Title:
MIXING DEVICE AND METHOD FOR MANUFACTURING A RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
Document Type and Number:
WIPO Patent Application WO/2011/122212
Kind Code:
A1
Abstract:
The disclosed mixing device (1) has a casing (2) and a pair of screws (4a and 4b) rotatably provided inside the casing (2). The casing (2) has a casing body (20) and an enclosure (3) which forms a mixing chamber (30) in which a resin composition is mixed. Each screw (4a) has: a screw shaft (41); and a screw member (42) and mixing members (43) provided on the outer surface of the screw shaft (41) and disposed inside the mixing chamber (30). The screw shafts (41), screw members (42), and mixing members (43) each have a core (411, 421, and 431) and an outer layer (45) provided on the surface of that core (411, 421, and 431). The housing (3) and the outer layers (45) are nonmetallic.
Inventors:
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
上田 茂久 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
上田 茂久 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
Application Number:
JP2011/054697
Publication Date:
October 06, 2011
Filing Date:
March 02, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE COMPANY LIMITED (5-8 Higashi-shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
International Classes:
B01F7/08; B01F7/02; B01F15/00; B29B7/48
Attorney, Agent or Firm:
ASAHI Kazuo et al. (Nishi-Shinbashi Noa Bldg. 4th Floor, 18-9 Nishi-Shinbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
Claims:
Previous Patent: METHOD FOR FABRICATING RESIN COMPOSITION FOR SEALING SEMICONDUCTORS, AND PULVERIZER
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