Title:
MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/172903
Kind Code:
A1
Abstract:
Provided are a novel modified fluororesin material having a low linear expansion rate, a material for a circuit board, a laminate for a circuit board, a circuit board, and a method for producing a modified fluororesin material. A modified fluororesin material including tetrafluoroethylene units, modified monomer units based on a modified monomer that is copolymerizable with tetrafluoroethylene, and tertiary carbon, the tertiary carbon being 0.001-0.100 mol% relative to the total of the tetrafluoroethylene units and the modified monomer units, the linear expansion rate of the modified fluororesin material being decreased 5% or more at 20-200°C in comparison to a tertiary carbon-free unmodified fluororesin material that includes tetrafluoroethylene units and modified monomer units based on a modified monomer that is copolymerizable with tetrafluoroethylene.
Inventors:
SAWAKI KYOUHEI (JP)
OKUNO SHINGO (JP)
UEDA YUKI (JP)
OKANISHI KEN (JP)
FUKUSHIMA TOSHIYUKI (JP)
IMAMURA HITOSHI (JP)
OKUNO SHINGO (JP)
UEDA YUKI (JP)
OKANISHI KEN (JP)
FUKUSHIMA TOSHIYUKI (JP)
IMAMURA HITOSHI (JP)
Application Number:
PCT/JP2022/004759
Publication Date:
August 18, 2022
Filing Date:
February 07, 2022
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
C08J7/00; C08F214/26; H05K1/03
Domestic Patent References:
| WO2019187725A1 | 2019-10-03 | |||
| WO2018043003A1 | 2018-03-08 | |||
| WO2020145133A1 | 2020-07-16 | |||
| WO2013008667A1 | 2013-01-17 |
Foreign References:
| JP2015008260A | 2015-01-15 | |||
| JP2015008286A | 2015-01-15 | |||
| JP5766125B2 | 2015-08-19 | |||
| JP2012145676A | 2012-08-02 | |||
| JPH0770315A | 1995-03-14 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: