MICROPOROUS PLATING SOLUTION AND METHOD OF USING THIS PLATING SOLUTION TO PERFORM MICROPOROUS PLATING ON OBJECT TO BE PLATED

Title:

MICROPOROUS PLATING SOLUTION AND METHOD OF USING THIS PLATING SOLUTION TO PERFORM MICROPOROUS PLATING ON OBJECT TO BE PLATED

Document Type and Number:

WIPO Patent Application WO/2020/184289

Kind Code:

A1

Abstract:

This microporous plating solution, characterized by containing non-conductive particles and polyaluminum chloride, allows for easy preparation of positively charged nonconductive particles and is safe. Also, this method for performing microporous plating on an object to be plated, characterized by plating the object to be plated in the microporous plating solution, results in a favorable number of micropores in the plating.

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Inventors:

SHIBATA KANA (JP)

Application Number:

PCT/JP2020/008897

Publication Date:

September 17, 2020

Filing Date:

March 03, 2020

Export Citation:

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Assignee:

JCU CORP (JP)

International Classes:

C25D3/12; C25D15/02; C25D21/14

Foreign References:

JPH03291395A	1991-12-20
JPH04371597A	1992-12-24
JP2010185116A	2010-08-26
JPH10251870A	1998-09-22
JPH05171468A	1993-07-09

Other References:

TAKAAKI KOGA: "Prevention of Surface Corrosion of Microporous Chromium Plating", JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 28, no. 11, 1981, pages 522 - 527
See also references of EP 3940119A4

Attorney, Agent or Firm:

THE PATENT CORPORATE BODY OF ONO & CO. (JP)

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