MICROWAVE-TRANSMITTING MOULD STRUCTURE, AND METHOD FOR USING SAME

WIPO Patent Application WO/2019/196029

A1

Disclosed is a microwave-transmitting mould structure, comprising a first template (10), a second template (20) and a mould combining unit (30). The mould combining unit (30) has a first snap fit (31), a second snap fit (32) and an engagement member (33). The first snap fit (31) is arranged on the first template (10); the second snap fit (32) is arranged on the second template (20); and the engagement member (33) is snap-fit engaged between the first snap fit (31) and the second snap fit (32), so that when the first template (10) and the second template (20) are subjected to an outward pressure, corresponding faces thereof which the engagement member (33) can pass through respectively abut against abutting faces of the first snap fit (31) and of the second snap fit (32), and thus, the first template (10) and the second template (20) cannot be separated from each other due to an increased pressure inside the mould.

JP7457748	Apparatus, method and capacitor plate set for making particle foam parts, in particular for making shoe soles or parts of shoe soles
WO/2016/128818	FORMING PROCESS AND MOULD FOR A SHOE SOLE AND SHOE SOLE
JP3475196	[Title of Invention] Breathable shoes

CHIU HUI-CHEN (CN)
HUANG TING-TI (CN)
WANG YA-CHI (CN)

PCT/CN2018/082662

October 17, 2019

April 11, 2018

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HUI AN SHING FOOTWEAR CO LTD (CN)
SUNKO INK CO LTD (CN)

B29D35/12; A43D25/20; B29C45/26

CN107187092A	2017-09-22
CN106965471A	2017-07-21
CN206953353U	2018-02-02
CN106263291A	2017-01-04
JPS60135230A	1985-07-18
US5866060A	1999-02-02
TWM565121U	2018-08-11

See also references of EP 3778206A4

NTD PATENT & TRADEMARK AGENCY LIMITED (CN)

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