new type of semiconductor component which is different from the semiconductor components of existing types is manufactured, the server 1 determines a combination of q (q is an arbitrary integer value which is different from n and m described above and which is more than or equal to one) steps for manufacturing the new type of semiconductor component. When the combination of the steps is determined by the server 1, consideration is given to in which combination the new type of semiconductor component can be manufactured efficiently. The server 1 allocates, to each of the first semiconductor manufacturing devices 2, one or more steps among the q steps in which processing is to be performed. As described above, the server 1 can also form a plan for the manufacturing process of a new type of semiconductor component.

[0022]

As described above, even when a new type of semiconductor component is manufactured, the server 1 forms, with

consideration given to the efficiency of the operation of the entire semiconductor manufacturing system S, a plan for a manufacturing process corresponding to the new type and thereby can perform processing in the individual types of steps. In this way, the semiconductor manufacturing system S can reduce a temporal cost and an actual cost caused when a small number of semiconductor components such as for a

prototype or a customized item are manufactured. In other words, in the manufacturing of a prototype or a customized item, costs necessary for individually setting the details of processing, installation places and the like for the first semiconductor manufacturing devices 2, the second

semiconductor manufacturing device 3 and the transport device 4 can be reduced.

[0023]

An example of the specific configuration of the

semiconductor manufacturing system S in Fig. 1 described above will then be described. Fig. 2 is a plan view showing the specific configuration of the semiconductor manufacturing system S in Fig. 1.

[0024]

As shown in Fig. 2, on the inner circumference of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3, the transport device 4 including the conveyer on which the wafer is loaded and which transports it in the predetermined direction is arranged. In the transport device 4, the delivery portions 5-1 to 5-11 for connecting the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to the conveyer are provided. Specifically, for example, in the example of Fig. 2, the first semiconductor manufacturing device 2-1 performs, among the individual types of steps for manufacturing the semiconductor component, a step of supplying one unit of the wafer to a manufacturing line. Hence, the first semiconductor manufacturing device 2-1 includes a wafer supply portion 201 for supplying the one unit of the wafer to the manufacturing line of the semiconductor component and the Bernoulli chuck 202 for delivering the one unit of the wafer to the delivery portion 5-1. A wafer cassette 700 on which a plurality of units of the wafers are loaded is connected to the wafer supply portion 201. The first semiconductor manufacturing devices 2-1 to 2-8 include a processing portion for performing, on the one unit of the wafer, processing in the individual types of steps previously allocated though it is not shown in the figure. As with the first semiconductor manufacturing device 2-1, the first semiconductor manufacturing devices 2-2 to 2-8 individually include the Bernoulli chuck 202 for delivering the wafer to the delivery portions 5-2 to 5-12. The second semiconductor manufacturing device 3 includes a wafer tray 301 which holds a plurality of units of the wafers, an aligner 302 which

transfers a pattern described on a mask to the plurality of units of wafers and a wafer transport robot 303 which

transports the units of the plurality of wafers held on the wafer tray 301.

[0025]

In the semiconductor manufacturing system S configured as described above and shown in Fig. 2, the semiconductor component is manufactured by the following process. For example, when steps for manufacturing one unit of a

semiconductor component include a manufacturing process in which in the first semiconductor manufacturing device 2-1, the one unit of the semiconductor component is supplied to a manufacturing line (processing in such a step is performed) and in which thereafter processing in separate steps is performed in the order of the first semiconductor

manufacturing devices 2-2 to 2-5 and the second semiconductor manufacturing device 3, in the semiconductor manufacturing system S, the semiconductor component is manufactured as follows .

[0026]

In other words, the first semiconductor manufacturing device 2-1 performs the processing in the step of supplying the wafer to the manufacturing line. Specifically, the wafer supply portion 201 of the first semiconductor manufacturing device 2-1 loads, onto the wafer loading portion 502, a predetermined unit of the wafer among a plurality of units of the wafers loaded on the wafer cassette 700. In this way, the wafers are supplied to the manufacturing line unit by unit.

The first semiconductor manufacturing device 2-1 repeatedly performs the processing described above. The predetermined unit of the wafer loaded on the delivery portion 5-1 is transported with the conveyer to the first semiconductor manufacturing device 2-2 which performs the subsequent step. [0027]

The predetermined unit of the wafer which is transported to the front of the first semiconductor manufacturing device 2-2 is transported with the Bernoulli chuck 202 of the first semiconductor manufacturing device 2-2 into the first

semiconductor manufacturing device 2-2. The processing portion of the first semiconductor manufacturing device 2-2 performs, on the wafer, based on a manufacturing instruction from the server 1, the processing in the step to be performed by itself. The wafer on which the processing in the predetermined step is performed with the processing portion of the first

semiconductor manufacturing device 2-2 is loaded from the first semiconductor manufacturing device 2-2 onto the delivery portion 5-2 and is transported with the conveyer. Thereafter, in the semiconductor manufacturing devices 2-3 to 2-5,

processing in the steps allocated thereto is likewise

performed in a sequential manner. As described above, the wafer is supplied to the manufacturing line with the first semiconductor manufacturing device 2-1, and in the

semiconductor manufacturing devices 2-2 to 2-5, the processing in the individual types of steps is sequentially performed, with the result that the wafer is gradually brought close to the finished product of the semiconductor component to be manufactured.

[0028]

The wafer on which the processing in the predetermined step is performed with the first semiconductor manufacturing devices 2-1 to 2-5 is transported with the conveyer to the second semiconductor manufacturing device 3. The predetermined unit of the wafer which is transported to the front of the second semiconductor manufacturing device 3 is loaded onto the wafer tray 301 with the Bernoulli chuck 202 of the second semiconductor manufacturing device 3. The wafer tray 301 holds a plurality of units of the wafers including the one unit of the wafer. The aligner 302 transfers the pattern described on the mask to the plurality of units of the wafers loaded on the wafer tray 301. The wafer transport robot 303 transports the plurality of units of the wafers held on the wafer tray 301. On the plurality of units of the wafers loaded on the wafer tray 301, in the second semiconductor manufacturing device 3, the following processing is performed. In this way, the semiconductor component is manufactured.

[0029]

The semiconductor manufacturing system S will be further described below with reference to Fig. 3. Fig. 3 is a cross- sectional side view of the semiconductor manufacturing system S in Fig. 2.

[0030]

As shown in Fig. 3A, a plurality of first semiconductor manufacturing devices 2 are arranged so as to sandwich the transport device 4 from both side surfaces. In the transport device 4, the delivery portions 5 for connecting the first semiconductor manufacturing devices 2 to the conveyer are provided. The clean tunnel 6 is arranged so as to cover the transport device 4. In the clean tunnel 6, an FFU 611 is provided. The FFU 611 is a fan filter unit which purifies, through a filter, external air sucked by a fan and which feeds out it into the clean tunnel 6 as clean air. In this way, in order for the wafer to be transported in the clean portion, the transport portion 4 can be shielded from the external unclean portion.

[0031]

As shown in Fig. 3B, the second semiconductor

manufacturing device 3 includes the wafer tray 301, the aligner 302 and the wafer transport robot 303. The transport device 4 and the clean tunnel 6 are installed horizontally.

[0032]

A specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1 in the semiconductor manufacturing system S of Fig. 2 will then be described. Fig. 4 is a diagram showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1 in the semiconductor manufacturing system S of Fig. 2.

[0033]

Fig. 4A is a plan view showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1. Fig. 4B is a front view showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1. Fig. 4C is a side view showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1. As shown in Fig. 4, the wafer supply portion 201 includes a drive gear 601 which drives the wafer cassette 700 vertically in a state where the wafer cassette 700 is

sandwiched between four gears and a suction hand 602 which sucks and takes out a predetermined unit of the wafer from the wafer cassette 700 while being driven forward and backward. With the wafer supply portion 201 configured as described above, the predetermined unit of the wafer is taken out from the wafer cassette and is supplied to the manufacturing line of the semiconductor component. For example, in the example of Fig. 2, the first semiconductor manufacturing device 2-1 performs the step of supplying the wafer to the manufacturing line. Hence, the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1 repeats the operation described above and thereby supplies the wafers loaded on the wafer cassette 700 every predetermined unit.

[0034]

The hardware configuration of the server 1 in the

semiconductor manufacturing system S of Figs. 1 to 3 will then be described. Fig. 5 is a block diagram showing the hardware configuration of the server 1 in Fig. 1.

[0035]

The server 1 includes a CPU (Central Processing Unit) 11, a ROM (Read Only Memory) 12, a RAM (Random Access Memory) 13, a bus 14, an input/output interface 15, an output portion 16, an input portion 17, a storage portion 18, a communication portion 19 and a drive 20.

[0036]

The CPU 11 performs various types of processing according to programs recorded in the ROM 12 or programs loaded from the storage portion 18 onto the RAM 13. In the RAM 13, data and the like which are necessary for performing various types of processing by the CPU 11 are stored as necessary.

[0037]

The CPU 11, the ROM 12 and the RAM 13 are connected to each other through the bus 14. The input/output interface 15 is also connected to the bus 14. The output portion 16, the input portion 17, the storage portion 18, the communication portion 19 and the drive 20 are connected to the input/output interface 15.

[0038]

The output portion 16 is formed with a display, a speaker and the like so as to output various types of information as images and sounds. The input portion 17 is formed with a keyboard, a mouse and the like so as to input various types of information .

[0039]

The storage portion 18 is formed with a hard disk, a DRAM

(Dynamic Random Access Memory) and the like so as to store various types of data. The communication portion 19

communicates with other devices (in the example of Fig. 1, the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3 and the transport device 4) through a network N including the Internet.

[0040]

A removable medium 30 which is formed with a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory or the like is fitted to the drive 20 as necessary. A program which is read by the drive 20 from the removable medium 30 is installed in the storage portion 18 as necessary. The removable medium 30 can also store various types of data stored in the storage portion 18 as with the storage portion 18.

[0041]

The details of various types of processing performed by the server 1 of Fig. 5 will then be described. Fig. 6 is a functional block diagram showing an example of the functional configuration of the server 1 in Fig. 5.

[0042]

In the CPU 11 of the server 1, a manufacturing target identifying portion 101, a step acquiring portion 102, an instruction information determining portion 103, an

instructing portion 104, a step determining portion 105 and a step allocating portion 106 function. In a region of the storage portion 18, a semiconductor component DB 401 and a step DB 402 are provided.

[0043]

The manufacturing target identifying portion 101

references information stored in the semiconductor component

DB 401, thereby identifies one or more types of semiconductor components to be manufactured in the semiconductor

manufacturing system S and identifies the number of pieces (number of units of the wafers to be manufactured) for each of the one or more types of semiconductor components that are identified.

[0044]

The step acquiring portion 102 acquires, from information stored in the step DB 402, a combination of one or more steps for each of the types of semiconductor components that are identified by the manufacturing target identifying portion 101.

[0045]

Here, a specific example of the information stored in the semiconductor component DB 401 will be described with

reference to Fig. 7. Fig. 7 is a diagram showing a specific example of the types of semiconductor components and steps for the types .

[0046]

Fig. 7A shows the specific example of the steps for each of the semiconductor components which are stored and managed in the semiconductor component DB 401. In the example of Fig.

7A, for each of the semiconductor component of a type a

(hereinafter referred to as the "semiconductor component α") , the semiconductor component of a type β (hereinafter referred to as the "semiconductor component β" ) and the semiconductor component of a type γ (hereinafter referred to as the

"semiconductor component γ") , steps and the order thereof necessary for the manufacturing are stored and managed in the semiconductor component DB 401.

[0047]

Specifically, for example, it is assumed that the

manufacturing target identifying portion 101 indentifies the semiconductor component a and the semiconductor component β as manufacturing targets, identifies the number of semiconductor components a to be manufactured (number of units of the wafers to be manufactured) as X and identifies the number of

semiconductor components β to be manufactured (number of units of the wafers to be manufactured) as Y. In this case, as shown in Fig. 7A, the step acquiring portion 102 acquires, as the combination of steps for manufacturing the semiconductor component a, a combination of "step a" —> "step b" -» "step d" —> "step e". As shown in Fig. 7A, the step acquiring portion 102 also acquires, as the combination of steps for

manufacturing the semiconductor component β, a combination of "step a" -» "step b" → "step c" → "step e" - "step v" .

[0048]

With reference back to Fig. 6, the instruction information determining portion 103 determines information (hereinafter referred to as "instruction information") necessary for providing an instruction to manufacture the semiconductor component based on the types and numbers of semiconductor components identified by the manufacturing target identifying portion 101 as the manufacturing targets and the combination of the steps acquired by the step acquiring portion 102. The instruction information includes the types and numbers of semiconductor components to be manufactured in the semiconductor manufacturing system S, a manufacturing time and a manufacturing order.

[0049]

Specifically, for example, it is assumed that according to the example of Fig. 7 described above, targets to be

manufactured during a T time on a predetermined day are X semiconductor components a and Y semiconductor components β . In this case, as shown in Fig. 7A, in the semiconductor manufacturing system S, during a Tl time in the T time (where Tl + T2 = T) , on each of the wafers of X units, processing is performed in the order of "step a" → "step b" -» "step d" -> "step e", and thus the X semiconductor components a are manufactured. As shown in Fig. 7A, in the semiconductor manufacturing system S, during the T2 time in the T time, on each of the wafers of Y units, processing is performed in the order of "step a" - "step b" → "step c" -» "step e" - "step v", and thus the Y semiconductor components β are manufactured.

[0050]

Here, Fig. 7B shows the specific example of processing times in the individual steps and the necessary numbers of first semiconductor manufacturing devices 2 and second

semiconductor manufacturing device 3 for each of the types of semiconductor components which are stored and managed in the step DB 402. Specifically, in the example of Fig. 7B, the time in which the first semiconductor manufacturing devices 2 perform the processing in step a is set to "2" minutes. The time in which the first semiconductor manufacturing devices 2 perform the processing in step b is set to "4" minutes. The time in which the first semiconductor manufacturing devices 2 perform the processing in step c is set to "2" minutes. The time in which the first semiconductor manufacturing devices 2 perform the processing in step d is set to "2" minutes. The time in which the first semiconductor manufacturing devices 2 perform the processing in step e is set to "6" minutes. The time in which the first semiconductor manufacturing devices 2 perform the processing in step f is set to "2" minutes. The time in which the second semiconductor manufacturing device 3 performs the processing in step v is set to "3" minutes.

[0051]

For example, when in any one of the steps performed by the first semiconductor manufacturing devices 2, the procesing on 6 units of the wafers is assumed to be performed in 12 minutes, as shown in Fig. 7B, the instruction information determining portion 103 performs the allocation of the steps to be

performed by the first semiconductor manufacturing devices 2 and the second semiconductor manufacturing device 3.

[0052]

Specifically, in the manufacturing of the semiconductor product a, the instruction information determining portion 103 allocates the steps to be performed by the first semiconductor manufacturing devices 2-1 to 2-8 such that the processing in step a is performed by "1" device, the processing in step b is performed by "2" devices, the processing in step d is performed by "1" device and the processing in step e is performed by "3" devices. Here, although in general, the first semiconductor manufacturing devices 2 are often manufactured so as to perform only a predetermined step, in this example, for convenience of description, the first semiconductor manufacturing devices 2 are assumed to have the function of performing any of steps a to f by switching software. In this case, for example, the instruction information determining portion 103 determines that one device of the first

semiconductor manufacturing device 2-2 performs step a, that two devices of the first semiconductor manufacturing devices 2-3 and 2-4 perform step b, that one device of the first semiconductor manufacturing device 2-5 performs step d and that three devices of the first semiconductor manufacturing devices 2-6 to 2-8 perform step e.

[0053]

Likewise, in the manufacturing of the semiconductor product p , the instruction information determining portion 103 allocates the steps to be performed by the first semiconductor manufacturing devices 2-1 to 2-8 such that the processing in step a is performed by "1" device, the processing in step b is performed by "2" devices, the processing in step c is

performed by "1" device and the processing in step e is performed by "3" devices. In this case, for example, the instruction information determining portion 103 determines that one device of the first semiconductor manufacturing device 2-2 performs step a, that two devices of the first semiconductor manufacturing devices 2-3 and 2-4 perform step b, that one device of the first semiconductor manufacturing device 2-5 performs step c and that three devices of the first semiconductor manufacturing devices 2-6 to 2-8 perform step e. In other words, in this example, the first semiconductor manufacturing device 2-5 performs the processing in step d in the manufacturing of the semiconductor component a and

performs the processing in step c in the manufacturing of the semiconductor component β . In a case where the first

semiconductor manufacturing device 2 can perform only a

predetermined step, the number of first semiconductor

manufacturing devices 2 is preferably increased. Furthermore, for example, the instruction information determining portion 103 determines that one device of the second semiconductor manufacturing device 3 performs step v.

[0054]

With reference back to Fig. 6, based on the instruction information determined by the instruction information

determining portion 103, the instructing portion 104 provides a predetermined instruction to manufacture the semiconductor component to each of the first semiconductor manufacturing devices 2, the second semiconductor manufacturing device 3 and the transport device 4. Specifically, when one unit of the wafer to be manufactured is supplied, the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 perform, based on the instruction from the instructing portion 104, processing in steps to be performed. The transport device 4 each transports, based on the instruction from the instructing portion 104, the wafers to be manufactured one by one to each of the first

semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 in an appropriate order and with appropriate timing.

[0055]

When in the example of Fig. 7 described above, in the manufacturing of the semiconductor component a, attention is focused on a predetermined unit of the wafer, the wafer is supplied with the first semiconductor manufacturing device 2-1 to the manufacturing line, and thus the processing in step a is performed with the first semiconductor manufacturing ^' device 2-2 for 2 minutes, then the processing in step b is performed with any one of the first semiconductor manufacturing devices 2-3 and 2-4 for four minutes, then the processing in step d is performed with the first semiconductor manufacturing device 2- 5 for 2 minutes and then the processing in step e is performed with any one of three devices of the first semiconductor manufacturing devices 2-6 to 2-8 for six minutes. In this way, the semiconductor component a is manufactured. When attention is focused on predetermined timing in the manufacturing of the semiconductor component a, with the timing (at a predetermined time) , the processing in step a on one unit of the wafer with the first semiconductor manufacturing device 2-2, the

processing in step b on two units of the wafers with the first semiconductor manufacturing devices 2-3 and 2-4, the processing in step d on one unit of the wafer with the first semiconductor manufacturing device 2-5 and the processing in step e on three units of the wafers with the first

semiconductor manufacturing devices 2-6 to 2-8 are

simultaneously performed.

[0056]

Likewise, when in the manufacturing of the semiconductor component β, attention is focused on a predetermined unit of the wafer, the wafer is supplied with the first semiconductor manufacturing device 2-1 to the manufacturing line, and thus the processing in step a is performed with the first

semiconductor manuf cturing device 2-2 for 2 minutes, then the processing in step b is performed with any one of the first semiconductor manufacturing devices 2-3 and 2-4 for four minutes, then the processing in step c is performed with the first semiconductor manufacturing device 2-5 for 2 minutes and then the processing in step e is performed with any one of three devices of the first semiconductor manufacturing devices 2-6 to 2-8 for six munutes. Thereafter, the processing in step v is performed with the second semiconductor manufacturing device 3 for 3 minutes. In this way, the semiconductor component β is manufactured. When attention is focused on predetermined timing in the manufacturing of the semiconductor component β, with the timing (at a predetermined time) , the processing in step a on one unit of the wafer with the first semiconductor manufacturing device 2-2, the processing in step b on two units of the wafers with the first semiconductor manufacturing devices 2-3 and 2-4, the processing in step c on one unit of the wafer with the first semiconductor

manufacturing device 2-5 and the processing in step e on three units of the wafers with the first semiconductor manufacturing devices 2-6 to 2-8 are simultaneously performed.

[0057]

The point on which attention is focused here is, as described above, that processing in one step is not

necessarily performed with one first semiconductor

manufacturing device 2, and parallel processing can be

performed with a plurality of first semiconductor

manufacturing devices 2. Another point on which attention is focused is, as described above, that the transport route of one unit of the wafer does not need to be a route in which the wafers are supplied one by one in the order of the first semiconductor manufacturing devices 2-1 to 2-8 but can be an arbitrary route such as a route in which a few first

semiconductor manufacturing devices are skipped or a route in which the wafer is moved not in the same direction but in different directions. For each unit of the wafer, a separate transport route can be taken independently. With these points on which attention is focused, while reducing the number of first semiconductor manufacturing devices 2, it is possible to efficiently manufacture various types of semiconductor

components in the minimum amount of time in a mixed manner.

[0058]

With reference back to Fig. 6, when a new type of semiconductor component is manufactured with the semiconductor manufacturing system S, the step determining portion 105 determines a combination of q steps. Specifically, for example, when a new type δ of semiconductor component (hereinafter referred to as the "semiconductor component δ" ) which is different from the semiconductor components that are already stored and managed in the semiconductor component DB 401 is identified as the manufacturing target, the step determining portion 105 determines a combination of one or more types of steps necessary for manufacturing the semiconductor component δ . The specific method for determining a combination of one or more steps for manufacturing a new type of semiconductor component is not particularly limited. For example, it is also possible to determine a combination of steps with

consideration given to the identity, the similarity or the like of the new type of semiconductor component δ and each of a plurality of semiconductor components (for example, a and β ) stored in the semiconductor component DB 401. In this way, even when the new type of semiconductor component δ is

manufactured, if it is possible to manufacture it by changing a combination of the existing types of steps, the server 1 provides a manufacturing instruction indicating it, and thus it is possible to utilize the existing manufacturing line as it is. In other words, since it is possible to flexibly cope with the manufacturing of a prototype or a customized item which is not a mass-produced product and in which only a small number thereof need to be manufactured, even a small and medium-size venture company in which an installation area and a budget are limited can perform an operation for

manufacturing a semiconductor component.

[0059]

The step allocating portion 106 allocates, to each of the first semiconductor manufacturing devices 2 and the second semiconductor manufacturing device 3, one or more steps among the q steps in which processing is to be performed. Here, the allocation is a broad concept which includes not only the allocation of an individual and specific one device of each of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device, but also the allocation of the necessary number of first semiconductor manufacturing devices 2 to each step as in Fig. 7B.

[0060]

Although the embodiment of the present invention is described above, the present invention is not limited to the embodiment described above, and variations, modifications and the like which can achieve the object of the present invention are included in the present invention.

[0061]

For example, the hardware configuration shown in Fig. 5 is only illustrative for achieving the object of the present invention, and there is no particular limitation on it.

[0062]

The functional block diagram shown in Fig. 6 is only illustrative, and there is no particular limitation on it. In other words, as long as a function capable of performing a series of processing described above as a whole is included in an information processing device, functional blocks which are used for achieving such a function are not particularly

limited to the example of Fig. 6.

[0063]

The places where the functional blocks are present are not limited to Fig. 6, and any place may be adopted. One

functional block may be formed with hardware alone, may be formed with software alone or may be formed with a combination thereof .

[0064]

When the processing of each functional block is performed by software, the programs of the software are installed onto a computer or the like from a network or a recording medium. The computer may be a computer which is incorporated in dedicated hardware. The computer may be a computer, such as a server, a general-purpose smartphone or a general-purpose personal computer, that can perform various types of functions by the installation of various types of programs.

[0065]

The recording medium including such programs is formed with a removable medium which is distributed separately of a device main body to each user in order to provide the programs, a recording medium which is provided to the user in a state where it is previously incorporated in the device main body or the like. [0066]

In the present specification, steps which describe the programs recorded in the recording medium include not only processing which is chronologically performed according to the order thereof, but also processing which is not necessarily chronologically performed and which is performed in parallel or separately.

[0067]

In the present specification, the term system means an overall device which is formed by a plurality of devices, a plurality of means or the like.

[0068]

In the steps for manufacturing the semiconductor component in Fig. 2, the conveyer of the transport device 4 in an oval shape is driven clockwise, and thus the processing on the wafer is sequentially performed in the order of the first semiconductor manufacturing device 2-2, the first

semiconductor manufacturing device 2-3, the first

semiconductor manufacturing device 2-4 and the first

semiconductor manufacturing device 2-5. However, the conveyer of the transport device 4 may transport the wafer

counterclockwise instead of clockwise. The clockwise conveyer and the counterclockwise conveyer may be provided together.

Furthermore, a configuration may be adopted in which a plurality of conveyers that are rotated in the same direction are provided, and thus in which the wafer that is transported can pass another wafer that is transported. In the configuration described above, the semiconductor manufacturing system S can more efficiently manufacture a plurality of semiconductor components at the same time.

[0069]

Although in the embodiment described above, it is assumed that processing in predetermined one or more steps is

performed on a predetermined unit of the wafer and thus a semiconductor component is manufactured, this is only

illustrative. The present invention can also be applied to a case where processing in predetermined one or more steps is performed on a predetermined unit of a substrate containing glass or the like and thus where a predetermined microdevice is manufactured. The "microdevice" in the present invention includes all electronic devices of extremely small sizes such as semiconductor components, various types of sensors, MEMS

(Micro Electro Mechanical Systems) , medical electronic devices and DNA computers.

[0070]

Hence, the information processing device or the

microdevice manufacturing system (for example, the

semiconductor manufacturing system S of Fig. 1) to which the present invention is applied has the following configuration and can adopt various types of embodiments. Specifically, as the information processing device to which the present invention is applied,

an information processing device (for example, the server 1 of

Fig. 1) in which under an environment where n microdevice manufacturing devices (for example, the first semiconductor manufacturing device 2 of Fig. 1) perform processing in

predetermined one or more steps among a plurality of steps for manufacturing a predetermined type of microdevice (for example, a semiconductor component) having a substrate (for example, the wafer) of a predetermined size as one unit, a plan for manufacturing one or more pieces for each of one or more types of the microdevices is formed, includes:

a manufacturing target identifying means (for example, the manufacturing target identifying portion 101 of Fig. 6) which identifies one or more types of the microdevices to be

manufactured and which identifies a number of pieces to be manufactured for each of the one or more types identified;

a step acquiring means (for example, the step acquiring

portion 102 of Fig. 6) which acquires a combination of one or more steps for each of the one or more types identified by the manufacturing target identifying means; and

an instruction information determining means (for example, the instruction information determining portion 103 of Fig. 6) which determines, based on a result of the identification by the manufacturing target identifying means and the combination of the one or more steps acquired by the step acquiring means for each of the one or more types, at least a type and a number of pieces to be manufactured, a manufacturing time, and a manufacturing order for each of the n microdevice

manufacturing devices.

Since in this way, it is possible to form a specific manufacturing plan for realizing an efficient production process on the entire microdevice manufacturing system, even when it is difficult to acquire the cost for procuring the microdevice manufacturing device and the place where the microdevice manufacturing device is installed, it is possible to efficiently manufacture the microdevice with a small investment .

[0071]

The microdevice manufacturing system (for example, the semiconductor manufacturing system S of Fig. 1) to which the present invention is applied, includes:

under an environment where n (n is an arbitrary integer value more than or equal to one) microdevice manufacturing devices (for example, the first semiconductor manufacturing device 2 of Fig. 1) perform processing in predetermined one or more steps among a plurality of steps for manufacturing a

predetermined type of microdevice having a substrate (for example, the wafer) of a predetermined size as one unit, a transport portion (for example, the transport device 4 of Fig. 1) which transports, in the n microdevice manufacturing devices, from a first microdevice manufacturing device that completes the performance of processing on a predetermined unit to a second microdevice manufacturing device that can perform processing in the subsequent step, the predetermined unit; and

a clean holding portion (for example, the clean tunnel 6 of

Fig. 1) which shields the transport portion from an outside unclean portion such that the predetermined unit is transported in a clean portion.

In this way, it is possible to prevent the substrate from being contaminated by influence of dust and the like present outside the clean holding portion. Hence, the processing in each step can be performed in the clean portion without preparation of the same number of small sealed containers whose interior is in a clean environment similar to a clean room as the number of substrates.

[0072]

The microdevice manufacturing system also can include: n (n is an arbitrary integer value more than or equal to one) first microdevice manufacturing devices (for example, the first semiconductor manufacturing devices 2-1 to 2-8 of Fig. 1) which performs processing in predetermined one or more steps among a plurality of steps for manufacturing a

predetermined type of microdevice having a substrate of a predetermined size as one unit; and

m (m is an arbitrary integer value which is different from n described above and which is more than or equal to one) second microdevice manufacturing device's (for example, the second semiconductor manufacturing device 3 of Fig. 1) which perform, as processing in predetermined one or more steps among the plurality of steps which are different from the one or more steps of the processing performed by the n microdevice manufacturing devices, collective processing on two or more units . In this way, it is possible to efficiently perform the same processing for two or more units of the substrate.

[0073]

In order to achieve the above object, an information processing device according to an aspect of the present invention includes:

under an environment where n (n is an arbitrary integer value more than or equal to one) microdevice manufacturing devices

(for example, the first semiconductor manufacturing device 2 of Fig. 1) perform processing in predetermined one or more steps among a plurality of steps for manufacturing a

predetermined type of microdevice having a substrate (for example, the wafer) of a predetermined size as one unit, a step determining means (for example, the step determining portion 105 of Fig. 6) which determines a combination of q (q is an arbitrary integer value which is different from n described above and which is more than or equal to one) steps for manufacturing a new type of microdevice; and

a step allocating means (for example, the step allocating portion 106 of Fig. 6) which allocates, to each of the n microdevice manufacturing devices, one or more steps among the q steps in which processing is to be performed.

In this way, even when a new type of microdevice is

manufactured, with consideration given to the efficiency of the operation of the entire microdevice manufacturing system, a plan for a manufacturing process corresponding to the type of microdevice to be manufactured is formed, and processing in various types of steps is performed. The microdevice

manufacturing system can reduce a temporal cost and an actual cost caused when a small number of microdevices such as for a prototype are manufactured. In other words, it is possible to reduce a temporal cost and an actual cost caused, for example, when the details of processing, installation places and the like are individually set for each of the microdevice

manufacturing device and the transport portion.

EXPLANATION OF REFERENCE NUMERALS

[0074]

1: server

2, 2-1, 2-2, 2-3, 2-4, 2-5, 2-6, 2-7 and 2-8: first

semiconductor manufacturing device

3: second semiconductor manufacturing device

4: transport device

5, 5-1, 5-2, 5-3, 5-4, 5-5, 5-6, 5-7, 5-8, 5-9, 5-10, 5-11 and

5-12: delivery portion

6: clean tunnel

11: CPU

12: ROM

13: RAM

14: bus

15: input/output interface

16: output portion

17: input portion

18: storage portion

19: communication portion 20: drive

30: removable medium

101: manufacturing target identifying portion

102 : step acquiring portion

103: instruction information determining portion

104 : instructing portion

105: step determining portion

106: step allocating portion

201: wafer supply portion

202: Bernoulli chuck

301: wafer tray

302: aligner

303: wafer robot

401: semiconductor component DB

402: step DB

501: conveyer fixing portion

502: wafer loading portion

601: drive gear

602: suction hand

611: FFU

700: wafer cassette

N: network