Title:
MICROENCAPSULATED HARDENER FOR EPOXY RESIN, MASTERBATCH TYPE HARDENER COMPOSITION FOR EPOXY RESIN, ONE-PACK EPOXY RESIN COMPOSITION, AND PROCESSED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2010/098431
Kind Code:
A1
Abstract:
A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained by the reaction of an epoxy resin (e1) with an amine compound, the epoxy-resin hardener has an overall amine value of 370 to 1,000, the epoxy-resin hardener has an average particle diameter of 0.3-12 µm, excluding 0.3 µm, and the shells have, on at least the surface thereof, a combined group (x) that absorbs infrared rays having a wavenumber of 1,630-1,680 cm-1, a combined group (y) that absorbs infrared rays having a wavenumber of 1,680-1,725 cm-1, and a combined group (z) that absorbs infrared rays having a wavenumber of 1,730-1,755 cm-1.
Inventors:
YAMAMOTO HISANAO (JP)
KONDO YOSHIKIMI (JP)
AIKAWA KAZUYUKI (JP)
KONDO YOSHIKIMI (JP)
AIKAWA KAZUYUKI (JP)
Application Number:
PCT/JP2010/053054
Publication Date:
September 02, 2010
Filing Date:
February 26, 2010
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP (JP)
YAMAMOTO HISANAO (JP)
KONDO YOSHIKIMI (JP)
AIKAWA KAZUYUKI (JP)
YAMAMOTO HISANAO (JP)
KONDO YOSHIKIMI (JP)
AIKAWA KAZUYUKI (JP)
International Classes:
C08G59/50; C09D201/00; C09J7/20; C09J201/00; H01B3/40
Domestic Patent References:
| WO2007088889A1 | 2007-08-09 | |||
| WO2007037378A1 | 2007-04-05 | |||
| WO2006090794A1 | 2006-08-31 | |||
| WO2005095486A1 | 2005-10-13 |
Foreign References:
| JP2007091900A | 2007-04-12 |
Attorney, Agent or Firm:
ASAMURA Kiyoshi et al. (JP)
Hiroshi Asamura (JP)
Hiroshi Asamura (JP)
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