Title:
MODIFIED EPOXY RESIN, MANUFACTURING METHOD THEREFOR, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, COATING MATERIAL, AND ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2022/201985
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a modified epoxy resin that has excellent flexibility and adhesiveness, has good reactivity to a curing agent, and is capable of exhibiting characteristics even when combined with another epoxy resin; a curable resin composition including the modified epoxy resin; and a cured product thereof. This modified epoxy resin is represented by formula 1 and includes a structural unit (X) derived from epoxy resin and a structural unit (Y) derived from acid terminated polyester, wherein the weight average molecular weight is 3,000-50,000, the epoxy equivalent weight is 500-10,000 g/eq, and the proportion of the structural unit (Y) derived from acid terminated polyester in formula 1 is 50-90 wt%.
Inventors:
SUGIYAMA DAIKI (JP)
OGASAWARA HAYATO (JP)
MIYAMA KOU (JP)
OGASAWARA HAYATO (JP)
MIYAMA KOU (JP)
Application Number:
PCT/JP2022/006176
Publication Date:
September 29, 2022
Filing Date:
February 16, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/14; C08L63/00; C09D163/00; C09J163/00
Foreign References:
| JPS51131599A | 1976-11-16 | |||
| JP2017008155A | 2017-01-12 | |||
| JPH1087789A | 1998-04-07 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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