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Patent Searching and Data


Title:
MICROPUMP-ASSISTED LOOP HEAT PIPE FOR HEAT DISSIPATION FROM MULTIPLE HEAT SOURCES
Document Type and Number:
WIPO Patent Application WO/2019/085090
Kind Code:
A1
Abstract:
Provided is a micropump-assisted loop heat pipe for heat dissipation from multiple heat sources, comprising a reservoir (6), an evaporator assembly, a first radiator circuit (3), a second radiator circuit (4), and an ejector (5). The evaporator assembly comprises at least two evaporators (1, 2) connected in series or in parallel. The first radiator circuit (3) and the second radiator circuit (4) are connected in parallel to connect the ejector (5) and the evaporator assembly, and the reservoir (6) connects the ejector (5) and the evaporator assembly. The micropump-assisted loop heat pipe starts up quickly, provides long-distance transmission and stable operation, and has low thermal resistance.

Inventors:
LIU WEI (CN)
LIU ZHICHUN (CN)
WANG XINTING (CN)
JIANG CHI (CN)
YANG JINGUO (CN)
ZHANG HAO (CN)
Application Number:
CN2017/112764
Publication Date:
May 09, 2019
Filing Date:
November 24, 2017
Export Citation:
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Assignee:
UNIV HUAZHONG SCIENCE TECH (CN)
International Classes:
F28D15/02
Foreign References:
US20150338171A12015-11-26
CN106556276A2017-04-05
US20080110598A12008-05-15
US20030159808A12003-08-28
US20150276324A12015-10-01
Other References:
JIANG CHI ET AL.: "Performance evaluation of Pump-Assisted Capillary Phase change Loop", JOURNAL OF ENGINEERING THERMOPHYSICS, vol. 36, no. 9, 30 September 2015 (2015-09-30), pages 1976
Attorney, Agent or Firm:
HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY PATENT AGENCY CENTER (CN)
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