Title:
MIRROR DIE IMAGE RECOGNITION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/127973
Kind Code:
A1
Abstract:
The present invention provides a mirror die image recognition system which distinguishes and recognizes, from among a plurality of dies (31) of a wafer (30), a mirror die free of a pattern and chips in a rectangular shape identical to that of a production die with a pattern, from a mirror die or production die with chips. The mirror die image recognition system is provided with: a camera (42) which captures an image of at least a part of a wafer in view; and an image processing device which processes the image captured by the camera, and distinguishes and recognizes the mirror die free of chips among dies in the image from other dies. This image processing device acquires luminances of at least five areas including areas corresponding to four corner portions and the central portion of each die in the image captured by the camera, determines whether the luminances of the at least five areas can be considered uniform, and recognizes a die for which the luminances of the at least five areas can be considered uniform as a mirror die free of chips.
Inventors:
IWASE TOMONORI (JP)
MORISHITA MASAHIRO (JP)
MORISHITA MASAHIRO (JP)
Application Number:
PCT/JP2017/000279
Publication Date:
July 12, 2018
Filing Date:
January 06, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H01L21/301; H01L21/66
Foreign References:
| JPH1167876A | 1999-03-09 | |||
| JP2010272615A | 2010-12-02 | |||
| US20080188016A1 | 2008-08-07 | |||
| US20040029306A1 | 2004-02-12 | |||
| JP2003031601A | 2003-01-31 | |||
| JP2002310627A | 2002-10-23 | |||
| JP2008010447A | 2008-01-17 | |||
| JPH1167876A | 1999-03-09 | |||
| JP2002026041A | 2002-01-25 |
Other References:
See also references of EP 3567626A4
Attorney, Agent or Firm:
KAKO, Muneo (JP)
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