MICROWAVE OVEN-HEATING PACKAGE INCLUDING CONDUCTIVE HEAT-GENERATING LAYER, AND METHOD FOR HEATING FOODSTUFFS ENCLOSED THEREIN

WIPO Patent Application WO/2020/240920

A1

Provided are: a microwave oven-heating package including a conductive heat-generating layer which generates heat in a desired state regardless of the state of microwave radiation output; and a method for heating foodstuffs enclosed therein.　A microwave oven-heating package (100) includes a first sheet member (1). In addition to a substrate layer (12) and a sealant layer (13), a conductive heat-generating layer (14) is formed on the first sheet member (1). A large number of island portions containing a conductive material made of an organic compound, and a large number of bridge portions, which contain the conductive material and connect adjacent island portions, are formed in the conductive heat-generating layer (14). During heating in a microwave oven, the conductive heat-generating layer (14) generates heat such that a portion (steam-outlet intended portion (5)) of the sealant layer (13) adjacent to the conductive heat-generating layer (14) is weakened to form a steam outlet. When the output of the microwaves emitted by a microwave oven is high and the bridge portions are overheated, the bridge portions break the connection between the island portions and cause the island portions to be heated individually.

JPH06120657	PRODUCTION OF METAL BASE BOARD
WO/1990/015109	COATING OF METAL SURFACES

KUMAGAI MASAMI (JP)
NAITOH SHINGO (JP)
ARAKI MASAYA (JP)

PCT/JP2020/003114

December 03, 2020

January 29, 2020

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KUMAGAI CORP (JP)

B32B15/08; B65D81/34

JP2018193119A	2018-12-06
JP5271198B2	2013-08-21
US5171594A	1992-12-15

MATSUURA Yasuji (JP)

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