Title:
MICRONEEDLE AND FLAT CABLE FLIP-CHIP BONDING STRUCTURE AND PREPARATION PROCESS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/021322
Kind Code:
A1
Abstract:
A microneedle and flat cable flip-chip bonding structure and a preparation process therefor. In the process, a flip-chip bonding metal layer (5a) of a microneedle (1) and a flip-chip bonding metal layer (5b) of a flat cable are prepared, and the flip-chip bonding metal layer (5a) of the microneedle and the flip-chip bonding metal layer (5b) of the flat cable are aligned and pressed together to form flip-chip bonding contact, thereby achieving the microneedle and flat cable flip-chip bonding structure. Compared to the traditional TSV process for preparing microneedle arrays, the process of the present invention is significantly simplified and can achieve accurate signal transmission; the resistance value of the ohmic resistance generated by electrical contact between the contacts of the bonding structure is significantly reduced, so the stability and accuracy of signal transmission are improved.
Inventors:
HUANG LI (CN)
HUANG CHENG (CN)
CAI GUANGYAN (CN)
GAO JIANFEI (CN)
WANG CHUNSHUI (CN)
WANG CHAO (CN)
HUANG CHENG (CN)
CAI GUANGYAN (CN)
GAO JIANFEI (CN)
WANG CHUNSHUI (CN)
WANG CHAO (CN)
Application Number:
PCT/CN2022/126569
Publication Date:
February 01, 2024
Filing Date:
October 21, 2022
Export Citation:
Assignee:
WUHAN NEURACOM TECH DEVELOPMENT CO LTD (CN)
International Classes:
A61B5/262; A61B5/38; B81B1/00
Foreign References:
| CN112701092A | 2021-04-23 | |||
| US20210098341A1 | 2021-04-01 | |||
| CN101030548A | 2007-09-05 | |||
| CN101543406A | 2009-09-30 | |||
| CN114305433A | 2022-04-12 | |||
| CN114343655A | 2022-04-15 |
Attorney, Agent or Firm:
SHENZHEN FENGCHENGZHIHE IP ATTORNEY LTD (CN)
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