MICROPHONE MODULE

WIPO Patent Application WO/2019/109715

A1

Disclosed in the present invention is a microphone module. The module comprises: a housing having sound receiving holes; a pressure plate fixedly combined with the housing, an accommodating cavity being formed between the inner surface of the pressure plate and the outer surface of the housing, and the pressure plate comprising sound transmission holes corresponding to the sound receiving holes; and an intermediate layer covering the sound receiving holes, provided on the outer or inner surface of the housing, and corresponding to the sound receiving holes. The housing further comprises an annular protrusion having a channel, extending outwards from the outer surface of the housing, and surrounding the sound receiving holes. According to the microphone module provided in the present invention, by combining sound transmission holes with an annular protrusion provided with a channel, the vibration amplitude of an intermediate layer remains small even when the microphone module is subjected to high-pressure water flow impact, such that deformation and breaking of the intermediate layer is avoided. Therefore, the influence on the acoustic property and water resistance of the microphone module is reduced.

OU MINGXU (CN)

PCT/CN2018/107865

June 13, 2019

September 27, 2018

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GOERTEK INC (CN)

H04R1/08

CN207665147U	2018-07-27
CN205491129U	2016-08-17
CN206136188U	2017-04-26
CN103533482A	2014-01-22
CN205545765U	2016-08-31
CN106385644A	2017-02-08

BEIJING JANLEA PATENT AGENCY CO., LTD. (CN)

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