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Patent Searching and Data


Title:
MICROSPHERE, THERMALLY FOAMABLE RESIN COMPOSITION, FOAM MOLDED BODY AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/175519
Kind Code:
A1
Abstract:
Provided are a microsphere exhibiting sharp foaming behavior while maintaining sufficient foaming performance, a thermally foamable resin composition and foam molded body using the same, and a manufacturing method for the foam molded body. The microsphere according to the present invention includes an outer shell including a polymer and a foaming agent enclosed within the outer shell, and satisfies formula (1): 20 ≤ Ts - Tg ≤ 75 (°C). In the formula, Ts (°C) represents the foaming initialization temperature of the microsphere and Tg (°C) represents the glass transition temperature of the polymer.

Inventors:
NOMURA SHINTARO (JP)
ISHIKAWA MASAYUKI (JP)
KURIU NAOKO (JP)
ENDO SHUNZO (JP)
SUZUKI YASUHIRO (JP)
Application Number:
PCT/JP2017/007856
Publication Date:
October 12, 2017
Filing Date:
February 28, 2017
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
C09K3/00; B01J13/18; C08F220/42; C08J9/32; C08K9/10; C08L33/18
Domestic Patent References:
WO2007072769A12007-06-28
WO2006030946A12006-03-23
WO1999043758A11999-09-02
Foreign References:
JP2006002133A2006-01-05
JP2015129290A2015-07-16
JP2013234255A2013-11-21
Other References:
J. BRANDRUP: "Polymer Handbook", 1989, INTERSCIENCE
See also references of EP 3441439A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
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