Title:
MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2009/147556
Kind Code:
A3
Abstract:
The present invention discloses a method of packaging a microscopic structure (12). The method comprises the steps of forming the microscopic structure (12) on a substrate (10); depositing a layer (14) of a thermally decomposable polymer over the substrate, thereby embedding the microscopic structure; patterning the deposited layer (14) such that the microscopic structure is embedded in a portion of the patterned layer, the side walls of said portion (14) forming a substantially right angle with the substrate (10); growing a capping layer (18) over the portion, wherein the substantially right angles cause the formation of at least one channel (20) from the portion (14) through the capping layer (18); and decomposing the polymer, whereby the decomposition products escape from the portion (14) through said channel (20). The present invention further discloses a device including a microscopic structure packaged in accordance with the above method.
Inventors:
VERHEIJDEN GREJA J A M (NL)
DAAMEN ROEL (NL)
ROOSEN HAROLD H (NL)
DAAMEN ROEL (NL)
ROOSEN HAROLD H (NL)
Application Number:
PCT/IB2009/052083
Publication Date:
June 24, 2010
Filing Date:
May 19, 2009
Export Citation:
Assignee:
NXP BV (NL)
VERHEIJDEN GREJA J A M (NL)
DAAMEN ROEL (NL)
ROOSEN HAROLD H (NL)
VERHEIJDEN GREJA J A M (NL)
DAAMEN ROEL (NL)
ROOSEN HAROLD H (NL)
International Classes:
B81C1/00
Domestic Patent References:
| WO2006014403A2 | 2006-02-09 |
Foreign References:
| US20070273013A1 | 2007-11-29 | |||
| US20070126068A1 | 2007-06-07 |
Other References:
PAUL JAYACHANDRAN JOSEPH ET AL: "Wafer-Level Packaging of Micromechanical Resonators", IEEE TRANSACTIONS ON ADVANCED PACKAGING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 30, no. 1, 1 February 2007 (2007-02-01), pages 19 - 26, XP011163535, ISSN: 1521-3323
REUTER D ET AL: "Thin film encapsulation technology for harms using sacrificial CF-polymer", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH LNKD- DOI:10.1016/J.SNA.2007.11.002, vol. 145-146, 17 November 2007 (2007-11-17), pages 316 - 322, XP022716449, ISSN: 0924-4247, [retrieved on 20071117]
REUTER D ET AL: "Thin film encapsulation technology for harms using sacrificial CF-polymer", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH LNKD- DOI:10.1016/J.SNA.2007.11.002, vol. 145-146, 17 November 2007 (2007-11-17), pages 316 - 322, XP022716449, ISSN: 0924-4247, [retrieved on 20071117]
Attorney, Agent or Firm:
WILLIAMSON, Paul, L. et al. (IP DepartmentBetchworth House ,57-65 Station Road, Redhill Surrey RH1 1DL, GB)
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