Title:
MICRONEEDLE ARRAY CHIP
Document Type and Number:
WIPO Patent Application WO/2023/116548
Kind Code:
A1
Abstract:
Disclosed in the present invention is a microneedle array chip, comprising a substrate and a plurality of microneedles arranged on a front side of the substrate in an array, wherein a notch is formed downwards from a tip of each microneedle; the width of the notch is greater than or equal to 10 nm; and the depth thereof is greater than or equal to 50 nm. A microneedle array chip, comprising a substate, wherein a plurality of microneedle clusters are arranged on a front side of the substrate in an array; each microneedle cluster is composed of at least two microneedles; and a gap between the microneedles in each microneedle cluster is greater than or equal to 10 nm, but less than or equal to 300 μm. By means of the notches in the microneedles or the gaps between the microneedles in the microneedle clusters, the microneedles can play a role in carrying a medicament or a beauty product, and after the microneedles pass through the stratum corneum, the medicament or the beauty product can be carried into the deep tissue below the stratum corneum of the skin, thereby improving the absorption efficiency of the medicament or the beauty product.
Inventors:
XU BAI (CN)
Application Number:
PCT/CN2022/139300
Publication Date:
June 29, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
SUZHOU NASHENG MICROELECTRONICS CO LTD (CN)
International Classes:
A61M37/00
Foreign References:
| CN206526397U | 2017-09-29 | |||
| US20200330739A1 | 2020-10-22 | |||
| JP2018183511A | 2018-11-22 | |||
| CN104117136A | 2014-10-29 | |||
| CN108310617A | 2018-07-24 | |||
| US20050143713A1 | 2005-06-30 |
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