MICROELECTROMECHANICAL SYSTEMS EMBEDDED IN A SUBSTRATE

Title:

MICROELECTROMECHANICAL SYSTEMS EMBEDDED IN A SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2011/094594

Kind Code:

A3

Abstract:

An integrated circuit package includes a microelectromechanical systems (MEMS) device embedded in a packaging substrate. The MEMS device is located on a die embedded in the packaging substrate and covered by a hermetic seal. Low-stress material in the packaging substrate surrounds the MEMS device. Additionally, interconnects may be used as standoffs to reduce stress on the MEMS device. The MEMS device is embedded a distance into the packaging substrate leaving for example, 30-80 microns, between the hermetic seal of the MEMS device and the support surface of the packaging substrate. Embedding the MEMS device results in lower stress on the MEMS device.

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Inventors:

SHAH MILIND P (US)
VELEZ MARIO FRANCISCO (US)
SWEENEY FIFIN (US)

Application Number:

PCT/US2011/022999

Publication Date:

December 08, 2011

Filing Date:

January 28, 2011

Export Citation:

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Assignee:

QUALCOMM INC (US)
SHAH MILIND P (US)
VELEZ MARIO FRANCISCO (US)
SWEENEY FIFIN (US)

International Classes:

B81C1/00

Foreign References:

US20090127638A1	2009-05-21
US20090206444A1	2009-08-20
US20070090536A1	2007-04-26
US20080054759A1	2008-03-06
US6621137B1	2003-09-16

Attorney, Agent or Firm:

TALPALATSKY, Sam (San Diego, CA, US)

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