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Title:
MODIFIED LIQUID DIENE RUBBER, AND RESIN COMPOSITION CONTAINING SAID MODIFIED LIQUID DIENE RUBBER
Document Type and Number:
WIPO Patent Application WO/2016/104473
Kind Code:
A1
Abstract:
 The present invention provides a modified liquid diene rubber that can be used in a curable resin composition, wherein said resin composition containing said modified liquid diene rubber exhibits a much faster curing speed compared to prior art, and excellent post-curing mechanical properties, transparency and heat resistance. The present invention also provides a resin composition containing said modified liquid diene rubber. Prepared is a modified liquid diene rubber comprising: a modified group (p), part of which contains a (meth)acryloyl group; and a monomer unit (a1) derived from a conjugated diene compound. The hydrogenation rate of a carbon-carbon double bond derived from the conjugated diene compound is 30-95 mol%, and the functional group equivalent of the modified group (p) is 700-20,000 g/eq. Also prepared is a resin composition containing said modified liquid diene rubber.

Inventors:
MOTODA SATOSHI (JP)
HIRATA KEI (JP)
Application Number:
PCT/JP2015/085770
Publication Date:
June 30, 2016
Filing Date:
December 22, 2015
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08C19/28; C08C19/02; C08F290/12; C09J4/06; C09J11/06; C09J109/00
Domestic Patent References:
WO2015083608A12015-06-11
Foreign References:
JP2003335985A2003-11-28
JP2009029976A2009-02-12
JPH0269545A1990-03-08
JPS62280204A1987-12-05
JPH01113417A1989-05-02
Other References:
See also references of EP 3239182A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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