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Patent Searching and Data


Title:
MICROPHONE PACKAGE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/068893
Kind Code:
A1
Abstract:
A microphone package and a method for manufacturing the same are disclosed. The microphone package of the present invention comprises: a substrate comprising a top side having a mounting pad and a bottom side having an inputting and outputting pad; a cover coupled to the substrate to form an internal space and comprising multiple fine holes passing through an external side and an internal side; and a transducer housed in the internal space and mounted on the mounting pad.

Inventors:
KIM TAE WON (KR)
CHOI JI WON (KR)
OH JUN HYEOK (KR)
Application Number:
PCT/KR2013/011286
Publication Date:
May 14, 2015
Filing Date:
December 06, 2013
Export Citation:
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Assignee:
PARTRON CO LTD (KR)
International Classes:
H04R19/04; H04R31/00
Foreign References:
JP2006174005A2006-06-29
US20080247572A12008-10-09
JP2011259410A2011-12-22
JP2006222641A2006-08-24
JP2007037069A2007-02-08
Attorney, Agent or Firm:
CHOI, HAK HYUN (KR)
최학현 (KR)
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