Title:
MODIFIED MASK FOR PHOTOLITHOGRAPHY OF A WAFER WITH RECESS, METHOD FOR PRODUCING SUCH A MASK AND METHOD FOR PHOTOLITHOGRAPHY OF A WAFER WITH RECESS
Document Type and Number:
WIPO Patent Application WO/2012/020382
Kind Code:
A3
Abstract:
A mask for photolithography of a semiconductor wafer is dis- closed. The mask comprises a protrusion section that pro- trudes from a handling section of the mask. An outer shape of the handling section is provided to enable handling by a mask aligner device. The protrusion has a face surface that is provided at a level which is different from a face surface area of the handling section.
Inventors:
BIECK FLORIAN (DE)
Application Number:
PCT/IB2011/053565
Publication Date:
April 05, 2012
Filing Date:
August 10, 2011
Export Citation:
Assignee:
DOUBLECHECK SEMICONDUCTORS GMBH (DE)
BIECK FLORIAN (DE)
BIECK FLORIAN (DE)
International Classes:
G03F1/38
Domestic Patent References:
| WO2008048215A2 | 2008-04-24 | |||
| WO2009141740A2 | 2009-11-26 | |||
| WO2010082094A2 | 2010-07-22 |
Foreign References:
| US20060166111A1 | 2006-07-27 |
Attorney, Agent or Firm:
SCHWEIGER, Martin et al. (Karlstr. 35, Muenchen, DE)
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