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Title:
MICROPHONE UNIT
Document Type and Number:
WIPO Patent Application WO/2010/092856
Kind Code:
A1
Abstract:
Disclosed is a microphone unit comprising a film substrate (11), electrically conductive layers (15, 16) which are formed on both substrate surfaces of the film substrate (11), and an electrical acoustic transducer unit (12) which is provided on the film substrate (11) and comprises a diaphragm capable of converting a sound pressure to an electrical signal.  In the microphone unit, the linear expansion coefficient of the film substrate (11) including the electrically conducive layers (15, 16) falls within the range from 0.8 to 2.5 times inclusive the linear expansion coefficient of the diaphragm.

Inventors:
INODA TAKESHI (JP)
HORIBE RYUSUKE (JP)
TANAKA FUMINORI (JP)
ISHIDA TOMIO (JP)
Application Number:
PCT/JP2010/050589
Publication Date:
August 19, 2010
Filing Date:
January 20, 2010
Export Citation:
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Assignee:
FUNAI ELECTRIC CO (JP)
INODA TAKESHI (JP)
HORIBE RYUSUKE (JP)
TANAKA FUMINORI (JP)
ISHIDA TOMIO (JP)
International Classes:
H04R1/02; H04R19/04
Foreign References:
JP2008136195A2008-06-12
JP2008103612A2008-05-01
JP2008283312A2008-11-20
JPH11153501A1999-06-08
JP2000074767A2000-03-14
JP2007178221A2007-07-12
JP2008092561A2008-04-17
JP2008022332A2008-01-31
JP2009164826A2009-07-23
JP2008072580A2008-03-27
JP2008047953A2008-02-28
Other References:
See also references of EP 2384019A4
Attorney, Agent or Firm:
SANO SHIZUO (JP)
Shizuo Sano (JP)
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