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Patent Searching and Data


Title:
MICRONEEDLE ARRAY WITH COMPOSITE FORMULATION, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/093218
Kind Code:
A1
Abstract:
The present invention relates to a microneedle array and a method for manufacturing the same, the microneedle array comprising: a support; and a plurality of microneedles which protrude from the upper portion of the support and on which a solid-phase formulation is loaded, wherein, when a liquid-phase formulation is applied or dripped onto an area of the upper portion of the support in which the microneedles are not formed, or when one or more holes are formed in the support, the liquid-phase formulation is discharged through the holes onto the area of the upper portion of the support in which the microneedles are not formed.

Inventors:
JUNG HYUNG IL (KR)
YANG HUI SUK (KR)
Application Number:
PCT/KR2017/013193
Publication Date:
May 24, 2018
Filing Date:
November 20, 2017
Export Citation:
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Assignee:
UNIV YONSEI IACF (KR)
International Classes:
A61K9/00; A61K9/06; A61K9/70; A61M37/00
Domestic Patent References:
WO2015164840A12015-10-29
Foreign References:
US20070250018A12007-10-25
US20080125743A12008-05-29
US20130165872A12013-06-27
US20060024358A12006-02-02
KR20150138646A2015-12-10
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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