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Patent Searching and Data


Title:
MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING MICRONEEDLE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/190911
Kind Code:
A1
Abstract:
A microneedle structure 10 equipped with needle-shaped parts 12 having a hole formed therein and a substrate 11 provided with said needle-shaped parts on one surface thereof. The needle-shaped parts 12 have a porous structure formed therein, and the value of the tip strength of the needle-shaped parts 12 is 40mN or higher. This method for producing a microneedle structure produces said microneedle structure 10. As a result, it is possible to provide: a microneedle structure having needle-shaped parts for which loss thereof and damage thereto is suppressed during use; and a method for producing said microneedle structure.

Inventors:
KOMA YOSUKE (JP)
KABUTO AKIO (JP)
Application Number:
PCT/JP2023/013269
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
A61M37/00
Domestic Patent References:
WO2019176126A12019-09-19
Foreign References:
JP6972409B12021-11-24
JP2017000724A2017-01-05
KR20150085502A2015-07-23
US20100048744A12010-02-25
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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