Title:
MILLIMETER-WAVE BAND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/217098
Kind Code:
A1
Abstract:
Proposed is a millimeter-wave band communication device in which no spatial resonance occurs in a lid that shields unwanted radio waves from the outside. The disclosed millimeter-wave band communication device is provided with a substrate, a millimeter-wave band high frequency circuit element provided on the substrate, and a lid made of a bulk material and covering at least a part of the high frequency circuit element and the substrate surface, the communication device being characterized in that the lid is formed by blending a dielectric loss material in a base.
Inventors:
NAGAISHI HIDEYUKI (JP)
KURIYAMA AKIRA (JP)
MATSUMURA TAKAFUMI (JP)
KURIYAMA AKIRA (JP)
MATSUMURA TAKAFUMI (JP)
Application Number:
PCT/JP2017/015124
Publication Date:
December 21, 2017
Filing Date:
April 13, 2017
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01P5/08; H01P3/08; H01P5/107; H01Q13/02; H01Q13/08; H01Q19/06; H01Q23/00; H05K9/00
Foreign References:
| JPH054592U | 1993-01-22 | |||
| JP2003273569A | 2003-09-26 | |||
| JPS56111511U | 1981-08-28 | |||
| JP2015119295A | 2015-06-25 | |||
| JP2009010458A | 2009-01-15 | |||
| JP2014143250A | 2014-08-07 | |||
| JP2008252634A | 2008-10-16 | |||
| JP2001057507A | 2001-02-27 |
Attorney, Agent or Firm:
SEIRYO I.P.C. (JP)
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