MICROMACHINING METHOD HAVING HALF-SAWING PROBLEM SOLVED, AND MEMS DEVICE PREPARED BY MEANS OF SAME

Title:

MICROMACHINING METHOD HAVING HALF-SAWING PROBLEM SOLVED, AND MEMS DEVICE PREPARED BY MEANS OF SAME

Document Type and Number:

WIPO Patent Application WO/2016/126127

Kind Code:

A1

Abstract:

The present invention provides a micromachining method, which has the half-sawing problem solved, comprising: a step (S100) for preparing a silicon-on-insulator (SOI) wafer comprising an upper silicon layer, a support substrate which is formed from silicon, and an insulating layer between the support substrate and upper silicon layer; and a step (S300) for applying on the SOI wafer a third photoresist, which is for replacing the existing half sawing procedure, and first deep etching the SOI wafer by means of the third photoresist.

Inventors:

PARK JONG SAM (KR)
LEE JONG SUNG (KR)
LEE SUNG HO (KR)
WOO JONG CHANG (KR)

Application Number:

PCT/KR2016/001264

Publication Date:

August 11, 2016

Filing Date:

February 04, 2016

Export Citation:

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Assignee:

STANDING EGG INC (KR)

International Classes:

B81C1/00; B81B7/00

Foreign References:

US20040023498A1	2004-02-05
US6846724B2	2005-01-25
US7166488B2	2007-01-23
US7550358B2	2009-06-23
KR20110079222A	2011-07-07

Attorney, Agent or Firm:

KIM, YOUNG DAE (KR)
김영대 (KR)

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