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Title:
MODELING METHOD AND MODELING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/009009
Kind Code:
A1
Abstract:
The modeling method of the present disclosure comprises: a formation step in which a powder layer is formed using a first powder; a placement step in which a second powder having a smaller average particle size than that of the first powder is placed in a region of the powder layer; and a first heating step in which the powder layer on which the second powder is placed is heated at a temperature at which particles included in the second powder are sintered or fused together. When the compressive strength of the powder layer in said region, as measured after the first heating process, is defined as P1, and the compressive strength of the powder layer in regions other than said regions is defined as P2, the relationship P1 ≥ 0.5 MPa > P2 holds true.

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Inventors:
USAMI HIROKAZU (JP)
SUGIYAMA AKIRA (JP)
Application Number:
PCT/JP2019/025771
Publication Date:
January 09, 2020
Filing Date:
June 28, 2019
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
B22F3/16; B22F1/05; B22F1/052; B22F3/105; B29C64/153; B29C64/314; B33Y10/00; B33Y70/00
Domestic Patent References:
WO2017015159A12017-01-26
Foreign References:
JP2000328106A2000-11-28
JP2018516794A2018-06-28
JP2017164971A2017-09-21
JP2017114716A2017-06-29
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
Download PDF:
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