Title:
MICROIMPLEMENT, PROCESS FOR MANUFACTURING THE SAME, AND METHOD OF ASSEMBLING SUGAR MATERIAL PART
Document Type and Number:
WIPO Patent Application WO/2008/010573
Kind Code:
A1
Abstract:
A microimplement for insertion in skin surface that ensures high safety, no pain
and easy use, and that is less in the quantitative limitation or variety restriction
as to functional material, etc., realizing high structure strength, high stability
and high machining precision, and that in disposal thereof, is very low in environmental
load; a process for manufacturing the microimplement; and a relevant method
of assembling sugar material parts. There is provided a microimplement for
insertion in skin surface having minute cantilevers of a material soluble into
the skin, disposed on an upper edge portion of side face of substrate or on a surface
of substrate sheet, wherein each of the cantilevers has roughly a half-split
cone configuration and has a given dimension. Further, there are provided a
process for manufacturing the above microimplement and a relevant method of
assembling sugar material parts.
Inventors:
TOBINAGA, Yoshikazu (20-8, Seifu-cho Otsu-sh, Shiga 25, 5200225, JP)
飛永 芳一 (〒25 滋賀県大津市清風町２０番８号 Shiga, 5200225, JP)
KITAGAWA, Tomoya (3D 3-25-7, Taishyogun Otsu-sh, Shiga 45, 5202145, JP)
飛永 芳一 (〒25 滋賀県大津市清風町２０番８号 Shiga, 5200225, JP)
KITAGAWA, Tomoya (3D 3-25-7, Taishyogun Otsu-sh, Shiga 45, 5202145, JP)
Application Number:
JP2007/064346
Publication Date:
January 24, 2008
Filing Date:
July 20, 2007
Export Citation:
Assignee:
ELEGAPHY, INC. (20-8, Seifu-cho Otsu-sh, Shiga 25, 5200225, JP)
株式会社エレガフィ (〒25 滋賀県大津市清風町２０番８号 Shiga, 5200225, JP)
MARUHO CO., LTD. (1-5-22, Nakatsu Kita-k, Osaka-shi Osaka 71, 5310071, JP)
マルホ株式会社 (〒71 大阪府大阪市北区中津一丁目５番２２号 Osaka, 5310071, JP)
TOBINAGA, Yoshikazu (20-8, Seifu-cho Otsu-sh, Shiga 25, 5200225, JP)
株式会社エレガフィ (〒25 滋賀県大津市清風町２０番８号 Shiga, 5200225, JP)
MARUHO CO., LTD. (1-5-22, Nakatsu Kita-k, Osaka-shi Osaka 71, 5310071, JP)
マルホ株式会社 (〒71 大阪府大阪市北区中津一丁目５番２２号 Osaka, 5310071, JP)
TOBINAGA, Yoshikazu (20-8, Seifu-cho Otsu-sh, Shiga 25, 5200225, JP)
International Classes:
A61M37/00
Attorney, Agent or Firm:
MINORI Patent Profession Corporation (Chiyoda Seimei Kyoto Oike Bldg, 8F 200, Takamiya-cho,Oike-dori Takakura Nishi-iru,Nakagyo-ku, Kyoto-shi, Kyoto 35, 6040835, JP)