Title:
MOBILE PHONE EMPLOYING BONE CONDUCTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/084595
Kind Code:
A1
Abstract:
One surface of a housing (1) is furnished with an opening (2) larger in diameter than a bone conduction device (3) placed therein. A cushioning material (4) is arranged on the inside surface of the opening (2), and an abutting member (7) secured to a plate yoke (15) constituting the bone conduction device (3) is supported on the cushioning material (4), such that the top surface thereof is positioned slightly above the surface of the housing (1). The cushioning material (4) is an annular disk in which is formed a center hole (5) slightly smaller in diameter than the outside diameter of the bone conduction device (3). The outside peripheral half of the cushioning material (4) is secured resting on the upper edge of the opening (2) of the housing (1), and the outside edge of the abutting member (7) is secured resting on the upper edge of the center hole (5) of the cushioning material (4).
Inventors:
FUKUDA MIKIO (JP)
Application Number:
PCT/JP2012/076890
Publication Date:
June 13, 2013
Filing Date:
October 18, 2012
Export Citation:
Assignee:
TEMCO JAPAN (JP)
FUKUDA MIKIO (JP)
FUKUDA MIKIO (JP)
International Classes:
H04M1/03; H04M1/02; H04R1/00
Foreign References:
| JPH03266550A | 1991-11-27 | |||
| JPS58182397A | 1983-10-25 | |||
| JP3070222U | 2000-07-28 | |||
| JP2007049599A | 2007-02-22 | |||
| JP4307446B2 | 2009-08-05 | |||
| JP2003348208A | 2003-12-05 | |||
| JP2002352000A | 2002-12-06 |
Other References:
See also references of EP 2698970A4
Attorney, Agent or Firm:
SAITOH HARUO (JP)
Haruo Saito (JP)
Haruo Saito (JP)
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Claims: