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Title:
MICROSPHERE, THERMALLY FOAMABLE RESIN COMPOSITION COMPRISING SAID MICROSPHERE, STRUCTURE MEMBER, MOLDED BODY, AND METHOD FOR MANUFACTURING SAID STRUCTURE MEMBER AND SAID MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/110201
Kind Code:
A1
Abstract:
Provided is a microsphere comprising an outer shell and a foaming agent encapsulated in the outer shell, wherein the foaming agent includes a compound which turns into a gas by being heated, and equations (1) and (2) below are satisfied when A (µm) is the average particle diameter (D50) of the microsphere, and B1 (mass%) is the amount of the foaming agent with respect to the microsphere. Equation (1) 50≦A≦190 Equation (2) B1≦-0.14×A+33

Inventors:
SUZUKI YASUHIRO (JP)
NOMURA SHINTARO (JP)
ENDO SHUNZO (JP)
Application Number:
JP2016/079529
Publication Date:
June 29, 2017
Filing Date:
October 04, 2016
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
C09K3/00; B01J13/14; C08J9/32
Domestic Patent References:
WO2006030946A12006-03-23
WO2007072769A12007-06-28
WO2015178329A12015-11-26
WO2013178561A22013-12-05
Foreign References:
JP2015523908A2015-08-20
JP2012513487A2012-06-14
Other References:
See also references of EP 3395925A4
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK (JP)
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