Title:
MICROENGINEERED ELECTRICAL CONNECTORS
Document Type and Number:
WIPO Patent Application WO2003066515
Kind Code:
A3
Abstract:
A miniature, multi-element electrical connector fabricated using micro-electro-mechanical systems technology is described. Shaped elastic cantilever elements (12) are formed on the female part (11) by deposition of conducting material on a surface that has been previously shaped to define a localised contact area and a sloped entrance face. The cantilevers (12) are then undercut. A similar process is used to construct a sloping face on the male part (10) for easy insertion. An etching process is used to fabricate an interlocking alignment system (20, 21, 22) on the two parts. Erosion of a convex corner is used to form a tapered entrance (22) to this alignment system.
Inventors:
SYMS RICHARD (GB)
Application Number:
PCT/GB2003/000314
Publication Date:
December 24, 2003
Filing Date:
January 27, 2003
Export Citation:
Assignee:
MICROSAIC SYSTEMS LTD (GB)
SYMS RICHARD (GB)
SYMS RICHARD (GB)
International Classes:
B81B3/00; B81C1/00; B81C3/00; (IPC1-7): B81C1/00; B81C3/00; B81B7/00; H01R43/00
Domestic Patent References:
| WO1995034000A1 | 1995-12-14 | |||
| WO1998052224A1 | 1998-11-19 |
Foreign References:
| US5903059A | 1999-05-11 | |||
| US3984620A | 1976-10-05 | |||
| US20020008966A1 | 2002-01-24 |
Other References:
MILLER D C ET AL: "Micromachined, flip-chip assembled, actuatable contacts for use in high density interconnection in electronics packaging", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 89, no. 1-2, 20 March 2001 (2001-03-20), pages 76 - 87, XP004317249, ISSN: 0924-4247
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