Title:
MOBILE TERMINAL, AND CHIP ENCAPSULATION STRUCTURE FOR SAME
Document Type and Number:
WIPO Patent Application WO/2019/041674
Kind Code:
A1
Abstract:
A mobile terminal, and chip encapsulation structure for the same. The chip encapsulation structure comprises a substrate (10), a chip (20), and an encapsulating member (30). The substrate (10) comprises an upper surface (11) and a lower surface (12) oppositely located. The lower surface (12) of the substrate (10) is provided with a ball grid array (40). The chip (20) is provided on the upper surface (11) of the substrate (10), and is electrically connected to the ball grid array (40) via the substrate (10). The encapsulating member (30) covers and surrounds the chip (20) and encapsulates and fixes the chip (20) to the upper surface (11) of the substrate (10). By configuring the substrate to electrically connect the chip encapsulated on the upper surface of the substrate and the ball grid array provided at the lower surface of the substrate, the ball grid array enables chip adaptation without re-designing a printed circuit board, thus reducing design time cost, avoiding re-design of circuit wiring, without affecting signal transmission, and accordingly ensuring stable and reliable product performance.
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Inventors:
WU FANG (CN)
Application Number:
PCT/CN2017/117756
Publication Date:
March 07, 2019
Filing Date:
December 21, 2017
Export Citation:
Assignee:
SHENZHEN LONGSYS ELECTRONICS CO LTD (CN)
International Classes:
H01L23/488
Foreign References:
| CN105009279A | 2015-10-28 | |||
| CN106328604A | 2017-01-11 | |||
| CN102376666A | 2012-03-14 | |||
| CN102005435A | 2011-04-06 | |||
| KR101672967B1 | 2016-11-04 |
Attorney, Agent or Firm:
LIUJIA CHINA IP LAW OFFICE (CN)
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