Title:
MICROPHONE, ELECTRONIC DEVICE, AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/021096
Kind Code:
A1
Abstract:
Provided are a thin microphone, a packaging method to be used in manufacturing the microphone, and an electronic device. Microphones 1, 1A, 1B, 1C, 1D, 1E, 2, 3, and 4 are each provided with: a die 11 on which a transducer is mounted; a frame 12 which has a hole 12A upwardly and downwardly penetrating the frame 12 and which holds the die 11 on the wall surface of the hole 12A with an adhesion layer 14 interposed therebetween; and a cover 13 attached to the frame 12 so as to form a space above the die 11, wherein the lower surface of the die 11 substantially forms a part of the outer surface. Since the lower surface of the die 11 does not need to be held by a thick substrate as is the case with conventional microphones, the microphone 1 can be made thinner.
Inventors:
TANAKA SHUJI (JP)
Application Number:
PCT/JP2017/025972
Publication Date:
February 01, 2018
Filing Date:
July 18, 2017
Export Citation:
Assignee:
UNIV TOHOKU (JP)
International Classes:
H04R19/04; H04R1/02; H04R31/00
Foreign References:
| JP2013533122A | 2013-08-22 | |||
| US7825509B1 | 2010-11-02 | |||
| JP2009515443A | 2009-04-09 |
Attorney, Agent or Firm:
HIRAYAMA Kazuyuki (JP)
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