MICROPHONE WITH DUSTPROOF THROUGH HOLES

Title:

MICROPHONE WITH DUSTPROOF THROUGH HOLES

Document Type and Number:

WIPO Patent Application WO/2016/109924

Kind Code:

A1

Abstract:

The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

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Inventors:

QIU GUANXUN (CN)
SONG QINGLIN (CN)

Application Number:

PCT/CN2015/070128

Publication Date:

July 14, 2016

Filing Date:

January 05, 2015

Export Citation:

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Assignee:

GOERTEK INC (CN)

International Classes:

H04R31/00

Domestic Patent References:

WO2014194062A1

2014-12-04

Foreign References:

CN102822084A	2012-12-12
CN101018424A	2007-08-15
CN101426163A	2009-05-06
CN103402163A	2013-11-20

Other References: