Title:
MICROWELL-SEALING COVER PLATE AND MICROCHIP
Document Type and Number:
WIPO Patent Application WO/2018/173390
Kind Code:
A1
Abstract:
The present invention provides a microwell-sealing cover plate that is capable of tightly sealing microwells. This microwell-sealing cover plate is provided with protrusions for sealing microwells, wherein each of the protrusions satisfies the condition: E≤5 GPa, where E represents Young's modulus, and further satisfies the condition: H/S≥75 (mm-1), where S (mm2) represents an average cross-sectional area obtained by averaging, along the height direction, the cross-sectional areas of cross-sections in the direction orthogonal to the protrusion, and H (mm) represents the height.
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Inventors:
MASUHARA SHIN (JP)
ABE TOMOTERU (JP)
KATO YOSHIAKI (JP)
BRUN MARCAURELE (JP)
ABE TOMOTERU (JP)
KATO YOSHIAKI (JP)
BRUN MARCAURELE (JP)
Application Number:
PCT/JP2017/045315
Publication Date:
September 27, 2018
Filing Date:
December 18, 2017
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
G01N35/02; C12M1/00; C12M1/34; G01N37/00
Foreign References:
| JP2002505440A | 2002-02-19 | |||
| JP2009069161A | 2009-04-02 | |||
| JP2014507937A | 2014-04-03 | |||
| JP2011505548A | 2011-02-24 | |||
| JP2009524407A | 2009-07-02 | |||
| JPH04315946A | 1992-11-06 | |||
| JP2010249520A | 2010-11-04 | |||
| JP2005345203A | 2005-12-15 | |||
| JP2006090749A | 2006-04-06 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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