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Title:
MICRONEEDLE ARRAY
Document Type and Number:
WIPO Patent Application WO/2017/213169
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a microneedle array which has a strength capable of withstanding the impact at the time of puncture. The present invention provides a microneedle array which comprises a sheet part and a plurality of needle parts that are present on the upper surface of the sheet part, and which is configured such that: the needle parts contain a water-soluble polymer; the sheet part contains a water-soluble polymer; the sheet part has a center part, which is a region where the plurality of needle parts are formed, and an edge part; and the average film thickness of the edge part is smaller than the average film thickness of the center part.

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Inventors:
KABATA KOKI (JP)
KUSANO TAKAYUKI (JP)
Application Number:
PCT/JP2017/021117
Publication Date:
December 14, 2017
Filing Date:
June 07, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
A61M37/00; A61K9/00; A61K47/36; A61K38/00; A61K39/00; A61K39/39
Domestic Patent References:
WO2014077242A12014-05-22
Foreign References:
JP2016112169A2016-06-23
JP2016067681A2016-05-09
JP2003093521A2003-04-02
JP2010184102A2010-08-26
JP2013158601A2013-08-19
JP2009061144A2009-03-26
JP2013153866A2013-08-15
Other References:
See also references of EP 3466478A4
Attorney, Agent or Firm:
SIKS & CO. (JP)
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