MODIFIED EXPANDABLE PARTICLES AND MOLDED OBJECT OBTAINED FROM EXPANDABLE PARTICLES

Title:

MODIFIED EXPANDABLE PARTICLES AND MOLDED OBJECT OBTAINED FROM EXPANDABLE PARTICLES

Document Type and Number:

WIPO Patent Application WO/2020/261694

Kind Code:

A1

Abstract:

Modified expandable particles (1) each comprising: an expandable particle including a specific base polymer (β); and a coating layer including a specific base polymer (α) and covering at least some of the surface of the expandable particle. The base polymer (α) has a melting point Tα and the base polymer (β) has a melting point Tβ, the Tα and the Tβ satisfying the relationship 0≤(Tα-Tβ)≤20. In cases when each modified expandable particle (1) is cut into halves (11) and (12) along a cutting plane (P1) for dividing into two equal portions and the half (11) is subsequently cut along planes (P2) perpendicular to the cutting plane (P1) into ten pieces (111) equal in thickness, then the outermost pieces (111a) and (111j) among the ten pieces (111) have a xylene-insoluble content (B) which is less than the xylene-insoluble content (A) of the half (12). The xylene-insoluble content (A) is 10-80 mass%.

More Like This:

WO/1986/001147

HOLLOW MICROSPHERES MADE FROM DISPERSED PARTICLE COMPOSITIONS AND METHODS AND APPARATUS FOR PRODUCING THEM

Inventors:

KOSHITA NOBUMASA (JP)
OHTA HAJIME (JP)
TAKAGI SHOTA (JP)

Application Number:

PCT/JP2020/015171

Publication Date:

December 30, 2020

Filing Date:

April 02, 2020

Export Citation:

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Assignee:

JSP CORP (JP)

International Classes:

C08J9/16; C08J9/232

Domestic Patent References:

WO2016181714A1	2016-11-17
WO2017010494A1	2017-01-19
WO2018084245A1	2018-05-11

Foreign References:

JPH0477532A	1992-03-11
JPH04118224A	1992-04-20
JP2000344928A	2000-12-12
JP2016069471A	2016-05-09
JP2003039565A	2003-02-13
JP2004249558A	2004-09-09
US20180345576A1	2018-12-06

Other References: