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Patent Searching and Data


Title:
MICROELECTROMECHANICAL ULTRASONIC TRANSDUCER AND ARRAY
Document Type and Number:
WIPO Patent Application WO/2022/170805
Kind Code:
A1
Abstract:
Provided are a microelectromechanical ultrasonic transducer and array. The microelectromechanical ultrasonic transducer comprises a base layer, a bottom electrode (30), a piezoelectric layer (40), a top electrode (50) and a passive layer (60), wherein the bottom electrode (30), the piezoelectric layer (40), the top electrode (50) and the passive layer (60) are sequentially stacked on the top surface of the base layer; the bottom electrode (30) and the top electrode (50) are configured to be connected to different electrode wiring terminals, respectively; the top surface of the base layer is provided with a trough-shaped vacuum chamber (70), and the top end of the trough-shaped vacuum chamber (70) is in contact with the bottom electrode (30) to provide a space for the bottom electrode (30), the piezoelectric layer (40), the top electrode (50) and the passive layer (60) to vibrate downwards; and the passive layer (60) is configured to be in direct contact with a traditional sound transfer medium. The present application solves the problems of existing ultrasonic transducers having a large size, a complex assembly process, and a low overall integration level.

Inventors:
LIU BIN (CN)
ZHANG TING (CN)
Application Number:
PCT/CN2021/131525
Publication Date:
August 18, 2022
Filing Date:
November 18, 2021
Export Citation:
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Assignee:
SONOSEMI MEDICAL CO LTD (CN)
International Classes:
B06B1/06; H03H3/02
Foreign References:
CN106660074A2017-05-10
CN106951887A2017-07-14
CN108698084A2018-10-23
CN109225789A2019-01-18
CN113145431A2021-07-23
CN214718133U2021-11-16
CN111817682A2020-10-23
CN106211005A2016-12-07
US20170326594A12017-11-16
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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