Title:
MICROSTRESS GROUNDING AND SHIELDING ELASTOMER
Document Type and Number:
WIPO Patent Application WO/2019/153442
Kind Code:
A1
Abstract:
A microstress grounding and shielding elastomer, comprising a conductive thin film base (1). A plurality of equidistantly distributed conductive thin film arched bodies (2) is provided on the conductive thin film base, and conductive thin films (3) connecting adjacent conductive thin film arched bodies are provided on the conductive thin film base. The microstress grounding and shielding elastomer has low stress or bounciness after being compressed, implements good contact, can achieve a stable grounding and shielding effect in a stress-sensitive compact space, does not cause structural deformation due to long-term internal stress, and has high conductive efficiency.
Inventors:
LIU JINGYUN (CN)
Application Number:
PCT/CN2018/080063
Publication Date:
August 15, 2019
Filing Date:
March 22, 2018
Export Citation:
Assignee:
SHENZHEN JOHAN MAT TECH CO LTD (CN)
International Classes:
H05K9/00; G12B17/02; H01B5/00
Foreign References:
| CN1376025A | 2002-10-23 | |||
| CN107634749A | 2018-01-26 | |||
| CN101149499A | 2008-03-26 | |||
| JPH11143396A | 1999-05-28 |
Attorney, Agent or Firm:
SHENZHEN HUATENG INTELLECTUAL PROPERTY AGENT CO., LTD. (CN)
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