Field of the invention The present invention relates to a microporous membrane more particularly the present invention relates to a membrane for removing viruses.

Background of the invention

Water usually contains three types of impurities. The first is suspended or particulate matter; dissolved chemicals come next, followed by microorganisms. Bacteria, viruses and cysts are the most common microbial contamination in water and are responsible for millions of deaths each year. Water purification processes that successfully eliminate bacteria, viruses and cysts from water sources can be expensive. The purification methods include use of chemicals and radiation. It is desired to find effective, low cost technologies to eliminate this type of contamination.

Microporous membranes remove bacteria from water by size exclusion method.

Microporous membrane removes bacteria and cyst even at high flow rates. However microporous membranes cannot remove viruses by size exclusion method. Viruses being smaller than the pore size of microporous membrane easily pass through the pores of the membrane. These membranes can be used even in the absence of applied pressure or electricity and also in the gravity kind of filtration devices. It is therefore desirable that the microporous membrane can be used to remove viruses in addition to bacteria.

Copper has long been identified with antiviral properties. Copper has been used to kill viruses by prolonged contact of the water to be purified with copper containing surface However when high flow rates of water and high water flux are required like in a point of use purification device, use of copper for killing viruses are not known. Non-metallic surface like a microporous membrane may be provided with a deposit of metal for example copper by known methods. Conventionally plating, vacuum- evaporating and sputtering methods are used to simply attach metal to a non-metallic surface. In the metallised surface formed by these methods, the bond strength is weak between the surface and the metallic layer, the metallic layer easily peels off from the surface.

One solution to this problem is disclosed in US5510195A (Sano et al., 1996) which relates to a porous resin membrane having a metallic layer chemically bonded to a porous resin. The resin is etched with high concentration alkali solution or a high concentration solution of chromic acid and sulphuric acid, a high concentration solution of sulphuric acid and nitric acid, or a solution of ammonium hydrogen fluoride and nitric type of resin to chemically bond the metal to the resin. WO2013/1 13068 A1 (Nano-Nouvelle Pty. Ltd.) discloses a method for depositing a metal containing material onto a porous substrate. The method of depositing a thin uniform coating of metal on the porous substrate involves providing a coating of a compound containing at least a metal and oxygen onto a porous substrate and then forming a seed coating that is substantially free of precious metal and then applying the metal containing material to the seed layer.

EP0891712 A1 (Biopolymerix, Inc. 1999) discloses a filter comprising a substrate having immobilized thereon an antimicrobial agent that prevents bacterial grow-through while maintaining high flow rates of aqueous solution. It further discloses a process of electroless coating of silver onto a polyethersulfone membrane and includes the step of using acidic tin chloride solution followed by treatment with sodium tartrate solution to provide a silver coating on the membrane.

The present inventors have found that the etching step alters the membrane characteristics and drastically affects pore size distribution of the membrane. It is therefore desired to provide a method of preparing a microporous membrane having a well adhering metallic deposit without requiring an etching step and a microporous membrane which still provides a well adhering metallic deposit without altering the pore size distribution of membrane.

It is thus an object of the present invention to provide a microporous membrane having improved filtration characteristics.

It is a further object of the present invention to provide uniform and well adhering metallic layer on a porous substrate. It is yet another object of the present invention to provide a microporous membrane having a copper layer without affecting the porosity of the membrane.

It is yet another object of the present invention to provide a microporous membrane which provides high flux and high flow rates at low pressure drops.

The present inventors have surprisingly found that uniform and well adhering metallic copper on a porous substrate can be provided without an etching step when a surface of a polymeric porous substrate has a metallic silver coating and a metallic copper coating overlaying the silver coating. It was further found that the filtration

characteristics of the disclosed microporous membrane remained unaltered. It was further found that when the microporous membrane of the present invention is used in water filtration the copper leaching into the water is within the acceptable limits.

Summary of the invention

According to a first aspect disclosed is a microporous membrane having a polymeric substrate said substrate carrying a coating comprising metallic silver adhering to a surface of the substrate and a metallic copper coating overlaying the metallic silver. According to a second aspect disclosed is a method for preparing a microporous membrane according to the first aspect of the invention comprising the steps of:

(i) contacting a porous polymeric substrate with an aqueous solution of acidic tin based compound to sensitise the substrate surface; treating the sensitised substrate with an alkaline solution of a salt of silver to provide a coating comprising metallic silver adhering to a surface of the substrate;

(iii) rinsing the substrate carrying a coating comprising metallic silver with

deionised water;

(iv) depositing metallic copper from an aqueous electroless plating bath to

overlay the coating comprising metallic silver.

According to a third aspect of the present invention disclosed is a membrane of the first aspect obtainable by a process of the second aspect.

According to a fourth aspect of the present invention disclosed is a water purification device having a membrane of the first or third aspect. According to a further aspect of the present invention disclosed is a use of a membrane of the first or third aspect for removing at least log 2 bacteria, viruses or cysts from water to be purified, preferably atleast log 4 viruses from water to be purified. According to a further aspect of the present invention disclosed is a use of a membrane of the first or third aspect for delivering purified water at flow rates of 100 to 1000 mL/minute.

Throughout the description, the term "log reduction" as used herein means a 10-fold or 90% reduction in the number of viable microorganisms. By "2 log" reduction it is meant that the number of viable bacteria is reduced by 9.9%.

Detailed description of the invention

Microporous Membrane

Disclosed microporous membrane includes a polymeric substrate, a coating having metallic silver and a coating of metallic copper. Average pore size as used herein refers to the pore size represented by maximum number of pores on the membrane and is measured using mercury porosimetry. Preferably disclosed microporous membrane has an average pore size of less than about 100 micrometers. More preferably the average pore size is 0.1 to 0.5 micrometres. Preferably the membrane has pores of a size which is not less than 0.15 micrometers more preferably not less than 0.2 and still more preferably not less than 0.25 micrometers however the pores are of a size such that it is preferably not more than 0.45 micrometers, more preferably not more than 0.35 micrometers and still more preferably not more than 0.30 micrometers in diameter.

As used herein, the term porosity refers to a measure of the empty spaces in the microporous membrane and is the fraction of the total void spaces in the membrane over total volume of the membrane, usually expressed in percentage between 0 and 100.

Preferably the porosity of the disclosed membrane is from 30 to 80%. Preferably disclosed membrane has a porosity of greater than 40% by volume more preferably greater than 45% still more preferably greater than 50% and more preferably greater than 55% by volume. Preferably the membrane has a porosity not more than 77% still more preferably not more than 65% and yet more preferably not more than 60%.

Porosity of a membrane is measured gravimetrically. The porosity is determined as follows. The weight (Wi)(g) of the membrane after it has been saturated with water, and the weight (W2)(g) of the membrane after it has been dried are individually measured. The porosity of the porous membrane is calculated from the weights

Wi and W2 by the following formula, assuming that the density of water is 1.0 g/ml: Porosity is given by the formula:

Porosity (ε) = (W - W?VDw

(Wi - W ₂ )/Dw + W ₂ /D _p Where Wi = weight of the wet membrane

W2 = weight of the dry membrane

Dw= density of water

D _p = density of water

Disclosed microporous membrane is not limited to flat sheets and includes shapes such as rods, tubes, spheres all of which can be effective copper coated according to the present invention. Hollow fibre membrane is highly preferred.

Polymeric substrate

Disclosed membrane includes a polymeric substrate preferably selected from polyamides, polyacrylonitriles, polysulfones, polyethersulfone, polyvinylidenefluoride or a mixture thereof. It is highly preferred that the polymeric substrate is polysulfones or polyethersulfone.

Metallic silver coating

Disclosed microporous membrane includes a coating of metallic silver adhering to a surface of the polymeric substrate.

Metallic silver coating of the present invention is preferably in the form of a discontinuous layer. As used herein, "discontinuous" means that the metallic coating is disposed as islands of particles or agglomerates thereof, surrounded by uncoated areas. The majority of the silver metal particles are usually elemental metal particles, although other metallic particles such as oxides are also contemplated. More preferably, the metallic silver coating is adhering to the entire surface of the polymeric substrate.

Preferably the metallic silver coating is in the form of nanoparticles. It is preferred that metallic silver coating is adhered to the substrate by physisorption.

Metallic copper coating Disclosed microporous membrane includes a metallic copper coating overlaying the metallic silver.

It is preferred that the sum total of the average thickness of the metallic copper coating and the metallic silver coating is 0.1 to 3% of the thickness of membrane.

Average thickness of the coating of metallic silver and metallic copper may be analyzed by scanning electron microscopy followed by image analysis using Image J software. The diameter of substrate without the metallic silver and metallic copper coating as well as the diameter of substrate with the metallic silver and metallic copper coating is compared for determining the thickness.

Preferably the ratio of the amount of the metallic copper coating to the amount of the metallic silver coating is at least 1 .

Process for preparing the porous membrane according to the present invention

According to a second aspect of the present invention disclosed is a method for preparing a microporous membrane according to the first aspect of the invention comprising the steps of (i) contacting a porous polymeric substrate with an aqueous solution of acidic tin based compound to sensitise the substrate surface; (ii) treating the sensitised substrate with an alkaline solution of a salt of silver to provide a coating comprising metallic silver adhering to a surface of the substrate; (iii) rinsing the substrate carrying a coating comprising metallic silver adhering to a surface of the substrate with deionised water; (iv) depositing metallic copper from an aqueous electroless plating bath to overlay the coating comprising metallic silver.

In accordance with the present invention, the process for preparing the microporous membrane includes preferably as a first step cleaning the porous polymeric substrate with deionised water. Preferably the cleaning step includes rinsing the substrate with deionized water at room temperature for 10 to 15 minutes.

It is highly preferred that the polymeric substrate is not treated with an etching solution still preferably the polymeric substrate is not treated with an etching solution having a high concentration alkali solution or a high concentration solution of chromic acid and sulphuric acid, a high concentration solution of sulphuric acid and nitric acid, or a solution of ammonium hydrogen fluoride. In accordance with the present invention, the process includes initially sensitising the substrate which involves contacting a porous polymeric substrate with an aqueous solution of acidic tin based compound. Preferably the tin based compound is stannous chloride other stannous tin compounds such as stannous fluoborate and stannous sulphate may also be suitable for sensitizing the substrate. Preferably, the substrate is sensitised by treating it with a solution having stannous chloride and hydrochloric acid at room temperature for 20 to 25 minutes. Preferably the concentration of hydrochloric acid is 38%.

Preferably the sensitised substrate is subsequently rinsed in deionized water.

Preferably chloride ions are completely removed prior to the subsequent step to prevent contamination and loss of effectiveness of the accumulation of subsequent materials.

The next step involves activating the substrate. This step involves treating the sensitised substrate with an alkaline solution of a salt of silver to provide a coating comprising metallic silver adhering to a surface of the substrate. The salt of silver which may be used for activating is preferably selected from silver nitrate, silver fluoride or silver acetate. Preferably the activation is carried by dipping the sensitised substrate in a solution having silver nitrate and ammonium hydroxide at room temperature for 20 to 25 minutes. The strength of ammonium hydroxide is preferably 28 to 30%.

The next step involves rinsing the substrate carrying a coating comprising metallic silver adhering to a surface of the substrate with deionised water. Preferably the rinsing is carried out with deionized water for 5 to 10 minutes.

The next step involves depositing metallic copper from an aqueous electroless plating bath to overlay the coating comprising metallic silver. The electroless plating bath preferably includes a salt of copper, reducing agent, complexing agent and a pH increasing agent.

Preferably the salt of copper is copper sulphate. The concentration of the copper sulphate in the electroless plating bath is preferably from 15 grams per liter to 100 grams per liter. Salts other than copper sulphate may be used which contain either cupric or cuprous ions if they are used on the basis of equivalent mols of copper per liter of solution. Among these salts which are suitable for use in place of copper sulphate are cupric and cuprous chloride, cupric carbonate, cupric acetate and cupric and cuprous oxides.

Preferably the reducing agent is formaldehyde. Preferably a 37% aqueous solution of formaldehyde is used as a reducing agent at a concentration level of 20 mL per litre of the electroless plating bath. Reducing agents other than formaldehyde may be used which includes hydrazine or glyoxylic acid.

Preferably the complexing agent is potassium sodium tartarate. Preferably

concentration of potassium sodium tartarate is at a level of 40 grams per litre of the electroless plating bath. The tartrate salts are preferably used as complexing agents, because of their economy but sodium citrate or gluconate may be substituted on a chemically equivalent basis. Other preferred complexing agents may be used which includes ethylenediamine tetraacetic acid or polyethylene glycol.

Preferably the pH increasing agent is sodium hydroxide. Preferably concentration of sodium hydroxide is at a level of 10 grams per litre of the electroless plating bath. pH changing agent other than sodium hydroxide may be used which includes potassium hydroxide or tetramethylammonium hydroxide. Potassium hydroxide may be used in place of sodium hydroxide on a chemically equivalent basis. Preferably the electroless plating bath is maintained at room temperature and pH of the electroless plating bath ranges from 9.5 to 13, preferably from 10 to 12. It is highly preferred that the pH of the electroless plating bath is 12. The critical relation which must be observed is that the pH must be adjusted so that there is a proper balance between the strength of the alkalinity of the solution and the amount of such complexing agent as may be present. It is also important that the concentration of copper salt in the bath be kept below 0.4 mols and that there also be more copper ions in solution than potassium sodium tartarate on an equivalent basis. Under these conditions the bath will have a clouded appearance. In order for the deposition of copper to proceed at a reasonable speed it is necessary that the pH of the bath be at least 1 1.0 and that the equivalent concentration of the sodium or potassium hydroxide be at least 1.5 times that of the potassium sodium tartarate. It is also important that the mol concentration of the sodium hydroxide or potassium hydroxide should not exceed seven times the mol concentration of the potassium sodium tartarate. Preferably after the plating step the membrane is rinsed with deionised water and dried at room temperature preferably for 2 hours.

Disclosed process for preparing the microporous membrane may be carried out in a batch mode or a continuous flow mode. When the preparation is in a batch mode the substrate is sequentially immersed in the solutions as described in the disclosed process preferably with agitation.

When the preparation process is a continuous flow mode, the solutions are

sequentially flowed through the porous substrate for the desired time period. In a continuous flow mode solutions of higher concentrations are preferred for providing uniform copper depositions.

According to a third aspect of the present invention disclosed is a membrane of the first aspect obtainable by a process of the second aspect.

According to a fourth aspect of the present invention disclosed is a water purification device having a membrane of the first or third aspect. According to a further aspect of the present invention disclosed is a use of a membrane of the first or third aspect for removing at least log 2 bacteria, viruses or cysts from water to be purified, preferably atleast log 4 viruses from water to be purified.

According to a further aspect of the present invention disclosed is a use of a membrane of the first or third aspect for delivering purified water at flow rates of 100 to l OOOmL/minute. Examples

Example 1 : Preparation of a microporous membrane according to the present invention. Materials Required

(i) Porous substrate: A pre-washed clean microporous polysulphone substrate (Para MF membrane) was taken. The substrate had a porosity of 50.1 % and average pore size of 0.1 micrometer.

(ii) Sensitising solution: 10 grams of SnC ^h O was mixed with 40 mL of 37% hydrochloric acid and the final volume of the mixture was made to 1 litre with deionised water.

(iii) Activation solution: 10 grams of silver nitrate was mixed with 10 mL of ammonium hydroxide and the final volume was made up to 1 litre with deionized water.

(iv) Electroless plating bath: 15 grams of CuS04.5H ₂ 0, 40 grams of C4H4KNa06.4H ₂ 0, 20 mL of formaldehyde (37% aqueous solution) and 10 grams of NaOH were mixed together and the final volume was made upto 1 litre with deionized water.

Preparation process

The pre-cleaned microporous polysulphone substrate was dipped in the sensitising solution maintained at 25°C and 1 atmospheric pressure for 20 minutes. The substrate was removed from the sensitizing solution and rinsed in deionized water for 5 minutes. In the next step, the substrate was immersed in the activation solution kept at 25°C and 1 atmospheric pressure for 20 minutes. The substrate was then removed from the activation solution and rinsed in deionized water for 5 minutes. The substrate was next immersed in the electroless plating bath kept at 25°C and 1 atmospheric pressure for 20 minutes. The substrate was removed from the electroless plating bath and rinsed in deionized water for 20 minutes and later dried in a vaccum dessicator.

Example 2: Removal of virus from the water in a gravity fed purification device.

The biocidal efficacy of the microporous membrane of Example 1 is tested using E.Coli ATCC 10536 bacteria (10 ⁷ log) and MS2 Bacteriophage Atcc 15597 (10 ⁵ log) virus in a standard NSF-1 test water.

The membrane obtained from Example 1 is spiked with prepared test water containing bacteria and virus. Test water was fed to the membrane using a peristaltic pump (Cole- Palmer Masterflex US). The test water was allowed to flow through the membrane and when the flow through the membrane reached equilibration a sample of 2 litres of filtered water was collected. The collected sample was immediately treated with thiosulphate-thioglycolate (neutralizer) and analysed for bacterial and virus

concentration using plate count method. Filtered water samples were collected and analysed when the flow rates through the membrane of Example 1 were maintained at 130ml_/minute and 800mL/minute.

A control was also prepared by filtering water at a flow rate of l OOmL/minute through a porous substrate without a coating of metallic silver and copper as disclosed in the present invention.

The experimental data is provided in Table 1. Table 1

The data in Table 1 clearly shows that when test water having bacteria and virus is filtered through the microporous membrane of the present invention (Example 1 ) it provides increased removal of viruses even at higher flow rates. Further the levels of copper leaching into the water are low. This clearly demonstrates that the present invention provides for a microporous membrane having a uniform metallic copper coating which is also well adhering.