Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MICROSTRUCTURE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/078019
Kind Code:
A1
Abstract:
Provided is a microstructure production method capable of effectively suppressing hardening of a transfer-receiving layer in a region covered by a light-shielding pattern. According to the present invention, a microstructure production method is provided which is provided with a step for applying a photocurable resin composition onto a transparent substrate directly or via a transparent resin layer to form a transfer-receiving layer, and in a state in which a mold having a reversed pattern of a desired relief pattern is pressed against the transfer-receiving layer, using a prescribed light-shielding pattern as a mask, the transfer-receiving layer is irradiated from the transparent substrate side with active energy rays to harden the transfer-receiving layer, thereby forming a hardened resin layer in which the reverse pattern is transferred to the transfer-receiving layer, the mold having been subjected to a transparency-reducing treatment.

Inventors:
YAMADA HIROKO (JP)
SAKATA IKUMI (JP)
YAMANAKA MISATO (JP)
Application Number:
PCT/JP2016/082452
Publication Date:
May 11, 2017
Filing Date:
November 01, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
H01L21/027; B29C59/02; B81C99/00
Domestic Patent References:
WO2015076147A12015-05-28
Foreign References:
JP2013045792A2013-03-04
JP2008213273A2008-09-18
JP2013191628A2013-09-26
JP2010263000A2010-11-18
JP2010258259A2010-11-11
JP2010074162A2010-04-02
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
Download PDF: