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Title:
MODIFICATION METHOD AND MODIFICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/223860
Kind Code:
A1
Abstract:
A modification method for modifying a film formed on a substrate. This modification method comprises a generation step and an irradiation step. In the generation step, a plasma is generated with microwaves in a treatment vessel in which a table having the substrate placed thereon has been set. In the irradiation step, in the treatment vessel containing the plasma generated in the generation step, a direct-current voltage is periodically applied to the table and electrons in the plasma are irradiated to the substrate.

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Inventors:
NOGAMI TAKAFUMI (JP)
KOTE KENICHI (JP)
Application Number:
PCT/JP2023/017272
Publication Date:
November 23, 2023
Filing Date:
May 08, 2023
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/318; H01L21/268; H01L21/31; H05H1/46
Foreign References:
JP2005023332A2005-01-27
JP2010500758A2010-01-07
JP2000068227A2000-03-03
JP2000054125A2000-02-22
JP2021522415A2021-08-30
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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