Title:
MILLIMETER WAVE-ABSORBING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/085508
Kind Code:
A1
Abstract:
Provided are a millimeter wave-absorbing structure, a method of producing same, a millimeter wave absorption method, and a method of curbing millimeter wave reflection or scattering. This millimeter wave-absorbing structure is provided with a layered film obtained by layering a film (B) and a film (C) in the stated order on a non-metal member (A). The underlayer film (B) comprises carbon powder/particles and a binder. The content of carbon powder/particles relative to 100 parts by mass binder is 30 parts by mass or greater. The upper layer film (C) comprises carbon powder/particles and a binder. The content of carbon powder/particles relative to 100 parts by mass of the binder is 5-100 parts by mass. The content of carbon powder/particles in the underlayer film (B) is greater than the content of carbon powder/particles in the upper layer film (C).
Inventors:
NAGANO TOSHIAKI (JP)
TSUKAMOTO ATSUSHI (JP)
RYOKI TAKAYUKI (JP)
TSUKAMOTO ATSUSHI (JP)
RYOKI TAKAYUKI (JP)
Application Number:
PCT/JP2020/040525
Publication Date:
May 06, 2021
Filing Date:
October 28, 2020
Export Citation:
Assignee:
KANSAI PAINT CO LTD (JP)
International Classes:
H05K9/00; B32B27/18; C01B32/00; C09D5/32; C09D7/61; C09D201/00
Domestic Patent References:
| WO2008126690A1 | 2008-10-23 |
Foreign References:
| JP2019158491A | 2019-09-19 | |||
| JP2004356352A | 2004-12-16 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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