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Title:
MICROPHONE STRUCTURE, PACKAGING STRUCTURE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/066324
Kind Code:
A1
Abstract:
Disclosed in the present application are a microphone structure, a packaging structure, and an electronic apparatus. The microphone structure comprises a base component and a functional assembly, wherein the base component is provided with a sound hole; the functional assembly comprises a first functional assembly and a second functional assembly; and the first functional assembly comprises an acoustic device and a third functional assembly, and the second functional assembly comprises a second metal portion and a second insulating portion. By means of the present application, the antistatic discharge performance of a product can be improved, and the damage of electrostatic discharge to a device can be reduced.

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Inventors:
LI HAO (CN)
MEI JIAXIN (CN)
QIAO LIFENG (CN)
Application Number:
PCT/CN2022/126332
Publication Date:
April 27, 2023
Filing Date:
October 20, 2022
Export Citation:
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Assignee:
MEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD (CN)
International Classes:
H04R19/04; H05F3/02
Foreign References:
CN215935100U2022-03-01
CN215935102U2022-03-01
CN216054696U2022-03-15
CN215935103U2022-03-01
CN216626051U2022-05-27
CN215935101U2022-03-01
CN216491057U2022-05-10
CN216054695U2022-03-15
CN216626052U2022-05-27
CN110475192A2019-11-19
CN110574395A2019-12-13
US20130034257A12013-02-07
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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