MIDDLE FRAME ASSEMBLY, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/185178

A1

Provided in the embodiments of the present application is a middle frame assembly, comprising a middle plate and a frame surrounding the edges of the middle plate, and the middle plate comprising a first carbon fiber reinforced resin composite material base body and a first metal plating laminated on the surface of the base body. Further provided in the embodiments of the present application are a method for manufacturing the middle frame assembly, and an electronic device comprising the middle frame assembly. In the embodiments of the present application, a carbon fiber reinforced resin composite material, such as a carbon fiber reinforced epoxy resin composite material, a carbon fiber reinforced phenolic resin composite material or a carbon fiber reinforced polytetrafluoroethylene resin composite material, is used as a base body of the middle plate of the middle frame assembly, so that the weight of the middle frame assembly is remarkably reduced, and advantages of good rigidity and high strength are achieved. In addition, a metal plating is laminated on the surface of the carbon fiber reinforced resin composite material base body, so that the wave absorption effect and PIM problem of the carbon fiber reinforced resin composite material are solved, thereby not affecting the antenna function of the electronic device.

MENG YIN (CN)
GAO JING (CN)
JIANG CHENG (CN)

PCT/CN2023/070061

October 05, 2023

January 03, 2023

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HONOR DEVICE CO LTD (CN)

H04M1/02; H01Q1/24

WO2021047659A1

2021-03-18

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CN202210339006A	2022-04-01

SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)

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