MODIFIED METAL COMPOSITIONS AND METHODS RELATED THERETO BACKGROUND [0001] Metal alloys can be an alloy of iron and other elements, including carbon. When carbon is the primary alloying element, its content in the metal alloy may be from about 0.002% to 2.1% by weight. Without limitation, the following elements can be present in metal alloy: carbon, manganese, phosphorus, sulfur, silicon, oxygen, nitrogen, and aluminum. Alloying elements added to modify the characteristics of a metal (e.g., steel) can include without limitation: manganese, nickel, chromium, molybdenum, boron, titanium, vanadium and niobium. [0002] A metal alloy (e.g., stainless steel) can be a material that does not readily corrode, rust (or oxidize) or stain with water. There can be different grades and surface finishes of stainless steel to suit a given environment. Stainless steel can be used where both the properties of steel and resistance to corrosion are beneficial. SUMMARY [0003] Provided in various embodiments herein, are metal compositions, metal materials (e.g., metal alloys, such as diffusion alloyed metal alloys (e.g., a metal alloys or metal alloy hybrid), metal substrates, such as for forming diffusion-alloyed metals (e.g., a metal alloys or metal alloy hybrid) (e.g., in any configuration, such as in coils), and methods related thereto, such as methods of manufacturing or otherwise preparing such compositions and methods. In some embodiments, the metal material provided herein comprises a metal substrate, such as described herein. In certain embodiments, the metal material is a diffusion alloyed metal material, comprising a metal substrate (or core) and a metal alloy surface (e.g., metallurgically bound to the substrate (or core)). In some instances, the metal alloy surface covers all or part of at least one surface of the metal material. In specific embodiments, such a metal material or metal alloy material (e.g., diffusion-alloyed metal) is configured in the form of a coil. [0004] In certain instances, processes provided herein, such as using coil configurations, facilitates the formation of desirable products provided herein. In some instances, use of coil configuration improves conversion rate of diffusion alloying processes provided herein, reduces the amount of slurry utilized in alloying processes, reduces loss of alloying materials (e.g., because regardless of the direction the alloying material is directed in a process herein, it is directed into a substrate material), reduces costs (e.g., by requiring less slurry material for alloying and/or by reducing the need to recycle depleted slurry), is more eco-friendly (e.g., by reducing the amount of slurry used), and/or provides other benefits. In some instances, processes provided herein are able to be implemented and adopted using existing infrastructures involving metal coil processing, e.g., improving cost efficiencies for manufacturers. [0005] Moreover, in certain instances, metal materials, substrates, and/or processes provided herein are suitable for forming metal (e.g., alloy) materials with unique, desirable, and/or otherwise high performance characteristics. In some instances, use of materials, substrates, and/or processes provided herein, facilitates the production of metal alloy materials in form factors, with form factors, performance characteristics, structuring (e.g., microstructures), and/or at costs not otherwise able to be achieved using existing technologies. In specific embodiments, materials and/or substrates provided herein comprise any suitable elements, such as, by way of non-limiting example, one or more of iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and niobium, tantalum, cerium, bismuth, antimony, tin, lead, oxides thereof, nitrides thereof, sulfides thereof, or any combination thereof. More specific details of specific substrates are described in more detail herein. [0006] Provided in certain embodiments herein is a method for forming metal coil. In some embodiments, the method comprises: (a) contacting (or coating) a metal substrate (e.g., a surface thereof) with a slurry composition to provide a coated metal substrate, which coated metal substrate comprising a slurry coating (e.g., film) in contact with and at least partially covering a surface of the metal substrate, the slurry composition and coating (e.g., independently) comprising an alloying agent (e.g., element) (e.g., and, a metal oxide (e.g., an inert metal oxide) and/or a metal transport activator); and (b) winding (e.g., coiling, bending, flexing, or rewinding) the coated metal substrate at a winding (e.g., coiling, bending, flexing, or rewinding) temperature (e.g., of about 10 degree Celsius (°C) to about 200°C) to form a metal coil (e.g., a spiral metal coil) comprising a plurality of (e.g., coiled) metal wraps with the slurry coating being configured (e.g., in wrap spacing(s)) between a plurality of (e.g., coil) wraps. [0007] In some embodiments, the slurry coating (e.g., film) covers at least 25% at least 50%, at least 75%, at least 90% of the surface, or two surfaces of the metal substrate. [0008] In some embodiments, step (b) of the method for forming metal coil comprises passing the coated metal substrate through a plurality of coils that (e.g., collectively) subject the coated metal substrate to a plurality (e.g., at least about 5, 10, 15, or 20 times) of bending and unbending cycles. [0009] In some embodiments, the method for forming metal coil further comprises: (c) subjecting the metal coil to conditions sufficient (e.g., annealing at an alloying temperature (e.g., of about 750 degree Celsius (°C) to about 1100 °C) in an alloying atmosphere (e.g., comprising a reducing gas, such as hydrogen)) that the alloying agent (e.g., element) diffuses into and alloys with two neighboring metal wraps of the plurality of metal wraps to form a diffusion-alloyed metal coil. [0010] In some embodiments, the slurry comprises a reactive metal oxide. In some embodiments, the reactive metal oxide comprises the alloying element. In some embodiments, the reactive metal oxide can be selected from the group consisting of chromium(III) oxide (Cr ₂ O ₃ ), titanium(IV) oxide (TiO ₂ ), iron chromium oxide (FeCr ₂ O ₄ ), silicon oxide (SiO ₂ ), tantalum pentoxide (Ta2O ₅ ), magnesium chromium oxide (MgCr ₂ O ₄ ), manganese(II) oxide (MnO), manganese(IV) oxide (MnO ₂ ), vanadium(II) oxide (VO), vanadium(III) oxide (V ₂ O ₃ ), titanium(II) oxide (TiO), titanium(III) oxide (Ti ₂ O ₃ ), niobium pentoxide (Nb ₂ O ₅ ), boron trioxide (B ₂ O ₃ ), cerium oxide (CeO ₂ ), and combinations thereof. In some embodiments, the alloying atmosphere is a reducing atmosphere. In some embodiments, the alloying atmosphere comprises hydrogen. In some embodiments, at least a portion of the reactive metal oxide undergoes a metallothermic reduction reaction with the reducing atmosphere to yield water (e.g., reduced by the alloying agent (e.g., element)) and two metal diffusion layers. In some embodiments, each of the two metal diffusion layers is metallurgically bonded to a side of a metal wrap of the diffusion-alloyed metal coil. [0011] In some embodiments, the method for forming metal coil further comprises drying the (wet) slurry coating (e.g., film) to form a dry slurry coating (e.g., film). In some embodiments, the drying is performed before winding (e.g., coiling, bending, flexing, or rewinding). In some embodiments, the drying is performed by removing a solvent (e.g., water or alcohol (e.g., C ₁ -C ₁₂ alcohol, such as C ₁ -C ₆ alcohol)). [0012] In some embodiments, a thickness of a wet film of the slurry composition is of about 50 micrometers (µm) to about 500 µm, such as about 50 µm to about 300 µm, about 150 µm to about 210 µm, about 150 µm to about 200 µm, about 160 µm to about 200 µm, about 165 µm to about 195 µm, about 170 µm to about 190 µm, about 175 µm to about 190 µm, about 177 µm to about 187 µm, or about 180 to about 185 µm, optionally with a relative standard deviation of 10% or less. In some embodiments, the standard deviation is about 15 µm or less, about 10 µm or less, or about 8 µm or less. In some embodiments, a thickness of a dry film of the slurry composition is of about 50 micrometers (µm) to about 250 µm, such as about 50 µm to about 150 µm, such as about 60 µm to about 100 µm, about 65 µm to about 95 µm, about 70 µm to about 90 µm, about 75 µm to about 85 µm, about 77 µm to about 83 µm, or about 80 µm, optionally with a relative standard deviation of 10% or less. In some embodiments, the standard deviation is about 15 µm or less, about 10 µm or less, or about 8 µm or less. [0013] In some embodiments, a wrap-to-wrap spacing (e.g., an average wrap-to-wrap spacing) of the metal coil is less than 1.5 times, such as less than 1.2 times, of an average dry film thickness of the slurry coating composition; or wherein a wrap-to-wrap spacing (e.g., an average wrap-to-wrap spacing) of the metal coil is less than 350 micrometers (µm), less than 250 µm, less than 200 µm, less than 150 µm, less than 100 µm, less than 90 µm, or less than 85 µm. [0014] In some embodiments, the diffusion-alloyed metal coil comprises (i) a metal sheet, (ii) a first metal diffusion layer metallurgically bonded to a side of the metal sheet, and (iii) a second metal diffusion layer metallurgically bonded to another side of the metal sheet. [0015] In some embodiments, the slurry coating is in contact with a blocking layer (e.g., comprising an inert metal oxide) of the surface of the metal substrate. In some embodiments, the blocking layer comprises an inert metal oxide. In some embodiments, the blocking layer does not comprise (e.g., an appreciable amount of) the alloying agent (e.g., element). A blocking layer generally does not comprise an appreciable amount (e.g., less than 0.01%, less than 0.005%, or less than 0.001% by weight of the blocking layer(s)) of the alloying element(s). [0016] In some embodiments, the alloying element is selected from the group consisting of iron (Fe), chromium (Cr), nickel (Ni), silicon (Si), vanadium (V), titanium (Ti), boron (B), tungsten (W), aluminum (Al), molybdenum (Mo), cobalt (Co), manganese (Mn), zirconium (Zr), copper (Cu), niobium (Nb), tantalum (Ta), cerium (Ce), bismuth (Bi), antimony (Sb), tin (Sn), lead (Pb), and combinations thereof. [0017] In some embodiments, the slurry coating composition comprises chromium (Cr) at a concentration of about 5% to about 50%, about 10% to about 45%, or about 12% to about 45%, by weight of the slurry coating composition. [0018] In some embodiments, at least about 10 wt %, at least about 20 wt %, at least about 30 wt %, or at least about 40 wt % of the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps. In some embodiments, about 10 wt % to about 80 wt %, about 20 wt % to about 80 wt %, about 30 wt % to about 80 wt %, or about 40 wt % to about 80 wt % of the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps. In some embodiments, about 10 wt % to about 100 wt %, about 20 wt % to about 100 wt %, about 30 wt % to about 100 wt %, or about 40 wt % to about 100 wt % of the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps. In some embodiments, the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps at an alloying temperature. In some embodiments, the alloying temperature about 750 degree Celsius (°C) to about 1100 °C. In some embodiments, the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps in an alloying atmosphere. In some embodiments, the alloying atmosphere comprises a reducing gas, such as hydrogen. [0019] In some embodiments, the slurry coating composition comprises the alloying element, a metal oxide, and a metal transport activator. In some embodiments, the metal oxide is an inert metal oxide. [0020] In some embodiments, the metal oxide comprises a metal oxide selected from the group consisting of aluminum oxide (Al ₂ O ₃ ), chromium(III) oxide (Cr ₂ O ₃ ), titanium(IV) oxide (TiO ₂ ), iron chromium oxide (FeCr ₂ O ₄ ), silicon oxide (SiO ₂ ), tantalum pentoxide (Ta2O ₅ ), magnesium chromium oxide (MgCr ₂ O ₄ ), manganese(II) oxide (MnO), manganese(IV) oxide (MnO ₂ ), vanadium(II) oxide (VO), vanadium(III) oxide (V ₂ O ₃ ), titanium(II) oxide (TiO), titanium(III) oxide (Ti ₂ O ₃ ), niobium pentoxide (Nb ₂ O ₅ ), boron trioxide (B ₂ O ₃ ), cerium oxide (CeO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), lithium superoxide (LiO ₂ ), zirconium oxide (ZrO ₂ ), lanthanum(III) oxide (La ₂ O ₃ ), bentonite clay, monterey clay, Kaolin clay, philosilicate clay, other clays, or combinations thereof. In some embodiments, the metal oxide comprises an inert metal oxide selected from the group consisting of aluminum oxide (Al ₂ O ₃ ), chromium(III) oxide (Cr ₂ O ₃ ), titanium dioxide (TiO ₂ ), FeCr ₂ O ₄ , silicon oxide (SiO ₂ ), titanium dioxide (TiO ₂ ), Ta ₂ O ₅ , MgCr ₂ O ₄ , magnesium oxide (MgO), calcium oxide (CaO), lithium superoxide (LiO ₂ ), zirconium oxide (ZrO ₂ ), vanadium(III) oxide (V ₂ O ₃ ), lanthanum(III) oxide (La ₂ O ₃ ), bentonite clay, monterey clay, Kaolin clay, philosilicate clay, other clays, or combinations thereof. [0021] In some embodiments, the metal transport activator comprises a halide species, a metal halide species, a metal sulfide species, a gaseous species, or a combination thereof. In some embodiments, the halide species comprises chlorine, bromide, iodine, fluorine, or a combination thereof. In some embodiments, the metal halide species comprise a metal chloride, a metal bromide, a metal iodine, a metal fluoride, or a combination thereof. In some embodiments, gaseous species comprises hydrogen. In some embodiments, the metal chloride species comprises a species selected from the group consisting of magnesium chloride (MgCl ₂ ), iron (II) chloride (FeCl ₂ ), calcium chloride (CaCl ₂ ), zirconium (IV) chloride (ZrCl ₄ ), titanium (IV) chloride (TiCl ₄ ), niobium (V) chloride (NbCl ₅ ), titanium (III) chloride (TiCl ₃ ), silicon tetrachloride (SiCl ₄ ), vanadium (III) chloride (VCl ₃ ), chromium (III) chloride (CrCl ₃ ), trichlorosilance (SiHCl ₃ ), manganese (II) chloride (MnCl ₂ ), chromium (II) chloride (CrCl ₂ ), cobalt (II) chloride (CoCl ₂ ), copper (II) chloride (CuCl ₂ ), nickel (II) chloride (NiCl ₂ ), vanadium (II) chloride (VCl ₂ ), ammonium chloride (NH4Cl), sodium chloride (NaCl), potassium chloride (KCl), bismuth oxychloride (BiOCl), copper hydroxychloride, manganese hydroxychloride, antimony oxychloride, and molybdenum trichloride, and combinations thereof. In some embodiments, the metal sulfide species comprises a species selected from the group consisting of molybdenum sulfide (MoS), manganese sulfide (MnS), iron disulfide (FeS ₂ ), chromium sulfide (CrS), iron sulfide (FeS), copper sulfide (CuS), nickel sulfide (NiS) and combinations thereof. [0022] In some embodiments, the method for forming metal coil further comprises unwinding (e.g., uncoiling, unbending, leveling, or flattening) the diffusion-alloyed metal coil. [0023] In some embodiments, the method for forming metal coil further comprises mechanically treating (e.g., by polishing, cleaning, or both) the diffusion-alloyed metal coil (e.g., to remove a plurality of sintered (e.g., surface-sintered) particles). [0024] Provided in certain embodiments herein is a metal coil (e.g., a spiral metal coil) wound in a plurality of metal wraps the metal coil comprising a plurality of metal wraps with a slurry coating composition (e.g., a diffusion alloying composition) being configured in a wrap-to-wrap spacing (e.g., an average wrap-to-wrap spacing) between a plurality of (e.g., coil) wraps thereof. [0025] In some embodiments, the slurry coating composition is provided at an average dry film thickness of about 60 micrometers (µm) to about 100 µm such as about 70 µm to about 100 µm, about 75 µm to about 100 µm, or about 80 µm, optionally with a relative standard deviation of 10% or less. In some embodiments, the standard deviation is about 15 µm or less, about 10 µm or less, or about 8 µm or less. [0026] In some embodiments, the wrap-to-wrap spacing is less than 1.5 times, such as less than 1.2 times, of the average dry film thickness of the slurry coating composition or is less than 200 micrometers (µm), less than 150 µm, less than 100 µm, less than 90 µm, or less than 85 µm. [0027] In some embodiments, the slurry coating composition comprises an alloying agent (e.g., element) (e.g., and, a metal oxide (e.g., an inert metal oxide) and/or a metal transport activator), which alloying agent is capable of diffusion into and alloying with two neighboring metal wraps of the plurality of metal wraps. [0028] Provided in certain embodiments herein is a metal coil (e.g., a spiral metal coil) wound in a plurality of metal wraps, the metal coil comprising a first metal wrap, a neighboring second metal wrap thereof, and a slurry coating composition (e.g., a diffusion alloying composition) provided between the first and second metal wraps. [0029] In some embodiments, the slurry coating composition is provided at an average dry film thickness of about 60 micrometers (µm) to about 100 µm, such as about 70 micrometers (µm) to about 100 µm, about 75 micrometers (µm) to about 100 µm, or about 60 µm to about 80 µm. [0030] In some embodiments, the first metal wrap comprises a first side surface facing towards the second metal wrap, and the second metal wrap comprises a second side surface facing towards the first metal wrap. In some embodiments, a spacing (e.g., an average spacing, or a shortest distance), along a radial direction of the metal coil, between the first and second side surfaces is of about 60 micrometers (µm) to about 120 µm, such as about 70 µm to about 100 µm, about 75 µm to about 100 µm, or about 80 µm to about 100 µm. [0031] In some embodiments, the slurry coating composition comprises an alloying agent (e.g., element), which alloying element is capable of diffusion into and alloying with the first and second metal wraps to form (i) a first diffusion layer metallurgically bonded to at least a portion of the first metal wrap and (ii) a second diffusion layer metallurgically bonded to at least a portion of the second metal wrap. [0032] In some embodiments, the first or second diffusion layer is characterized by a (e.g., average) concentration of the alloying agent (e.g., element) that is lower than a corresponding (e.g., average) concentration of the alloying agent (e.g., element) of the slurry coating composition. In some embodiment, the (e.g., average) concentration of the alloying agent is no more than about 50%, 40%, 30%, 20%, or 10% of the corresponding (e.g., average) concentration of the alloying agent of the slurry coating composition. [0033] In some embodiments, the metal coil further comprises a blocking layer provided between the slurry coating composition and one of the two neighboring metal wraps, or provided between the slurry coating composition and one of the first and second metal wraps. In some embodiments, the blocking layer comprises an inert metal oxide. [0034] In some embodiments, the slurry coating composition is provided adjacent to the other one of the two neighboring metal wraps, or the other one of the first and second side surfaces. [0035] In some embodiments, the blocking layer is a first blocking layer. In some embodiments, the metal coil further comprises a second blocking layer provided between the slurry coating composition and the other one of the two neighboring metal wraps, or provided between the slurry coating composition and the other one of the first and second metal wraps. [0036] In some embodiments, the metal coil has an inner diameter of about 100 millimeters (mm) to about 700 mm. In some embodiments, the metal coil has an outer diameter of about 500 millimeters (mm) to about 10 meters (m). [0037] In some embodiments, a width (e.g., an average width) of the metal coil is of about 1 inch (in) to about 100 in, such as about 5 in to about 90 in, about 5 in to about 80 in, or about 8 in to about 72 in. In some embodiments, a metal wrap (e.g., the first metal wrap, or the second metal wrap) has a thickness (e.g., an average thickness or average gauge thickness) of about 0.0005 inch (in) to about 0.250 in, such as about 0.0005 in to about 0.125 in, about 0.0005 in to about 0.100 in, or about 0.0005 in to about 0.050 in. [0038] In some embodiments, the alloying element is selected from the group consisting of iron (Fe), chromium (Cr), nickel (Ni), silicon (Si), vanadium (V), titanium (Ti), boron (B), tungsten (W), aluminum (Al), molybdenum (Mo), cobalt (Co), manganese (Mn), zirconium (Zr), copper (Cu), niobium (Nb), tantalum (Ta), cerium (Ce), bismuth (Bi), antimony (Sb), tin (Sn), lead (Pb), and combinations thereof. [0039] In some embodiments, the slurry coating composition comprises chromium (Cr) at a concentration of about 5% to about 50%, such as about 10% to about 45%, or about 12% to about 45%, by weight of the slurry coating composition. [0040] In some embodiments, at least about 10 wt %, at least about 20 wt %, at least about 30 wt %, or at least about 40 wt % of the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps. In some embodiments, about 10 wt % to about 80 wt %, about 20 wt % to about 80 wt %, about 30 wt % to about 80 wt %, or about 40 wt % to about 80 wt % of the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps. In some embodiments, about 10 wt % to about 100 wt %, about 20 wt % to about 100 wt %, about 30 wt % to about 100 wt %, or about 40 wt % to about 100 wt % of the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps. In some embodiments, the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps at an alloying temperature. In some embodiments, the alloying temperature is about 750 degree Celsius (°C) to about 1100 °C. In some embodiments, the alloying agent (e.g., chromium (Cr), or aluminum (Al)) is configured for transport into and alloying with the two neighboring metal wraps of the plurality of metal wraps in an alloying atmosphere. In some embodiments, the alloying atmosphere comprises a reducing gas, such as hydrogen. [0041] In some embodiments, the slurry coating composition comprises the alloying element, a metal oxide, and a metal transport activator. In some embodiments, the metal oxide is an inert metal oxide. In some embodiments, the inert metal oxide is selected from the group consisting of aluminum oxide (Al ₂ O ₃ ), chromium(III) oxide (Cr ₂ O ₃ ), titanium dioxide (TiO ₂ ), FeCr ₂ O ₄ , silicon oxide (SiO ₂ ), titanium dioxide (TiO ₂ ), Ta ₂ O ₅ , MgCr ₂ O ₄ , magnesium oxide (MgO), calcium oxide (CaO), lithium superoxide (LiO ₂ ), zirconium oxide (ZrO ₂ ), vanadium(III) oxide (V ₂ O ₃ ), lanthanum(III) oxide (La ₂ O ₃ ), bentonite clay, monterey clay, Kaolin clay, philosilicate clay, other clays, and combinations thereof. [0042] In some embodiments, the metal transport activator comprises a halide species, a metal halide species, a metal sulfide species, a gaseous species, or a combination thereof. In some embodiments, the halide species comprises chlorine, bromide, iodine, fluorine, or a combination thereof. In some embodiments, the metal halide species comprise a metal chloride, a metal bromide, a metal iodine, a metal fluoride, or a combination thereof. In some embodiments, gaseous species comprises hydrogen. In some embodiments, the metal chloride species comprises a species selected from the group consisting of magnesium chloride (MgCl ₂ ), iron (II) chloride (FeCl ₂ ), calcium chloride (CaCl ₂ ), zirconium (IV) chloride (ZrCl ₄ ), titanium (IV) chloride (TiCl ₄ ), niobium (V) chloride (NbCl5), titanium (III) chloride (TiCl ₃ ), silicon tetrachloride (SiCl ₄ ), vanadium (III) chloride (VCl ₃ ), chromium (III) chloride (CrCl ₃ ), trichlorosilance (SiHCl ₃ ), manganese (II) chloride (MnCl ₂ ), chromium (II) chloride (CrCl ₂ ), cobalt (II) chloride (CoCl ₂ ), copper (II) chloride (CuCl ₂ ), nickel (II) chloride (NiCl ₂ ), vanadium (II) chloride (VCl ₂ ), ammonium chloride (NH ₄ Cl), sodium chloride (NaCl), potassium chloride (KCl), bismuth oxychloride (BiOCl), copper hydroxychloride, manganese hydroxychloride, antimony oxychloride, and molybdenum trichloride, and combinations thereof. In some embodiments, the metal sulfide species comprises a species selected from the group consisting of molybdenum sulfide (MoS), manganese sulfide (MnS), iron disulfide (FeS ₂ ), chromium sulfide (CrS), iron sulfide (FeS), copper sulfide (CuS), nickel sulfide (NiS) and combinations thereof. [0043] Another aspect of the present disclosure provides a non-transitory computer readable medium comprising machine executable code that, upon execution by one or more computer processors, implements any of the methods above or elsewhere herein. [0044] Another aspect of the present disclosure provides a system comprising one or more computer processors and computer memory coupled thereto. The computer memory comprises machine executable code that, upon execution by the one or more computer processors, implements any of the methods above or elsewhere herein. [0045] Additional aspects and advantages of the present disclosure will become readily apparent to those skilled in this art from the following detailed description, wherein only illustrative embodiments of the present disclosure are shown and described. As will be realized, the present disclosure is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, all without departing from the disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive. BRIEF DESCRIPTION OF THE DRAWINGS [0046] The novel features of the invention are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings (also “figure” and “FIG.” herein), of which: [0047] FIG.1 schematically illustrates an exemplary method for forming a coated metal substrate; [0048] FIG.2 illustrates an exemplary substrate after coating with a slurry; [0049] FIG.3 illustrates an exemplary substrate after coating with a slurry; [0050] FIG.4 schematically illustrates an exemplary computer control system that is programmed or otherwise configured to implement methods provided herein; [0051] FIGs.5A-5F illustrate exemplary grain morphologies in substrate(s); [0052] FIG.6 illustrates a schematic example of a metal coil; [0053] FIGs.7A-7B illustrate exemplary effect(s) of surface roughness and slurry delamination; [0054] FIGs.8A-8B illustrate exemplary local chromium concentration on a surface of a substrate; [0055] FIGs. 9A-9B illustrate exemplary chemical composition(s) of diffusion alloyed metal material(s) at the alloy layer; [0056] FIGs.10A-10B illustrate microstructure(s) in exemplary alloyed metal(s); [0057] FIGs.10C-10D illustrate elongation of exemplary alloyed metal(s); [0058] FIG.11 illustrates pitting potential of an exemplary metal material; [0059] FIG.12 illustrates Salt Spray Performance of an exemplary metal material; [0060] FIG. 13 illustrates corrosion in an exemplary alloyed metal; the insert of FIG. 13 illustrates exemplary association between a chromium concentration variation and corrosion in a metal material; [0061] FIG.14A illustrates an example of a metal material after cold reduction; [0062] FIG.14B illustrates pitting potential of an exemplary metal material after cold reduction; [0063] FIG.15 illustrates examples of sintered particles; [0064] FIG.16 illustrates mechanical properties of an exemplary metal material; and [0065] FIGs.17A-17C illustrate physical properties of exemplary Cr-SODA. DETAILED DESCRIPTION [0066] While various embodiments of the invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions may occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed. [0067] The term “winding,” as used herein, generally refers to turning (e.g., mechanically) a material completely or repeatedly in relation to an object or a reference position. Nonlimiting examples of winding includes coiling. [0068] The term “unwinding,” as used herein, generally refers to causing a wound material into a less curved shape or status. [0069] The term “adjacent” or “adjacent to,” as used herein, generally refers to ‘next to’, ‘adjoining’, ‘in contact with,’ and ‘in proximity to.’ In some instances, adjacent to may be ‘above’ or ‘below.’ A first layer adjacent to a second layer may be in direct contact with the second layer, or there may be one or more intervening layers between the first layer and the second layer. [0070] Whenever the term “at least,” “greater than,” or “greater than or equal to” precedes the first numerical value in a series of two or more numerical values, the term “at least,” “greater than” or “greater than or equal to” applies to each of the numerical values in that series of numerical values. For example, greater than or equal to 1, 2, or 3 is equivalent to greater than or equal to 1, greater than or equal to 2, or greater than or equal to 3. [0071] Whenever the term “no more than,” “less than,” or “less than or equal to” precedes the first numerical value in a series of two or more numerical values, the term “no more than,” “less than,” or “less than or equal to” applies to each of the numerical values in that series of numerical values. For example, less than or equal to 3, 2, or 1 is equivalent to less than or equal to 3, less than or equal to 2, or less than or equal to 1. [0072] Provided in various embodiments herein, are metal compositions, metal materials (e.g., metal alloys, such as diffusion alloyed metal alloys (e.g., a metal alloys or metal alloy hybrid), metal substrates, such as for forming diffusion-alloyed metals (e.g., a metal alloys or metal alloy hybrid) (e.g., in any configuration, such as in coils), and methods related thereto, such as methods of manufacturing or otherwise preparing such compositions and methods. In some embodiments, the metal material provided herein comprises a metal substrate, such as described herein. In certain embodiments, the metal material is a diffusion alloyed metal material, comprising a metal substrate (or core) and a metal alloy surface (e.g., metallurgically bound to the substrate (or core)). In some instances, the metal alloy surface covers all or part of at least one surface of the metal material. In specific embodiments, such a metal material or metal alloy material (e.g., diffusion-alloyed metal) is configured in the form of a coil. The present disclosure provides, in various embodiments herein, metal compositions (e.g., a steel composition), compositions (e.g., metal substrate compositions) comprising the same, metal objects (e.g., steel sheet) comprising the same, and methods for preparing the same. [0073] In some embodiments, the metal composition can comprise an elemental weight percent of any two or more (e.g., three or more, four or more, five or more, six or more, seven or more, or all eight) of (i)- (viii) (e.g., as determined by instrumental gas analysis (IGA) or glow discharge mass spectrometry (GDMS)): (i) about 0.001 wt. % to about 0.6 wt. % aluminum (Al); (ii) about 0.001 wt. % to about 0.3 wt. % (e.g., about 0.001 wt. % to about 0.1 wt. %, or about 0.005 wt. % to about 0.02 wt. %) titanium (Ti); (iii) about 0.5 wt. % to about 3 wt. % (e.g., about 1.0 wt. % to about 2.5 wt. %) manganese (Mn); (iv) about 0.2 wt. % or less (e.g., about 0.01 wt. % to about 0.2 wt. %, such as about 0.1 wt. % to about 0.2 wt. %) (or at least about 0.08 wt. %) niobium (Nb); (v) about 0.01 wt. % or less (e.g., about 0.005 wt. % or less, about 0.004 wt. % or less, or about 0.002 wt. %) carbon (C); (vi) about 0.001 wt. % to about 0.02 wt. % (e.g., about 0.005 wt. % to about 0.015 wt. %, about 0.008 wt. % to about 0.015 wt. %, or about 0.005 wt. % to about 0.01 wt. %) nitrogen (N); (vii) about 0.02 wt. % or less (e.g., about 0.008 wt. % to about 0.02 wt. %) phosphorus (P); and (viii) about 0.01 wt. % or less (e.g., about 0.005 wt. % to about 0.01 wt. %) sulfur (S). [0074] In some embodiments, the method for preparing the metal (e.g., steel) composition (e.g., for subsequent diffusion alloying). The method may comprise (a) providing a metal composition as described herein; and (b) subjecting the metal composition to conditions sufficient to form the steel composition, which steel composition comprises grains having an average American Society for Testing and Materials (ASTM) grain size of about 7 or less (e.g., as determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., E112)) (e.g., determined by scanning electron microscopy (SEM) or optical microscopy (OM)) [0075] In some embodiments, the composition (e.g., substrate composition) or metal object (e.g., steel sheet) comprising the metal composition can comprise a slurry. The slurry can comprise an alloying element and at least partially covering at least a surface of the object (e.g., the steel sheet). [0076] The present disclosure also provides, in various embodiments herein, metal coils and methods for forming metal coil(s). [0077] In some embodiments, the method forming metal coil comprises: (a) contacting (or coating) a metal substrate (such as described herein) (e.g., a surface thereof) with a slurry composition to provide a coated metal substrate; and (b) winding (e.g., coiling, bending, flexing, or rewinding) the coated metal substrate at a winding (e.g., coiling, bending, flexing, or rewinding) temperature to form a metal coil (e.g., a spiral metal coil). The coated metal substrate can comprise a slurry coating (e.g., film) in contact with and at least partially covering a surface of the metal substrate. The slurry composition and coating (e.g., independently) can comprise an alloying agent (e.g., element) (e.g., and, a metal oxide (e.g., an inert metal oxide) and/or a metal transport activator). The metal coil can comprise a plurality of (e.g., coiled) metal wraps with the slurry coating being configured (e.g., in wrap spacing(s)) between a plurality of (e.g., coil) wraps. [0078] In some embodiments, the metal coil (e.g., a spiral metal coil) wound in a plurality of metal wraps. The metal coil can comprise a plurality of metal wraps with a slurry coating composition (e.g., a diffusion alloying composition) being configured in a wrap-to-wrap spacing (e.g., an average wrap-to-wrap spacing) between a plurality of (e.g., coil) wraps thereof. The slurry coating composition can be provided at an average dry film thickness. The slurry coating composition can comprise an alloying agent (e.g., element) (e.g., and, a metal oxide (e.g., an inert metal oxide) and/or a metal transport activator). The alloying agent can be capable of diffusion into and alloying with two neighboring metal wraps of the plurality of metal wraps. [0079] In some embodiments, the metal coil (e.g., a spiral metal coil) wound in a plurality of metal wraps. The metal coil can comprise a first metal wrap, a neighboring second metal wrap thereof, and a slurry coating composition (e.g., a diffusion alloying composition) provided between the first and second metal wraps. The slurry coating composition can be provided at an average dry film thickness. The first metal wrap can comprise a first side surface facing towards the second metal wrap. The second metal wrap can comprise a second side surface facing towards the first metal wrap. The slurry coating composition can comprise an alloying agent (e.g., element). The alloying element can be capable of diffusion into and alloying with the first and second metal wraps to form (i) a first diffusion layer metallurgically bonded to at least a portion of the first metal wrap and (ii) a second diffusion layer metallurgically bonded to at least a portion of the second metal wrap. [0080] The present disclosure further provides, in various embodiments herein, metal materials (e.g., alloy, such as steel alloy) comprising a surface layer (e.g., an alloy, such as a steel alloy) metallurgically bonded with a substrate (e.g., through a metal diffusion layer), which substrate comprises a metal composition described herein. The metal material can be produced according to a method provided herein. [0081] In some embodiments, the metal material can comprise a metal diffusion layer metallurgically bonded with a core layer, wherein the metal diffusion layer comprises a diffusion frontier boundary formed proximate thereto with the core layer. The metal material can be characterized by at least two, at least three, at least four, or all five of (i)-(v): (i) a yield of about 19 kilopounds per square inch (ksi) (i.e., 1 ksi = 6.8947572932 megapascal (MPa)) to about 29 ksi (e.g., about 26 ksi to about 29 ksi); (ii) a tensile strength of about 42 kilopounds per square inch (ksi) (i.e., 1 ksi = 6.8947572932 megapascal (MPa)) to about 65 ksi (e.g., about 47 ksi to about 56 ksi, about 52 ksi to about 56 ksi); (iii) an elongation of about 32% to about 44% (e.g., about 32% to about 38%); (iv) an n-value of about 0.21 to about 0.32 (e.g., about 0.29 to about 0.32) (e.g., as determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., E8, E18, E19, or a combination thereof)); and (v) an r-value of about 1.8 to about 3.0 (e.g., as determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., E8, E18, E19, or a combination thereof)). At least about 80% (e.g., at least about 85%, 90%, 95%, or 99%) grains by volume of the metal diffusion layer can be columnar grains (e.g., at a temperature of about 1 degree Celsius (°C) to about 50 °C (e.g., 5 °C to about 45 °C, or 10 °C to about 40 °C). At least about 80% (e.g., at least about 85%, 90%, 95%, or 99%) grains by volume of the core layer can be equiaxed grains (e.g., having an average American Society for Testing and Materials (ASTM) grain size of about 7 or less (e.g., at a temperature of about 750 degree Celsius (°C) to about 1100 °C). [0082] In some embodiments, the metal material can further comprise a surface layer metallurgically bonded with the substrate through the metal diffusion layer, which metal diffusion layer comprises the diffusion frontier boundary proximate thereto formed within the substrate. The surface layer can comprise chromium (Cr) at a concentration of about 30 wt % to about 45 wt % that can vary by less than about 10 wt % across a surface of the surface layer (e.g., as determined by scanning electron microscopy-energy dispersive X-Ray spectroscopy (SEM-EDS), X-ray fluorescence (XRF), or glow discharge mass spectrometry (GDMS)); and the metal diffusion layer can comprise chromium (Cr) at a concentration of about 12 wt % to about 45 wt % (e.g., about 20 wt % to about 45 wt %, about 25 wt % to about 45 wt %, or about 30 wt % to about 45 wt %) that can vary by less than about 5 wt % along a direction from the surface layer towards the diffusion frontier boundary (e.g., as determined by scanning electron microscopy- energy dispersive X-Ray spectroscopy (SEM-EDS), X-ray fluorescence (XRF), or glow discharge mass spectrometry (GDMS)). Metal Composition and Methods Related Thereto [0083] In one aspect, provided herein is a metal composition of the substrate described hereinbelow in the section “substrate” or anywhere else herein. In some embodiments, the metal composition can be, for example, a steel composition. The compositions described herein can be prepared by a method described hereinbelow in section “substrate preparation” or anywhere else herein. [0084] The metal composition such as the steel composition may comprise any one or more desired elements. In some embodiments, the metal composition may comprise any two or more of the elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises any three or more of the elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises any four or more of the elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises any five or more of the elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises any six or more of the elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises any seven or more of the elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises all eight elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). [0085] In some embodiments, the metal composition such as the steel composition may comprises eight or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises seven or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises six or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises five or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises four or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises three or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition such as the steel composition may comprises two or fewer elements selecting from the group consisting of aluminum (Al), titanium (Ti), manganese (Mn), manganese (Mn), niobium (Nb), carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). [0086] In some embodiments, the metal composition comprises at least two, at least three or all four of aluminum (Al), titanium (Ti), manganese (Mn) and niobium (Nb). For example, the metal composition may comprise aluminum (Al) and titanium (Ti), aluminum (Al) and manganese (Mn), aluminum (Al) and niobium (Nb), titanium (Ti) and manganese (Mn), titanium (Ti) and niobium (Nb), or manganese (Mn) and niobium (Nb). In some embodiments, the metal composition may comprise aluminum (Al), titanium (Ti) and manganese (Mn); aluminum (Al), titanium (Ti) and niobium (Nb); aluminum (Al), manganese (Mn) and niobium (Nb); or titanium (Ti), manganese (Mn) and niobium (Nb). In some embodiments, the metal composition comprises aluminum (Al), titanium (Ti), manganese (Mn) and niobium (Nb). [0087] In some embodiments, the metal composition comprises at least two, at least three or all four of carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). For example, the metal composition may comprise carbon (C) and nitrogen (N), carbon (C) and phosphorus (P), carbon (C) and sulfur (S), nitrogen (N) and phosphorus (P), nitrogen (N) and sulfur (S), or phosphorus (P) and sulfur (S). In some embodiments, the metal composition may comprise carbon (C), nitrogen (N), and phosphorus (P); carbon (C), nitrogen (N), and sulfur (S); carbon (C); phosphorus (P) and sulfur (S) or nitrogen (N), phosphorus (P) and sulfur (S). In some embodiments, the metal composition comprises carbon (C), nitrogen (N), phosphorus (P) and sulfur (S). [0088] In some embodiments, the metal composition may comprise carbon (C), aluminum (Al), niobium (Nb), titanium (Ti), manganese (Mn), phosphor (P), sulfur (S), and nitrogen (N). [0089] The element can be present in any suitable elemental weight percent in the metal composition. The elemental weight percent can be determined through any suitable method known in the art, for example by instrumental gas analysis (IGA) or glow discharge mass spectrometry (GDMS). [0090] In some embodiments, the metal composition comprises aluminum (Al), and the elemental weight percent of the aluminum (Al) is about 0.001 wt. % to about 0.6 wt. %, about 0.001 wt. % to about 0.01 wt. %. about 0.01 wt. % to about 0.1 wt. %, about 0.1 wt. % to about 0.6 wt. %, about 0.005 wt. % to about 0.05 wt. % or about 0.05 wt. % to about 0.5 wt. %. In some embodiments, the metal composition comprises aluminum (Al), and the elemental weight percent of the aluminum (Al) is about 0.001 wt. %, 0.005 wt. %, 0.01 wt. %, 0.05 wt. %, 0.1 wt. %, 0.5 wt. %, 0.6 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the metal composition comprises aluminum (Al), and the elemental weight percent of the aluminum (Al) is at least about 0.001 wt. %, 0.005 wt. %, 0.01 wt. %, 0.05 wt. %, 0.1 wt. %, 0.5 wt. %, or 0.6 wt. %. In some embodiments, the metal composition comprises aluminum (Al), and the elemental weight percent of the aluminum (Al) is at most about 0.001 wt. %, 0.005 wt. %, 0.01 wt. %, 0.05 wt. %, 0.1 wt. %, 0.5 wt. % or 0.6 wt. %. [0091] In some embodiments, the metal composition comprises titanium (Ti), and the elemental weight percent of the titanium (Ti) is about 0.001 wt. % to about 0.3 wt. %, about 0.001 wt. % to about 0.01 wt. %, about 0.001 wt. % to about 0.1 wt. %, about 0.01 wt. % to about 0.1 wt. %, or about 0.005 wt. % to about 0.02 wt. %. about 0.05 wt. % to about 0.02 wt. %, about 0.05 wt. % to about 0.1 wt. %, or about 0.005 wt. % to about 0.3 wt. %. In some embodiments, the metal composition comprises titanium (Ti), and the elemental weight percent of the titanium (Ti) is about 0.001 wt. %, 0.005 wt. %, 0.01 wt. %, 0.02 wt. %, 0.05 wt. %, 0.1 wt. %, 0.2 wt. %, 0.3 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the metal composition comprises titanium (Ti), and the elemental weight percent of the titanium (Ti) is at least about 0.001 wt. %, 0.005 wt. %, 0.01 wt. %, 0.02 wt. %, 0.05 wt. %, 0.1 wt. %, 0.2 wt. %, or 0.3 wt. %. In some embodiments, the metal composition comprises titanium (Ti), and the elemental weight percent of the titanium (Ti) is at most about 0.001 wt. %, 0.005 wt. %, 0.01 wt. %, 0.02 wt. %, 0.05 wt. %, 0.1 wt. %, 0.2 wt. %, or 0.3 wt. %. [0092] In some embodiments, the metal composition comprises manganese (Mn), and the elemental weight percent of the manganese (Mn) is about 0.5 wt. % to about 3 wt. %, 0.5 wt. % to about 1 wt. %, 1 wt. % to about 2 wt. %, about 1 wt. % to about 2.5 wt. %, or about 2.5 wt. % to about 3 wt. %. In some embodiments, the metal composition comprises manganese (Mn), and the elemental weight percent of the manganese (Mn) is about 0.5 wt. %, 1 wt. %, 1.5 wt. %, 2 wt. %, 2.5 wt. %, 3 wt. %, or a range (inclusive) between any two of the foregoing values. %. In some embodiments, the metal composition comprises manganese (Mn), and the elemental weight percent of the manganese (Mn) is at least bout 0.5 wt. %, 1 wt. %, 1.5 wt. %, 2 wt. %, 2.5 wt. % or 3 wt. %. In some embodiments, the metal composition comprises manganese (Mn), and the elemental weight percent of the manganese (Mn) is at most about 0.5 wt. %, 1 wt. %, 1.5 wt. %, 2 wt. %, 2.5 wt. % or 3 wt. %. [0093] In some embodiments, the metal composition comprises niobium (Nb), and the elemental weight percent of the niobium (Nb) is about 0.2 wt. % or less, about 0.1 wt. % or less, about 0.08 wt. % or less or about 0.05 wt. % or less. For example, the elemental weight percent of the niobium (Nb) can be about 0.01 wt. % to about 0.2 wt. %, 0.01 wt. % to about 0.05 wt. %, 0.05 wt. % to about 0.08 wt. %, 0.05 wt. % to about 0.2 wt. %, or 0.1 wt. % to about 0.2 wt. %. In some embodiments, the metal composition comprises niobium (Nb), and the elemental weight percent of the niobium (Nb) is about 0.01 wt. %, 0.05 wt. %,0.08 wt. %,0.08 wt. %,0.2 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the metal composition comprises niobium (Nb), and the elemental weight percent of the niobium (Nb) is at least about 0.01 wt. %, 0.05 wt. %,0.08 wt. %,0.08 wt. %, or 0.2 wt. %. In some embodiments, the metal composition comprises niobium (Nb), and the elemental weight percent of the niobium (Nb) is at most about 0.01 wt. %, 0.05 wt. %,0.08 wt. %,0.08 wt. %, or 0.2 wt. %. [0094] In some embodiments, the metal composition comprises carbon (C), and the elemental weight percent of the carbon (C) is about 0.01 wt. % or less, about 0.005 wt. % or less, about 0.004 wt. % or less, or about 0.002 wt. % or less). For example, the elemental weight percent of the carbon (C) can be about 0.001 wt. % to about 0.002 wt. %, about 0.002 wt. % to about 0.004 wt. %, about 0.004 wt. % to about 0.005 wt. %, or about 0.005 wt. % to about 0.01 wt. %. In some embodiments, the metal composition comprises carbon (C), and the elemental weight percent of the carbon (C) is about 0.001 wt. %, 0.002 wt. %, 0.004 wt. %, 0.005 wt. %, 0.01 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the metal composition comprises carbon (C), and the elemental weight percent of the carbon (C) is at least about 0.001 wt. %, 0.002 wt. %, 0.004 wt. %, 0.005 wt. %, or 0.01 wt. %. In some embodiments, the metal composition comprises carbon (C), and the elemental weight percent of the carbon (C) is at most about 0.001 wt. %, 0.002 wt. %, 0.004 wt. %, 0.005 wt. %, or 0.01 wt. %. [0095] In some embodiments, the metal composition comprises nitrogen (N), and the elemental weight percent of the nitrogen (N) is about 0.001 wt. % to about 0.02 wt. %, about 0.005 wt. % to about 0.015 wt. %, about 0.008 wt. % to about 0.015 wt. %, or about 0.005 wt. % to about 0.01 wt. %, or about 0.01 wt. % to about 0.02 wt. %. In some embodiments, the metal composition comprises nitrogen (N), and the elemental weight percent of the nitrogen (N) is about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, 0.015 wt. %, 0.02 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the metal composition comprises nitrogen (N), and the elemental weight percent of the nitrogen (N) is at least about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, 0.015 wt. %, or 0.02 wt. %. In some embodiments, the metal composition comprises nitrogen (N), and the elemental weight percent of the nitrogen (N) is at most about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, 0.015 wt. %, or 0.02 wt. %. [0096] In some embodiments, the metal composition comprises phosphorus (P), and the elemental weight percent of the phosphorus (P) is about 0.02 wt. % or less, 0.01 wt. % or less, 0.008 wt. % or less, 0.005 wt. % or less, or 0.001 wt. % or less. For example, the elemental weight percent of the phosphorus (P) can be about 0.001 wt. % to about 0.005 wt. %, 0.005 wt. % to about 0.008 wt. %, or about 0.008 wt. % to about 0.02 wt. %. In some embodiments, the elemental weight percent of the phosphorus (P) is about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, 0.02 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the elemental weight percent of the phosphorus (P) is at least about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, 0.02 wt. %. In some embodiments, the elemental weight percent of the phosphorus (P) is at most about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, 0.02 wt. %. [0097] In some embodiments, the metal composition comprises sulfur (S), and the elemental weight percent of the sulfur (S) is about 0.01 wt. % or less, 0.008 wt. % or less, 0.005 wt. % or less, or 0.001 wt. % or less. For example, he elemental weight percent of the sulfur (S) can be about 0.001 wt. % to about 0.005 wt. %, 0.005 wt. % to about 0.008 wt. %, or 0.005 wt. % to about 0.01 wt. %. In some embodiments, the metal composition comprises sulfur (S), and the elemental weight percent of the sulfur (S) is about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %, or a range (inclusive) between any two of the foregoing values. In some embodiments, the metal composition comprises sulfur (S), and the elemental weight percent of the sulfur (S) is at least about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %. In some embodiments, the metal composition comprises sulfur (S), and the elemental weight percent of the sulfur (S) is at most about 0.001 wt. %, 0.005 wt. %, 0.008 wt. %, 0.01 wt. %. [0098] In some embodiments, the metal composition may comprise one or more additional elements. The additional elements can be any suitable elements that can be used for the metal composition described herein. In some embodiments, one or more additional elements can be selected from the group consisting of chromium (Cr), vanadium (V), silicon (Si), boron (B), copper (Cu), nickel (Ni), molybdenum (Mo) and tin (Sn). [0099] In some embodiments, the metal composition may comprise carbon (C), aluminum (Al), niobium (Nb), titanium (Ti), manganese (Mn), phosphor (P), sulfur (S), chromium (Cr), nitrogen (N) and vanadium (V). [00100] In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of about 0.02% to about 0.04%, about 0.02 to about 0.03%, about 0.03% to about 0.04%, about 0.001% to about 0.005%, about 0.001% to about 0.002%, about 0.002% to about 0.004%, about 0.003% to about 0.005%, about 0.004% to about 0.005%, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of about 0.001%, 0.002%, 0.003%, 0.004%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of at least about 0.001%, 0.002%, 0.003%, 0.004%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%, or 0.05%, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of at most about 0.001%, 0.002%, 0.003%, 0.004%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%, or 0.05%, by weight of the metal composition. [00101] In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of about 0.02% to about 0.06%, about 0.03% to about 0.05%, about 0.04% or about 0.06%, about 0.001% to about 0.01%, about 0.001% to about 0.005%, about 0.005 to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of about 0.001%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of at least about 0.001%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, or 0.06%, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of at most about 0.001%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, or 0.06%, by weight of the metal composition. [00102] In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of about 0.2% or less, about 0.15% or less, about 0.1% or less, about 0.05% or less, about 0.01% or less, or about 0.005% or less, by weight of the metal composition. In some embodiments, the niobium (Nb) may have a concentration of about 0.08% to about 0.15%, about 0.08% to about 0.1%, or 0.1% to about 0.15%, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of about 0.005%, 0.01%, 0.05%, 0.08%, 0.1%, 0.15%, 0.2%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of at least about 0.005%, 0.01%, 0.05%, 0.08%, 0.1%, 0.15%, or 0.2%, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of at most about 0.005%, 0.01%, 0.05%, 0.08%, 0.1%, 0.15%, or 0.2%, by weight of the metal composition. [00103] In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) titanium (Ti) has a concentration of about 0.2% to about 0.3%, about 0.1% to about 0.2%, about 0.05% to about 0.1%, about 0.02% to about 0.05%, or about 0.01% to about 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) titanium (Ti) has a concentration of about 0.01%, 0.02%, 0.05%, 0.1%, 0.2%, 0.3%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) titanium (Ti) has a concentration of at least about 0.01%, 0.02%, 0.05%, 0.1%, 0.2%, or 0.3%, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) titanium (Ti) has a concentration of at most about 0.01%, 0.02%, 0.05%, 0.1%, 0.2%, or 0.3%, by weight of the metal composition. [00104] In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of about 0.6% to about 0.73%, about 0.7% to about 0.8%, about 0.8% to about 1%, about 1% to about 1.2%, or about 1.2% to about 1.4%, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of about 0.6%, 0.73%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of at least about 0.6%, 0.73%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, or 1.4%, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of at most about 0.6%, 0.73%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, or 1.4%, by weight of the metal composition. [00105] In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of about 0.008% to about 0.015%, about 0.005% to about 0.008%, about 0.008% to about 0.01%, about 0.01% to about 0.015%, about 0.015% to about 0.02%, or about 0.005% to about 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of about 0.005%, about 0.008%, about 0.01%, about 0.015%, about 0.02%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of at least about 0.005%, about 0.008%, about 0.01%, about 0.015%, or about 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of at most about 0.005%, about 0.008%, about 0.01%, about 0.015%, or about 0.02%, by weight of the metal composition. [00106] In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of about 0.0005% to about 0.005%, about 0.0005% to about 0.001%, about 0.001% to about 0.005%, or about 0.005% to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of about 0.0005%, 0.001%, 0.005%, 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of at least about 0.0005%, 0.001%, 0.005%, or 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of at most about 0.0005%, 0.001%, 0.005%, or 0.01%, by weight of the metal composition. [00107] In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of about 0.01% to about 0.02%, about 0.02% to about 0.04%, about 0.03% to about 0.05%, about 0.03% to about 0.06%, or about 0.05% to about 0.06%, by weight of the metal composition. In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of about 0.01%, 0.02%,0.03%, 0.04%, 0.05%, 0.06%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of at least about 0.01%, 0.02%,0.03%, 0.04%, 0.05%, or 0.06%, by weight of the metal composition. In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of at most about 0.01%, 0.02%,0.03%, 0.04%, 0.05%, or 0.06%, by weight of the metal composition. [00108] In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of about 0.004% to about 0.01%, 0.004% to about 0.008%, about 0.008% to about 0.01%, about 0.01% to about 0.02%, or about 0.005% to about 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of about 0.004%, 0.005%, 0.008%, 0.01%, 0.02%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of at least about 0.004%, 0.005%, 0.008%, 0.01%, or 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of at most about 0.004%, 0.005%, 0.008%, 0.01%, or 0.02%, by weight of the metal composition. [00109] In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of about 0.05% or less, about 0.02% or less, about 0.01% or less, or about 0.005% or less, by weight of the metal composition. In some embodiments, the vanadium (V) has a concentration of about 0.005% to about 0.01%, 0.01% to about 0.02%, 0.005% to about 0.02%, or 0.02% to about 0.05%, by weight of the metal composition. In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of about 0.005%, 0.01%, 0.02%, 0.05%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of at least about 0.005%, 0.01%, 0.02%, or 0.05%, by weight of the metal composition. In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of at most about 0.005%, 0.01%, 0.02%, or 0.05%, by weight of the metal composition. [00110] In some embodiments, the metal composition comprises carbon (C), aluminum (Al), niobium (Nb), titanium (Ti), manganese (Mn), silicon (Si), nitrogen (N), phosphor (P), boron (B) and sulfur (S). [00111] In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of about 0.008% to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of about 0.008%, 0.009%, 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of at least about 0.008%, 0.009%, or 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of at most about 0.008%, 0.009%, or 0.01%, by weight of the metal composition. [00112] In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of about 0.005% to about 0.015%, about 0.005% to about 0.008%, 0.008% to about 0.01%, or about 0.008% to about 0.012%, or 0.012% to about 0.015%, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of about 0.005%, 0.008%, 0.01%, 0.012%, 0.012%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of at least about 0.005%, 0.008%, 0.01%, 0.012%, or 0.012%, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of at most about 0.005%, 0.008%, 0.01%, 0.012%, or 0.012%, by weight of the metal composition. [00113] In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of about 0.1% to about 0.2%, about 0.1% to about 0.15%, or about 0.15% to about 0.2%, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of about 0.1%, 0.15%, 0.2%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of at least about 0.1%, 0.15%, or 0.2%, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of at most about 0.1%, 0.15%, or 0.2%, by weight of the metal composition. [00114] In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of about 0.01% to about 0.02%, about 0.01% to about 0.15%, or 0.015% to about 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of about 0.01%, 0.15%, 0.02%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of at least about 0.01%, 0.15%, or 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of at most about 0.01%, 0.15%, or 0.02%, by weight of the metal composition. [00115] In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of about 1.5% to about 2.5%, about 1.5% to about 2%, about 2% to about 2.5%, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of about 1.5%, 2%, 2.5%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of at least about 1.5%, 2%, or 2.5%, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of at most about 1.5%, 2%, or 2.5%, by weight of the metal composition. [00116] In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of about 0.1% to about 1.0 %, about 0.1% to about 0.5%, or about 0.5% to about 1.0%, by weight of the metal composition. In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of about 0.1%, 0.5%, 1.0%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of at least about 0.1%, 0.5%, or 1.0%, by weight of the metal composition. In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of at most about 0.1%, 0.5%, or 1.0%, by weight of the metal composition. [00117] In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of about 0.005% to about 0.01%, about 0.005% to about 0.0075%, or about 0.0075% to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of about 0.005%, about 0.0075%, or 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of at least about 0.005%, about 0.0075%, or 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of at most about 0.005%, about 0.0075%, or 0.01%, by weight of the metal composition. [00118] In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of about 0.002% to about 0.01%, about 0.002% to about 0.005%, or about 0.005% to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of about 0.002%, 0.005%, 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of at least about 0.002%, 0.005%, or 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of at most about 0.002%, 0.005%, or 0.01%, by weight of the metal composition. [00119] In some embodiments, the metal composition comprises boron (B), and the boron (B) has a concentration of about 0.0001% to about 0.001%, about 0.0001% to about 0.0005%, or about 0.0005% to about 0.001%, by weight of the metal composition. In some embodiments, the metal composition comprises boron (B), and the boron (B) has a concentration of about 0.0001%, 0.0005%, 0.001%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises boron (B), and the boron (B) has a concentration of at least about 0.0001%, 0.0005%, or 0.001%, by weight of the metal composition. In some embodiments, the metal composition comprises boron (B), and the boron (B) has a concentration of at most about 0.0001%, 0.0005%, or 0.001%, by weight of the metal composition. [00120] In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of about 0.005% to about 0.01%, about 0.005% to about 0.0075%, or about 0.0075% to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of about 0.005%, 0.0075%, 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of at least about 0.005%, 0.0075%, or 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of at most about 0.005%, 0.0075%, or 0.01%, by weight of the metal composition. [00121] In some embodiments, the metal composition comprises carbon (C), aluminum (Al), niobium (Nb), titanium (Ti), manganese (Mn), phosphor (P), sulfur (S), silicon (Si), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), vanadium (V), tin (Sn) and nitrogen (N). [00122] In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of about 0.004% or less, 0.002% or less, or 0.001% or less, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of about 0.001%, 0.002%, 0.004%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of at least about 0.001%, 0.002%, or 0.004%, by weight of the metal composition. In some embodiments, the metal composition comprises carbon (C), and the carbon (C) has a concentration of at most about 0.001%, 0.002%, or 0.004%, by weight of the metal composition. [00123] In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of about 0.02% to about 0.05%, about 0.02% to about 0.03%, about 0.03% to about 0.05%by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of about 0.02%, 0.03%, 0.04%, 0.05%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of at least about 0.02%, 0.03%, 0.04%, or 0.05%, by weight of the metal composition. In some embodiments, the metal composition comprises aluminum (Al), and the aluminum (Al) has a concentration of at most about 0.02%, 0.03%, 0.04%, or 0.05%, by weight of the metal composition. [00124] In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of about 0.12% to about 0.14%, about 0.12% to about 0.13%, or 0.13% to about 0.14%, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of about 0.12%, 0.13%, 0.14%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of at least about 0.12%, 0.13%, or 0.14%, by weight of the metal composition. In some embodiments, the metal composition comprises niobium (Nb), and the niobium (Nb) has a concentration of at most about 0.12%, 0.13%, or 0.14%, by weight of the metal composition. [00125] In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of about 0.012% to about 0.02%, about 0.012% to about 0.015%, or about 0.015% to about 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of about 0.012%, 0.015%, 0.02%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of at least about 0.012%, 0.015%, or 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises titanium (Ti), and the titanium (Ti) has a concentration of at most about 0.012%, 0.015%, or 0.02%, by weight of the metal composition. [00126] In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of about 1.2% to about 1.35%, about 1.2% to about 1.25%, about 1.25% to about 1.3%, or 1.3% to about 1.35%, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of about 1.2%, 1.25%, 1.3%, 1.35%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of at least about 1.2%, 1.25%, 1.3%, or 1.35%, by weight of the metal composition. In some embodiments, the metal composition comprises manganese (Mn), and the manganese (Mn) has a concentration of at most about 1.2%, 1.25%, 1.3%, or 1.35%, by weight of the metal composition. [00127] In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of about 0.02% or less, about 0.01% or less, or about 0.005% or less, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of about 0.005%, 0.01%, 0.02%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of at least about 0.005%, 0.01%, or 0.02%, by weight of the metal composition. In some embodiments, the metal composition comprises phosphor (P), and the phosphor (P) has a concentration of at most about 0.005%, 0.01%, or 0.02%, by weight of the metal composition. [00128] In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of about 0.01% or less, about 0.005% or less, or about 0.001% or less, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of about 0.001%, 0.005%, 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of at least about 0.001%, 0.005%, 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises sulfur (S), and the sulfur (S) has a concentration of at most about 0.001%, 0.005%, 0.01%, by weight of the metal composition. [00129] In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of about 0.034% or less, about 0.02% or less, or 0.01% or less, by weight of the metal composition. In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of about 0.01%, 0.02%, 0.034%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of at least about 0.01%, 0.02%, or 0.034%, by weight of the metal composition. In some embodiments, the metal composition comprises silicon (Si), and the silicon (Si) has a concentration of at most about 0.01%, 0.02%, or 0.034%, by weight of the metal composition. [00130] In some embodiments, the metal composition comprises copper (Cu), and the copper (Cu) has a concentration of about 0.1% or less, about 0.05% or less, or about 0.01% or less, by weight of the metal composition. In some embodiments, the metal composition comprises copper (Cu), and the copper (Cu) has a concentration of about 0.01%, 0.05%, 0.1%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises copper (Cu), and the copper (Cu) has a concentration of at least about 0.01%, 0.05%, or 0.1%, by weight of the metal composition. In some embodiments, the metal composition comprises copper (Cu), and the copper (Cu) has a concentration of at most about 0.01%, 0.05%, or 0.1%, by weight of the metal composition. [00131] In some embodiments, the metal composition comprises nickel (Ni), and the nickel (Ni) has a concentration of about 0.1% or less, about 0.05% or less, or about 0.01% or less, by weight of the metal composition. In some embodiments, the metal composition comprises nickel (Ni), and the nickel (Ni) has a concentration of about 0.01%, 0.05%, 0.1%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises nickel (Ni), and the nickel (Ni) has a concentration of at least about 0.01%, 0.05%, or 0.1%, by weight of the metal composition. In some embodiments, the metal composition comprises nickel (Ni), and the nickel (Ni) has a concentration of at most about 0.01%, 0.05%, or 0.1%, by weight of the metal composition. [00132] In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of about 0.1% or less, about 0.05% or less, or about 0.01% or less, by weight of the metal composition. In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of about 0.01%, 0.05%, 0.1%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of at least about 0.01%, 0.05%, or 0.1%, by weight of the metal composition. In some embodiments, the metal composition comprises chromium (Cr), and the chromium (Cr) has a concentration of at most about 0.01%, 0.05%, or 0.1%, by weight of the metal composition. [00133] In some embodiments, the metal composition comprises molybdenum (Mo), and the molybdenum (Mo) has a concentration of about 0.03% or less, about 0.01% or less, or about 0.001% or less, by weight of the metal composition. In some embodiments, the metal composition comprises molybdenum (Mo), and the molybdenum (Mo) has a concentration of about 0.001%, 0.01%, 0.03%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises molybdenum (Mo), and the molybdenum (Mo) has a concentration of at least about 0.001%, 0.01%, or 0.03%, by weight of the metal composition. In some embodiments, the metal composition comprises molybdenum (Mo), and the molybdenum (Mo) has a concentration of at most about 0.001%, 0.01%, or 0.03%, by weight of the metal composition. [00134] In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of about 0.008% or less, about 0.005% or less, or about 0.001% or less, by weight of the metal composition. In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of about 0.001%, 0.005%, 0.008%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of at least about 0.001%, 0.005%, or 0.008%, by weight of the metal composition. In some embodiments, the metal composition comprises vanadium (V), and the vanadium (V) has a concentration of at most about 0.001%, 0.005%, or 0.008%, by weight of the metal composition. [00135] In some embodiments, the metal composition comprises tin (Sn), and the tin (Sn) has a concentration of about 0.03% or less, about 0.01% or less, or about 0.005% or less, by weight of the metal composition. In some embodiments, the metal composition comprises tin (Sn), and the tin (Sn) has a concentration of about 0.005%, 0.01%, 0.03%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises tin (Sn), and the tin (Sn) has a concentration of at least about 0.005%, 0.01%, or 0.03%, by weight of the metal composition. In some embodiments, the metal composition comprises tin (Sn), and the tin (Sn) has a concentration of at most about 0.005%, 0.01%, or 0.03%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of about 0.005% to about 0.01%, about 0.005% to about 0.0075%, or about 0.0075% to about 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of about 0.005%, 0.0075%, 0.01%, or a range (inclusive) between any two of the foregoing values, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of at least about 0.005%, 0.0075%, or 0.01%, by weight of the metal composition. In some embodiments, the metal composition comprises nitrogen (N), and the nitrogen (N) has a concentration of at most about 0.005%, 0.0075%, or 0.01%, by weight of the metal composition. [00136] In some embodiments, the metal composition described above comprises grains. In some embodiments, the grains are equiaxed grains. The size of the grains can be determined by any suitable methods known in the art, for example, by American Society for Testing and Materials (ASTM) standard method, scanning electron microscopy (SEM) or optical microscopy (OM), at any suitable temperature. In some embodiments, the size of the grains can be determined at a temperature of about 1 degree Celsius (°C) to about 50 °C, for example, of about 5 °C to about 45 °C, or of about 10 °C to about 40 °C. In some embodiment, the grains may have an average grain size of about 7 or less, about 6 or less, about 5 or less, about 4 or less, about 3 or less, about 2 or less, or about 1 or less, as determined by American Society for Testing and Materials (ASTM) standard method (e.g., E112). [00137] In some embodiments of the metal composition, at least about 50 wt %, 60 wt %, 70 wt %, 80 wt %, 90 wt %, or 95 wt % of an element of the metal composition, for example, in interstices between grains, is capable of transport out of the metal composition in a form of halide such as chloride at an alloying temperature in an alloying atmosphere. The element of the metal composition capable of transport out of the metal composition can be, for example, iron (Fe), titanium (Ti), or manganese (Mn). In some embodiments, the alloying temperature can be any temperature suitable for the diffusion alloying. In some embodiments, the alloying temperature can be about 750 degree Celsius (°C) to about 1100 °C. In some embodiments, the alloying atmosphere can be any environment suitable for the diffusion alloying. In some embodiments, the alloying atmosphere comprises a reducing gas, such as hydrogen. [00138] In some embodiments, the metal composition is configured for metallurgic bonding with an alloying agent, for example, by diffusion alloying at an alloying temperature in an alloying atmosphere. In some embodiments, the alloying temperature can be any temperature suitable for the diffusion alloying. In some embodiments, the alloying temperature can be about 750 degree Celsius (°C) to about 1100 °C. In some embodiments, the alloying atmosphere can be any environment suitable for the diffusion alloying. In some embodiments, the alloying atmosphere comprises a reducing gas, such as hydrogen. In some embodiments, the alloying agent can be any material, composition, or alloy suitable for the diffusion alloying. In some embodiments, the alloying agent comprises an elemental species selected from the group consisting of iron (Fe), chromium (Cr), nickel (Ni), silicon (Si), vanadium (V), titanium (Ti), boron (B), tungsten (W), aluminum (Al), molybdenum (Mo), cobalt (Co), manganese (Mn), zirconium (Zr), copper (Cu), niobium (Nb), tantalum (Ta), cerium (Ce), bismuth (Bi), antimony (Sb), tin (Sn), lead (Pb), and combinations thereof. [00139] In some embodiments, an amount of carbide in the metal composition remains substantially the same throughout a diffusion alloying process. In some embodiment, an amount of carbide or an amount of grain pins in the metal composition remains substantially the same throughout a diffusion alloying process. In some embodiments, the metal composition has undergone a ferrite-to-austenite transition. [00140] In some embodiments, during the diffusion alloying, grains of the metal composition vary, for example grow, less in size than corresponding grains of a reference metal composition. The reference metal composition can be, for example, stainless steel 439 (439 SS), stainless steel 304L (304L SS), stainless steel DDS, and the like. [00141] The metal composition described above can be used to prepare any desired metal object as need. For example, the metal composition can be used to prepare a metal sheet, a metal coil, a metal strip, a metal pipe, a metal tube, a metal wire or any metal object known in the art. In some embodiments, the metal composition described above can be used to prepare a substrate of the metal object. [00142] In some embodiments, the metal object prepared by the metal composition descried above comprises a surface having an average roughness of no more than 55 micro-inches (µin), no more than 40 µin, no more than 35 µin, no more than 30 µin, no more than 25 µin, no more than 20 µin, no more than 15 µin, no more than 10 µin, no more than 5 µin, no more than 3 µin, no more than 2 µin, or no more than 1 µin, as determined according to an American Society for Testing and Materials (ASTM) standard method. [00143] I-Units is an exacting quantitative flatness measurement. It is a dimensionless number that incorporates both the height (H) and peak to peak length (L, or P in the diagram below) of a repeating wave. According to American Society for Testing and Materials (ASTM) standard method, the formula for I-Units is as follows: I = [(3.1415 x H)/2L] ² x 10 ⁵ . In some embodiments, the metal object prepared by the metal composition descried above is characterized by an I-unit value of no more than 50, no more than 40, no more than 30, no more than about 20, no more than about 10, no more than about 5, no more than 3, or no more than 1, as determined according to an American Society for Testing and Materials (ASTM) standard method. [00144] The plastic strain ratio r is a parameter that indicates the ability of a sheet metal to resist thinning or thickening when subjected to either tensile or compressive forces in the plane of the sheet. This resistance to thinning or thickening contributes to the forming of shapes, such as cylindrical flat- bottom cups. In some embodiments, the metal composition or metal object exhibits a plastic strain ratio exceeding about 1.8, 1.9, or 2.0, at a temperature of about 1 degree Celsius (°C) to about 50 °C (for example, about 5 °C to about 45 °C, or about 10 °C to about 40 °C), as determined according to an American Society for Testing and Materials (ASTM) standard method. [00145] R-value may be defined as the ratio of plastic strain in the plane of a sheet to the plastic strain of the gauge or thickness of the sheet. The r-value may be calculated as: [00146] wherein R0, R45 and R90 are the plastic strain ratio relative to the direction of the sheet. The r- value and/or n-value of a metal material (e.g., a steel) may be altered by the manipulation of the metal material chemistry and composition to create a highly formable metal material. A common, interstitial- free steel may have an r-value between about 1.4 and 1.8. An r-value may be determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., E8, E18, E19, or a combination thereof). [00147] In some embodiments, the metal composition or metal object exhibits an r-value of at least about 1.2, 1.4, or 1.7 at a temperature of about 1 degree Celsius (°C) to about 50 °C (for example, about 5 °C to about 45 °C, or about 10 °C to about 40 °C, as determined by American Society for Testing and Materials (ASTM) standard method). In some embodiments, the metal composition or metal object exhibits an r-value of at most about 3.0, 2.5, or 2.0 at a temperature of about 1 degree Celsius (°C) to about 50 °C (for example, about 5 °C to about 45 °C, or about 10 °C to about 40 °C, as determined by American Society for Testing and Materials (ASTM) standard method). [00148] Also provided herein is a method for preparing a composition (for example, steel) comprising: (a) providing a metal composition as described above, (b) subjecting the metal composition to conditions sufficient to form the steel composition, which steel composition comprises grains having an average grain size of about 7 or less as determined according to American Society for Testing and Materials (ASTM)standard method (e.g., E112)), by scanning electron microscopy (SEM) or optical microscopy (OM)). In some embodiments of the method, the prepared composition (for example, steel) can be used for subsequent diffusion alloying. [00149] In some embodiments of the method for preparing the composition, step (b) comprises quenching the metal composition from a finish temperature to a quenching temperature. In some embodiments, the finish temperature can be about 250 °C to about 350 °C, about 250 °C to about 300 °C, or about 300 °C to about 350 °C. In some embodiments, the quenching temperature can be about 400 °C to about 700 °C, about 400 °C to about 500 °C, or about 500 °C to about 700 °C. [00150] In some embodiments of the method for preparing the composition, step (b) comprises mechanically reducing at least one dimension of the metal composition at a mechanical reduction temperature for a mechanical reduction duration. In some embodiments, step (b) comprises mechanically reducing average thickness of the metal composition. In some embodiments, the mechanical reduction temperature can be about 10 °C to about 200 °C, about 10 °C to about 50 °C, about 50 °C to about 100 °C, or about 100 °C to about 200 °C. In some embodiments, the mechanical reduction duration can be about about 1 second to about 24 hours, about 1 second to about 1 minute, about 1 minute to about 1 hour, or about 1 hour to about 24 hours. [00151] In some embodiments of the method for preparing the composition, the mechanical reduction is a process selected from the group consisting of stretch forming, tension level, thermal flattening, draw forming, re-striking, crash forming, spin forming, roll forming, hydro-forming, CNC forming, flanging, crimping, hemming, hot stamping, extrusion, and a combination thereof. [00152] In some embodiments of the method for preparing the composition, after step (b), the composition is characterized by one or more of the following: (I) interstitial segregation of the composition is reduced relative to that of the metal composition of (a); (II) interstitial stability of the steel composition is enhanced relative to that of the metal composition of (a); (III) grains of the steel composition vary (e.g., grow) less in size relative to that of the metal composition of (a) at an identical temperature; and (IV) an average American Society for Testing and Materials (ASTM) grain size (e.g., of austenitic grains) of the steel composition is decreased relative to that of the metal composition of (a). [00153] Also provided herein is a substrate comprising the metal composition described above in the “metal composition” section and anywhere else herein, and a method for contacting (or coating) a metal substrate (e.g., a surface thereof) with a slurry composition to provide a coated metal substrate such as a coated metal coil. Such substrates can include, for example, one or more of the following elements: carbon, manganese, silicon, vanadium, titanium, nickel, chromium, molybdenum, boron, and niobium. [00154] A substrate may comprise an elemental species that is a transition metal, a nonmetal element, a metal oxide, a reducing metal element, a metal halide, an activator, a metalloid, or a combination thereof (e.g., a plurality of elemental metals). A substrate may comprise a transition metal. A substrate may comprise a nonmetal element. A substrate may comprise a metalloid. A substrate may comprise an elemental species selected from, for example, chromium, nickel, aluminum, silicon, vanadium, titanium, boron, tungsten, molybdenum, cobalt, manganese, zirconium, niobium, carbon, nitrogen, sulfur, oxygen, phosphorus, copper, tin, calcium, arsenic, lead, antimony, tantalum, zinc, or any combination thereof. A substrate may comprise an elemental species that is configured to be a reducing metal agent. A reducing metal agent may comprise aluminum, titanium, zirconium, silicon, or magnesium. [00155] A substrate may comprise metal such as iron, copper, aluminum, or any combination thereof. The substrate may comprise an alloy of metals and/or non-metals. The alloy may comprise impurities. The substrate may comprise steel. The substrate may be a steel substrate. The substrate may comprise ceramic. The substrate may be devoid of free carbon. The substrate can be made from melt phase. The substrate may be in a cold reduced state, in a full hard state (e.g., not subjected to an annealing step after cold reduction), or in a hot rolled pickled state. [00156] A metal substrate may comprise a metal transport activator component. The metal transport activator may comprise about 0.001 wt%, 0.01 wt%, 0.1 wt%, 0.5 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or about 50 wt% of the total substrate. The metal transport activator may comprise at least about 0.001 wt%, 0.01 wt%, 0.1 wt%, 0.5 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or at least about 50 wt% or more of the total substrate. The metal transport activator may comprise no more than about 50 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 5 wt%, 4 wt%, 3 wt%, 2 wt%, 1 wt%, 0.5 wt%, 0.1 wt%, 0.01 wt%, or no more than about 0.001 wt% or less of the total substrate. The metal transport activator may comprise about 0.001 to 1 wt%, about 0.001 to 2 wt%, about 0.001 to 3 wt%, about 0.001 to 4 wt%, about 0.001 to 5 wt%, about 0.001 to 10 wt%, about 0.001 to 15 wt%, about 0.001 to 20 wt%, about 0.001 to 30 wt%, about 0.001 to 50 wt%, about 0.01 to 1 wt%, about 0.01 to 2 wt%, about 0.01 to 3 wt%, about 0.01 to 4 wt%, about 0.01 to 10 wt%, about 0.01 to 15 wt%, about 0.01 to 20 wt%, about 0.01 to 30 wt%, about 0.01 to 50 wt%, about 0.1 to 1 wt%, about 0.1 to 2 wt%, about 0.1 to 3 wt%, about 0.1 to 4 wt%, about 0.1 to 5 wt%, about 0.1 to 10 wt%, about 0.1 to 15 wt%, about 0.1 to 20 wt%, about 0.1 to 30 wt%, about 0.1 to 50 wt%, about 1.0 to 2 wt%, about 1.0 to 3 wt%, about 1.0 to 4 wt%, about 1.0 to 10 wt%, about 1.0 to 15 wt%, about 1.0 to 20 wt%, about 1.0 to 30 wt%, about 1.0 to 50 wt%, or about 10 to 50 wt% of the total substrate. [00157] A substrate may comprise about 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or about 20 or more elemental species. A substrate may comprise at least about 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or about 20 or more elemental species. A substrate may comprise no more than about 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, or no more than about 2 or less elemental species. A substrate may comprise at least two of the following elements: carbon, manganese, silicon, vanadium, and titanium. A substrate may comprise at least three of the following elements: carbon, manganese, silicon, vanadium, and titanium. A substrate may comprise at least four of the following elements: carbon, manganese, silicon, vanadium, and titanium. [00158] A substrate may comprise multiple elements. A substrate may comprise carbon (C) at (or at about) 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or 40 wt% or more. A substrate may comprise carbon at (or at about) 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or 0.0001 wt% or less. A substrate may comprise carbon (C) at (or at about) 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or 40 wt%, or a range (inclusive) between any two of the foregoing values. [00159] A substrate may comprise manganese (Mn) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise manganese at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00160] A substrate may comprise niobium (Nb) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise niobium at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. Niobium may be added to a substrate, so that the substrate may comprise niobium in an amount of at least about 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.003 wt%, 0.004 wt%, 0.005 wt%, 0.006 wt%, 0.007 wt%, 0.008 wt%, 0.009 wt%, 0.01 wt%, 0.02 wt%, 0.03 wt%, 0.04 wt%, 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt%, 0.1 wt%, or more. Without wishing to be bound by theory, niobium in a substrate may prevent chromium depletion in a substrate. [00161] A substrate may comprise vanadium (V) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise vanadium at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00162] A substrate may comprise titanium (Ti) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise titanium at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. In some cases, a substrate may comprise at least about 0.015 wt% titanium. [00163] A substrate may comprise nitrogen (N) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise nitrogen at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00164] A substrate may comprise phosphorus (P) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise phosphorus at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00165] A substrate may comprise sulfur (S) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise sulfur at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00166] A substrate may comprise aluminum (Al) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise aluminum at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00167] A substrate may comprise copper (Cu) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise copper at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00168] A substrate may comprise nickel (Ni) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise nickel at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00169] A substrate may comprise chromium (Cr) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise chromium at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00170] A substrate may comprise molybdenum (Mo) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise molybdenum at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00171] A substrate may comprise tin (Sn) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise tin at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00172] A substrate may comprise boron (B) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise boron at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00173] A substrate may comprise calcium (Ca) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise calcium at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00174] A substrate may comprise arsenic (As) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise arsenic at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00175] A substrate may comprise cobalt (Co) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise cobalt at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00176] A substrate may comprise lead (Pb) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise lead at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00177] A substrate may comprise antimony (Sb) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise antimony at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00178] A substrate may comprise tantalum (Ta) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise tantalum at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00179] A substrate may comprise tungsten (W) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise tungsten at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00180] A substrate may comprise zinc (Zn) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise zinc at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00181] A substrate may comprise zirconium (Zr) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise zirconium at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00182] A substrate may comprise silicon (Si) at greater than 0.0001 wt%, 0.0005 wt%, 0.001 wt%, 0.002 wt%, 0.004 wt%, 0.005 wt%, 0.01 wt%, 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.5 wt%, 3 wt%, 5 wt% 7 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, or greater than about 40 wt% or more. A substrate may comprise silicon at less than or equal to about 40 wt%, 30 wt%, 20 wt%, 15 wt%, 10 wt%, 7 wt%, 5 wt%, 3 wt%, 2.5 wt%, 2 wt%, 1.9 wt%, 1.8 wt%, 1.7 wt%, 1.6 wt%, 1.5 wt%, 1.4 wt%, 1.3 wt%, 1.2 wt%, 1.1 wt%, 1 wt%, 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.05 wt%, 0.01 wt%, 0.005 wt%, 0.004 wt%, 0.002 wt%, 0.001 wt%, 0.0005 wt%, or less than about 0.0001 wt% or less. [00183] Free interstitials, such as nitrogen, carbon, and sulfur, may exist during formation of a substrate. Niobium in a substrate may bind to these free interstitials (e.g. nitrogen, carbon, and sulfur) in the substrate. Addition of niobium may prevent grain boundary precipitates, e.g. chromium grain boundary precipitates. A decrease in grain boundary precipitates may lead to an increase in corrosion performance, which may be a desired property of a substrate. FIG.3 illustrates a substrate after coating with a slurry composition, wherein no grain boundary chromium precipitates are observed. [00184] The weight % of chromium on the surface of a substrate may be measured. The chromium weight % may be of a coated substrate or of an uncoated substrate. In some cases, the chromium weight % of a substrate may be at least about 5%, 10%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, or 26% or more. The chromium weight % of a substrate may be no more than about 26%, 25%, 24%, 23%, 22%, 21%, 20%, 19%, 18 %, 17%, 16%, 15%, 10%, or no more than about 5% or less. The chromium weight % of a substrate may be about 16%, 17%, 18%, 19%, 20%, 21%, 22%, or 23%. The chromium weight % of a coated substrate may be greater than, about, or less than the chromium weight % of an uncoated substrate. [00185] Substrates may be purchased from a vendor. Substrates may be coated with a slurry layer comprising an alloying element the same day the substrate was prepared. Substrates may be prepared greater than about 2 days, 3 days, 1 week, 1 month, or 1 year or more before coating with a slurry layer comprising an alloying element. Substrates may be prepared less than about 1 year, 1 month, 1 week, 3 days, or less than 2 days before coating with a slurry layer comprising an alloying element. A reducing metal may be added to the substrate within at least about 30 seconds, 1 minute, 5 minutes, 10 minutes, 30 minutes, 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6, hours, 7 hours, 8 hours, 9 hours, 10 hours, 11 hours, 12 hours, or more of adding a slurry composition to the substrate. A reducing metal may be added to the substrate within no more than about 12 hours, 11 hours, 10 hours, 9 hours, 8 hours, 7 hours, 6 hours, or less than about 5 hours, 4hours, 3 hours, 2 hours, 1 hour, 30 minutes, 10 minutes, 5 minutes, 1 minute, 30 seconds or less of adding a slurry composition to the substrate. In some examples, the reducing metal is added to the substrate within about 10 seconds, 20 seconds, 30 seconds, 1 minute, 5 minutes, 10 minutes, 20 minutes, 30 minutes, 45 minutes, 60 minutes, 1 hours, 2 hours, 3 hours, 4 hours, 6 hours, 8 hours, 10 hours, 12 hours, 18 hours, 24 hours or within about 2 days of adding a slurry composition to the substrate. Slurry Compositions [00186] The present disclosure provides a slurry for forming a coated metal substrate. The coated metal substrate can be formed by application of the slurry adjacent to the substrate as described above. Deposition of a slurry adjacent to a substrate may form a slurry-coated layer adjacent to the substrate. In some cases, the slurry comprises an alloying agent, a metal transport activator or a solvent. In some embodiments, the alloying agent may comprise an element. The element may be a metal. In some embodiments, the alloying agent may comprise a metal. In some embodiments, the alloying agent may comprise a metal oxide. [00187] In some embodiments, the alloying agent is selected from the group consisting of iron (Fe), chromium (Cr), nickel (Ni), silicon (Si), vanadium (V), titanium (Ti), boron (B), tungsten (W), aluminum (Al), molybdenum (Mo), cobalt (Co), manganese (Mn), zirconium (Zr), copper (Cu), niobium (Nb), tantalum (Ta), cerium (Ce), bismuth (Bi), antimony (Sb), tin (Sn), lead (Pb), and combinations thereof. The alloying agent may be selected from the group consisting of ferrosilicon (FeSi), ferrochrome (FeCr), chromium and combinations thereof. [00188] A slurry composition of a slurry mixture may comprise a metal oxide amounting to about 30 weight percent (wt%), 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or about 95 wt% of the total weight of the slurry. A slurry composition of a slurry mixture may comprise a metal oxide amounting to at least about 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or about 95 wt% or more of the total weight of the slurry. A slurry composition of a slurry mixture may comprise a metal oxide amounting to no more than about 95 wt%, 90 wt%, 85 wt%, 80 wt%, 75 wt%, 70 wt%, 65 wt%, 60 wt%, 55 wt%, 50 wt%, 45 wt%, 40 wt%, 35 wt%, or no more than about 30 wt% or less of the total weight of the slurry. A slurry composition of a slurry mixture may comprise a metal oxide in a range from about 30 to about 95 wt% of the total weight of the slurry. A metal oxide may comprise about 1 to about 95 wt%, about 1 to about 85 wt%, about 1 to about 75 wt%, about 1 to about 60 wt%, about 1 to about 50 wt%, about 1 to about 40 wt%, about 1 to about 30 wt%, about 1 to about 20 wt%, about 1 to about 10 wt%, about 5 to about 95 wt%, about 5 to about 85 wt%, about 5 to about 75 wt%, about 5 to about 60 wt%, about 5 to about 50 wt%, about 5 to about 40 wt%, about 5 to about 30 wt%, about 5 to about 20 wt%, about 5 to about 10 wt%, about 10 to 95 wt%, about 10 to about 85 wt%, about 10 to about 75 wt%, about 10 to about 60 wt%, about 10 to about 50 wt%, about 10 to about 40 wt%, about 10 to about 30 wt%, about 10 to about 20 wt%, about 20 to about 95 wt%, about 20 to about 85 wt%, about 20 to about 75 wt%, about 20 to about 60 wt%, about 20 to about 50 wt%, about 20 to about 40 wt%, about 20 to about 30 wt%, about 30 to about 85 wt%, about 30 to about 75 wt%, about 30 to about 60 wt%, about 30 to about 50 wt%, about 30 to about 40 wt%, about 1 to about 95 wt%, about 40 to about 85 wt%, about 40 to about 75 wt%, about 40 to about 60 wt%, about 40 to about 50 wt%, about 50 to about 95 wt%, about 50 to about 85 wt%, about 50 to about 75 wt%, or about 50 to about 60 wt% of the total weight of the slurry. A metal oxide or reducing metal may be selected for its relative purity. A metal oxide or reducing metal may comprise a purity of at least about 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, 99.9%, or at least about 99.99% or more on a weight basis. A metal oxide or reducing metal may comprise a purity of no more than about 99.99%, 99%, 95%, 90%, 85%, 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, 30%, or no more than about 25% or less on a weight basis. [00189] A reducing metal may comprise an about 0.6 to 2.0 atomic ratio to the oxide source. A reducing metal may comprise an about 0.01 to 10.0 atomic ratio, an about 0.01 to 1.0 atomic ratio, an about 0.01 to 1.5 atomic ratio, an about 0.01 to 3.0 atomic ratio, an about 0.01 to 4.0 atomic ratio, an about 0.01 to 5.0 atomic ratio, an about 0.1 to 1.0 atomic ratio, an about 0.1 to 1.5 atomic ratio, an about 0.1 to 3.0 atomic ratio, an about 0.1 to 4.0 atomic ratio, an about 0.1 to 5.0 atomic ratio, an about 0.1 to 10.0 atomic ratio, an about 0.5 to 1.0 atomic ratio, an about 0.5 to 1.5 atomic ratio, an about 0.5 to 3.0 atomic ratio, an about 0.5 to 4.0 atomic ratio, an about 0.5 to 5.0 atomic ratio, an about 0.5 to 10.0 atomic ratio, an about 1.0 to 1.5 atomic ratio, an about 1.0 to 3.0 atomic ratio, an about 1.0 to 4.0 atomic ratio, an about 1.0 to 5.0 atomic ratio, an about 1.0 to 10.0 atomic ratio, an about 2.0 to 3.0 atomic ratio, an about 2.0 to 4.0 atomic ratio, an about 2.0 to 5.0 atomic ratio, an about 2.0 to 10.0 atomic ratio, an about 3.0 to 4.0 atomic ratio, an about 4.0 to 5.0 atomic ratio, an about 4.0 to 10.0 atomic ratio, or an about 5.0 to 10.0 atomic ratio to the oxide source. [00190] A slurry coating may comprise an alloying element, a metal oxide (e.g., an inert metal oxide, or a reactive metal oxide), a metal chloride species, and/or a metal transport activator. In some embodiments, the alloying agent is selected from the group consisting of iron (Fe), chromium (Cr), nickel (Ni), silicon (Si), vanadium (V), titanium (Ti), boron (B), tungsten (W), aluminum (Al), molybdenum (Mo), cobalt (Co), manganese (Mn), zirconium (Zr), copper (Cu), niobium (Nb), tantalum (Ta), cerium (Ce), bismuth (Bi), antimony (Sb), tin (Sn), lead (Pb), and combinations thereof. [00191] A slurry coating may comprise an alloying element, a metal oxide (e.g., an inert metal oxide, or a reactive metal oxide). A metal oxide may be selected from the group consisting of aluminum oxide (Al ₂ O ₃ ), chromium(III) oxide (Cr ₂ O ₃ ), titanium(IV) oxide (TiO ₂ ), iron chromium oxide (FeCr ₂ O ₄ ), silicon oxide (SiO ₂ ), tantalum pentoxide (Ta ₂ O ₅ ), magnesium chromium oxide (MgCr ₂ O ₄ ), manganese(II) oxide (MnO), manganese(IV) oxide (MnO ₂ ), vanadium(II) oxide (VO), vanadium(III) oxide (V ₂ O ₃ ), titanium(II) oxide (TiO), titanium(III) oxide (Ti ₂ O ₃ ), niobium pentoxide (Nb ₂ O ₅ ), boron trioxide (B ₂ O ₃ ), cerium oxide (CeO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), lithium superoxide (LiO ₂ ), zirconium oxide (ZrO ₂ ), lanthanum(III) oxide (La ₂ O ₃ ), bentonite clay, monterey clay, Kaolin clay, philosilicate clay, other clays, and combinations thereof. [00192] A metal oxide may a reactive metal oxide and/or an inert metal oxide. A reactive metal oxide (e.g., comprising the alloying element) (e.g., selected from the group consisting of chromium(III) oxide (Cr ₂ O ₃ ), titanium(IV) oxide (TiO ₂ ), iron chromium oxide (FeCr ₂ O ₄ ), silicon oxide (SiO ₂ ), tantalum pentoxide (Ta ₂ O ₅ ), magnesium chromium oxide (MgCr ₂ O ₄ ), manganese(II) oxide (MnO), manganese(IV) oxide (MnO ₂ ), vanadium(II) oxide (VO), vanadium(III) oxide (V ₂ O ₃ ), titanium(II) oxide (TiO), titanium(III) oxide (Ti ₂ O ₃ ), niobium pentoxide (Ti ₂ O ₃ ), boron trioxide (B ₂ O ₃ ), cerium oxide (CeO ₂ ), and combinations thereof. [00193] In some embodiments, the metal oxide may comprise an inert metal oxide. In some embodiments, the inert metal oxide can be selected from the group consisting of aluminum oxide (Al ₂ O ₃ ), chromium(III) oxide (Cr ₂ O ₃ ), titanium dioxide (TiO ₂ ), FeCr ₂ O ₄ , silicon oxide (SiO ₂ ), titanium dioxide (TiO ₂ ), Ta ₂ O ₅ , MgCr ₂ O ₄ , magnesium oxide (MgO), calcium oxide (CaO), lithium superoxide (LiO ₂ ), zirconium oxide (ZrO ₂ ), vanadium(III) oxide (V ₂ O ₃ ), lanthanum(III) oxide (La ₂ O ₃ ), bentonite clay, monterey clay, Kaolin clay, philosilicate clay, other clays, and combinations thereof. [00194] A metal oxide may be formed in the slurry by a metallothermic reduction reaction between an elemental metal and a thermodynamically less-stable metal oxide. Suitable pairs of elemental metals and thermodynamically less-stable metal oxides may be chosen from pairs whose Gibbs free energy of formation is reduced by an oxidation of the elemental metal by the metal oxide. A metallothermic reduction reaction may occur spontaneously. A metallothermic reduction reaction may occur in the presence of a metal transport activator, such as a halide, metal halide, metal sulfide, or a gaseous species. A metal oxide may comprise a powder. [00195] A slurry may comprise a metal transport activator that is configured to carry a metal species from the slurry to the surface of a substrate. The metal transport activator may comprise a halide species (e.g., chlorine, bromide, iodine, fluorine, or a combination thereof), a metal halide species (e.g., a metal chloride, a metal bromide, a metal iodine, a metal fluoride, or a combination thereof), a sulfide species, a metal sulfide species, a gaseous species (e.g., hydrogen), or a combination thereof. A metal transport activator may be introduced during slurry preparation, for example by the addition of one or more powders. A metal transport activator may be introduced after slurry formation from an exogenous source, such as diffusion of hydrogen gas into a slurry layer after application to the substrate. In some cases, the metal transport activator includes a monovalent metal, a divalent metal or a trivalent metal. [00196] In some cases, the metal transport activator is selected from the group consisting of magnesium chloride (MgCl ₂ ), iron (II) chloride (FeCl ₂ ), calcium chloride (CaCl ₂ ), zirconium (IV) chloride (ZrCl ₄ ), titanium (IV) chloride (TiCl ₄ ), niobium (V) chloride (NbCl ₅ ), titanium (III) chloride (TiCl ₃ ), silicon tetrachloride (SiCl ₄ ), vanadium (III) chloride (VCl ₃ ), chromium (III) chloride (CrCl ₃ ), trichlorosilance (SiHCl ₃ ), manganese (II) chloride (MnCl ₂ ), chromium (II) chloride (CrCl ₂ ), cobalt (II) chloride (CoCl ₂ ), copper (II) chloride (CuCl ₂ ), nickel (II) chloride (NiCl ₂ ), vanadium (II) chloride (VCl ₂ ), ammonium chloride (NH4Cl), sodium chloride (NaCl), potassium chloride (KCl), molybdenum sulfide (MoS), manganese sulfide (MnS), iron disulfide (FeS ₂ ), chromium sulfide (CrS), iron sulfide (FeS), copper sulfide (CuS), nickel sulfide (NiS), bismuth oxychloride (BiOCl), copper hydroxychloride, manganese hydroxychloride, antimony oxychloride, and molybdenum trichloride, and combinations thereof. In some embodiments, the halide activator is hydrated. In some embodiments, the halide activator is selected from the group consisting of iron chloride tetrahydrate (FeCl ₂ · 4H ₂ O), iron chloride hexahydrate (FeCl ₂ · 6H ₂ O) and magnesium chloride hexahydrate (MgCl ₂ · 6H ₂ O). In some embodiments, the halide activator is hydrated. In some embodiments, the halide activator is selected from the group consisting of iron chloride tetrahydrate (FeCl ₂ · 4H ₂ O), iron chloride hexahydrate (FeCl ₂ · 6H ₂ O) and magnesium chloride hexahydrate (MgCl ₂ · 6H ₂ O). [00197] In some embodiments, the alloying agent is selected from the group consisting of iron (Fe), chromium (Cr), nickel (Ni), silicon (Si), vanadium (V), titanium (Ti), boron (B), tungsten (W), aluminum (Al), molybdenum (Mo), cobalt (Co), manganese (Mn), zirconium (Zr), copper (Cu), niobium (Nb), tantalum (Ta), cerium (Ce), bismuth (Bi), antimony (Sb), tin (Sn), lead (Pb), and combinations thereof. A slurry may comprise a solvent. A solvent may be aqueous or organic. Solvents may include water, methanol, ethanol, isopropanol, acetone, or methyl ethyl ketone The boiling point (or boiling temperature) of the solvent may be less than or equal to about 200 ºC, 190 ºC, 180 ºC, 170 ºC, 160 ºC, 150 ºC, 140 ºC, 130 ºC, 120 ºC, 110 ºC, or 100 ºC or less. The boiling point of the solvent may be greater than or equal to about 100 ºC, 110 ºC, 120 ºC, 130 ºC, 140 ºC, 150 ºC, 160 ºC, 170 ºC, 180 ºC, 190 ºC, or greater than about 200 ºC or more. The boiling point (or boiling temperature) of the solvent may be about 100 ºC to about 200 ºC, about 100 ºC to about 150 ºC or about 150 ºC to about 200 ºC. A slurry may comprise a solvent (e.g., water, a ketone, or alcohol (e.g., C1-C12 alcohol, such as C1-C6 alcohol))). [00198] In some cases, the slurry comprises an inert species. A slurry may be formed by mixing various components in a mixing chamber (or vessel). Various components may be mixed at the same time or sequentially. For example, a solvent is provided in the chamber and an elemental species is subsequently added to the chamber. To prevent clumping, dry ingredients may be added to the solvent in controlled amounts. Some elemental metals may be in dry powder form. [00199] The blade used to mix the slurry composition may be in the shape of a whisk, a fork, or a paddle. More than one blade may be used to mix the slurry components. Each blade may have different shapes or the same shape. Dry ingredients may be added to the solvent in controlled amounts to prevent clumping. A high shear rate may be used to help control viscosity. In a slurry, chromium particles may be larger in size than other particles and may be suspended without high polymer additions. [00200] The properties of the slurry can be a function of one or more parameters used to form the slurry, maintain the slurry or deposit the slurry. Such properties can include viscosity, shear thinning index, and yield stress. Such properties can include Reynolds number, viscosity, pH, and slurry component concentration. Parameters that can influence properties of the slurry can include water content, elemental species identity and content, temperature, shear rate and time of mixing. [00201] FIG.1 illustrates a method of forming a coated metal substrate. In operation 110, a substrate is provided. Next, in operation 120, a slurry composition can be applied from the mixing vessel to the substrate to form a slurry coating (e.g., film) comprising an alloying agent to form a coated substrate. In operation 130, the solvent in the slurry may be removed after application by heat or vacuum drying at about 90 °C – 175 °C for about 10 – 60 seconds. In operation 140, the coated substrate may be subjected to winding to be wound (or coiled) at a winding temperature of 10 °C – 200 °C to form a metal coil. In operation 150, under sufficient annealing conditions comprising an alloying temperature of about 750 degree Celsius (°C) to about 1100 °C and/or an alloying atmosphere comprising a reducing gas (e.g., hydrogen gas) the alloying agent can be annealed adjacent to the substrate to form a diffusion-alloyed metal coil. The substrate may comprise two substrates or side surfaces thereof in the metal coil being in contact with the slurry. Following the operation 150, the diffusion-alloyed metal coil may be subjected to winding to unwound (or uncoil) the diffusion-alloyed metal coil. [00202] FIG.2 illustrates an image of a substrate microstructure and grain morphology after coating with a slurry. The grain size and coefficient of variation may be calculated according to the American Society of the International Association for Testing and Materials (ASTM) standard. [00203] The slurry may exhibit thixotropic behavior, wherein the slurry exhibits a decreased viscosity when subjected to sheer strain. The shear thinning index of the slurry can be from about 1 to about 8. In order to achieve the target viscosity, mixing may occur at a high shear rate. The shear rate can be from about 1 s ^-1 to about 10,000 s ^-1 (or Hz). The shear rate may be about 1 s ^-1 , about 10 s ^-1 , about 100 s ^-1 , about 1,000 s ^-1 , about 5,000 s ^-1 , or about 10,000 s ^-1 . The shear rate may be at least about 1 s ^-1 , about 10 s ^-1 , about 100 s ^-1 , about 1,000 s ^-1 , about 5,000 s ^-1 , or at least about 10,000 s ^-1 or more. The shear rate may be less than about 10,000 s ^-1 , 5,000 s ^-1 , 1,000 s ^-1 , 100 s ^-1 , 10 s ^-1 , or less than about 1 s ^-1 or less. The shear rate may be about 10,000 s ^-1 to about 1 s ^-1 , 1000 s ^-1 to about 1 s ^-1 , 100 s ^-1 to about 1 s ^-1 , or 10,000 s ^-1 to about 100 s ^-1 . [00204] The shear rate of a slurry may be measured on various instruments. The shear rate may be measured on a TA Instruments DHR-2 rheometer, for example. The shear rate of a slurry may differ depending on the instrument used to perform the measurement. [00205] In order to achieve the target or predetermined viscosity, mixing may occur for a period of time from about 1 minute to 2 hours. The time of mixing may be less than about 30 minutes. The viscosity of the slurry may decrease the longer the slurry is mixed. The time of mixing may correspond to the length of time used in homogenizing the slurry. [00206] A properly mixed state may be a state where the slurry does not have water on the surface. A properly mixed state may be a state where there are no solids on the bottom of the vessel. The slurry may appear to be uniform in color and texture. [00207] The desired viscosity of the slurry composition can be a viscosity that is suitable for roll coating. The viscosity of the slurry can be about 1 centipoise (cP), 5 cP, 10 cP, 50 cP, 100 cP, 200 cP, 500 cP, 1,000 cP, 10,000 cP, 100,000 cP, 1,000,000 cP, or about 5,000,000 cP, or a range (inclusive) between any two of the foregoing. The viscosity of the slurry can be at least about 1 cP, 5 cP, 10 cP, 50 cP, 100 cP, 200 cP, 500 cP, 1,000 cP, 10,000 cP, 100,000 cP, 1,000,000 cP, or about 5,000,000 cP. The viscosity of the slurry can be no more than about 5,000,000 cP, 1,000,000 cP, 100,000 cP, 10,000 cP, 5,000 cP, 1,000 cP, 500 cP, 200 cP, 100 cP, 50 cP, 10 cP, 5 cP, or no more than about 1 cP. The viscosity of the slurry can be from about 1cP to 5,000,000 cP. The viscosity of the slurry may be about 1 cP, about 5 cP, about 10 cP, about 50 cP, about 100 cP, about 200 cP, about 500 cP, about 1,000 cP, about 10,000 cP, about 100,000 cP, about 1,000,000 cP, or about 5,000,000 cP. The viscosity of the slurry may be from about 1 cP to 1,000,000 cP, or 100 centipoise cP to 100,000 cP. The viscosity of the slurry may depend on shear rate. The viscosity of the slurry may be from about 200 cP to about 10,000 cP, or about 600 cP to about 800 cP. The slurry may be from about 100 cP to about 200 cP in the application shear window that has shear rates from about 1000 s ^-1 to about 1000000 s ^-1 . [00208] The capillary number of the slurry may be about 0.01, 0.05, 0.1, 0.5, 1, 2, 3, 4 ,5, 6, 7, 8, 9, or about 10, or a range (inclusive) between any two of the foregoing. The capillary number of a slurry may be at least about 0.01, 0.05, 0.1, 0.5, 1, 2, 3, 4 ,5, 6, 7, 8, 9, or about 10 or more. The capillary number of a slurry may be no more than about 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0.5, 0.1, 0.05, or no more than about 0.01 or less. The capillary number of the slurry may be about 0.01 to about 10, about 0.01 to about 0.1, about 0.1 to about 1, about 1 to about 10, about 0.05 to about 0.5, about 0.5 to about 5, or about 5 to about 10, [00209] The yield stress of a slurry may be about 0.0001 Pascal (Pa), 0.001 Pa, 0.01 Pa, 0.1 Pa, 0.2 Pa, 0.3 Pa, 0.4 Pa, 0.5 Pa, 0.6 Pa, 0.7 Pa, 0.8 Pa, 0.9 Pa, or about 1 Pa, or a range (inclusive) between any two of the foregoing. The yield stress of a slurry may be at least about 0.0001 Pascal (Pa), 0.001 Pa, 0.01 Pa, 0.1 Pa, 0.2 Pa, 0.3 Pa, 0.4 Pa, 0.5 Pa, 0.6 Pa, 0.7 Pa, 0.8 Pa, 0.9 Pa, or at least about 1 Pa or more. The yield stress of a slurry may be no more than 1 Pa, 0.9 Pa, 0.8 Pa, 0.7 Pa, 0.6 Pa, 0.5 Pa, 0.4 Pa, 0.3 Pa, 0.2 Pa, 0.1 Pa, 0.01 Pa, 0.001 Pa, or no more than about 0.001 Pa or less. The yield stress of a slurry may be about 0.0001 Pa to about 1 Pa, about 0.0001 Pa to about 0.001 Pa, about 0.001 Pa to about 0.01 Pa, about 0.01 Pa to about 0.1 Pa, or about 0.1 Pa to about 1 Pa. [00210] The settling rate of the slurry may be stable to separation or sedimentation for greater than about one minute, greater than about 15 minutes, greater than about 1 hour, greater than about 1 day, greater than about 1 month, or greater than about 1 year. The settling rate of the slurry may refer to the amount of time the slurry is able to withstand, without mixing, before settling occurs, or before the viscosity increases to values that are not suitable for roll coating. Similarly, the shelf-life of the slurry may refer to the time that slurry can withstand, without mixing, before the slurry thickens to an extent unsuitable for roll coating. Even if the slurry settles and thickens, however, the slurry may be remixed to its initial viscosity. The thixotropic index of the slurry can be stable such that the slurry does not thicken to unsuitable levels at dead spots in the pan of a roll coating assembly. [00211] The viscosity of the slurry can be controlled by controlling the extent of hydrogen bonding by adding acid to the slurry during mixing. In addition, acid or base may be added to the slurry during mixing in order to control the pH level of the slurry. The pH of a slurry may be about 3, 4, 5, 6, 7, 8, 9, 10, 11, or about 12, or a range (inclusive) between any two of the foregoing. The pH level of a slurry may be at least about 3, 4, 5, 6, 7, 8, 9, 10, 11, or at least about 12 or more. The pH level of a slurry may be no more than about 12, 11, 10, 9, 8, 7, 6, 5, 4 or no more than about 3 or less. The pH level of the slurry can be from about 3 to about 12. The pH level of the slurry can be about 5 to about 8. The pH level of the slurry can be about 3, about 4, about 5, about 6, about 7, about 8, about 9, about 10, about 11, or about 12. The pH level of the slurry may change as the slurry settles. Remixing the slurry after the slurry settles may return the pH level of the slurry to initial pH levels. Varying levels of binder, for example, metal acetate, may be added to a slurry to increase green strength in a slurry. A slurry may include no binders. A slurry may include a metal transport activator that is configured to act as a binder. [00212] The fluidity of a slurry can be measured by a tilt test. A tilt test can be an indication of yield stress and viscosity. As an alternative, a rheometer may be used to measure the fluidity of the slurry. [00213] The drying time of the slurry can be sufficiently long such that the slurry remains wet during the roll coating process and does not dry until after a coating of the slurry is applied to the substrate. The slurry may not dry at room temperature. The slurry may become dry to the touch after subjecting the drying zone of a roll coating line to heat for around ten seconds. The temperature of heat applied may be around 120 °C. [00214] The specific gravity of the slurry can be about 1, 2, 3, 4, 5, 6, 7, 8, 9, or about 10 g/cm ³ , or a range (inclusive) between any two of the foregoing. The specific gravity of the slurry can be at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, or at least about 10 g/cm ³ or more. The specific gravity of the slurry can be no more than about 10, 9, 8, 7, 6, 5, 4, 3, 2, or no more than about 1 g/cm ³ or less. The specific gravity of the slurry can be about 1 g/cm ³ to 10 g/cm3, about 1 g/cm ³ to 5 g/cm ³ , or about 5 g/cm ³ to 10 g/cm ³ . The green strength of the slurry can be such that the slurry is able to withstand roll coating such that the slurry coated substrate is not damaged. For example, a dry film of slurry, dried after roll-coating in the drying oven adjacent to the paint booth, may have a green strength that allows the film to survive a force that flexes the film, twenty times, in alternating negative and positive directions, to an arc with a diameter of about 20 inches. The green strength of the dry film of slurry may further allow the film to pass a tape test with a small amount of powdering. The tape test may involve contacting a piece of tape with the surface of the coated material. The tape, once removed from the surface of the coated material, may be clear enough to allow one to see through any powder that had adhered to the tape. [00215] A slurry composition may be applied to a substrate before forming a diffusion alloyed metal on the substrate. The slurry may be applied in a uniform thickness over the substrate. A slurry may be applied in a varying thickness over the substrate. The average thickness of an applied slurry coating may be about 0.0001 inch (in) (i.e., 1 inch = 2.54 centimeters), 0.0005 inch (in), 0.001 inch (in), 0.002 inch (in), 0.003 inch (in), 0.004 inch (in), 0.005 inch (in), 0.006 inch (in), 0.007 inch (in), 0.008 inch (in), 0.009 inch (in), 0.01 inch (in), 0.02 inch (in), 0.03 inch (in), 0.04 inch (in), 0.05 inch (in), 0.06 inch (in), 0.07 inch (in), 0.08 inch (in), 0.09 inch (in), 0.1 inch (in), 0.125 inch (in), 0.25 inch (in), 0.5 inch (in), or a range (inclusive) between any two of the foregoing. The average thickness of an applied slurry coating may be at least about 0.0001 inch (in), 0.0005 inch (in), 0.001 inch (in), 0.002 inch (in), 0.003 inch (in), 0.004inch (in), 0.005 inch (in), 0.006 inch (in), 0.007 inch (in), 0.008 inch (in), 0.009 inch (in), 0.01 inch (in), 0.02 inch (in), 0.03 inch (in), 0.04 inch (in), 0.05 inch (in), 0.06 inch (in), 0.07 inch (in), 0.08 inch (in), 0.09 inch (in), 0.1 inch (in), 0.125 inch (in), 0.25 inch (in), 0.5 inch (in) or more. The average thickness of an applied slurry coating may be no more than about 0.5 inch (in), 0.25 inch (in), 0.125 inch (in), 0.1 inch (in), 0.09 inch (in), 0.08 inch (in), 0.07 inch (in), 0.06 inch (in), 0.05 inch (in), 0.04 inch (in), 0.03 inch (in), 0.02 inch (in), 0.01 inch (in), 0.009 inch (in), 0.008 inch (in), 0.007 inch (in), 0.006 inch (in), 0.005 inch (in), 0.004 inch (in), 0.003 inch (in), 0.002 inch (in), 0.001 inch (in), 0.0005 inch (in), 0.0001 inch (in) or less. The average thickness of an applied slurry coating may be about 0.0001 inch (in) to about 0.5 inch (in), about 0.0001 inch (in) to about 0.001 inch (in), 0.001 inch (in) to about 0.01 inch (in), 0.01 inch (in) to about 0.1 inch (in), 0.0001 inch (in) to about 0.05 inch (in), or 0.005 inch (in) to about 0.5 inch (in). [00216] A slurry composition may be applied adjacent to one or more surfaces of a substrate with a particular thickness. The thickness of the applied slurry coating may be relatively uniform over a surface or may vary. The thickness of the applied slurry coating may vary from one surface of the substrate to another. The thickness of the applied slurry coating adjacent to the substrate may be measured at any time, including immediately after application, during drying, or after all solvent has been removed. An applied coating of a slurry may be considered substantially uniform if at least 90%, 95%, 99% or more of the substrate surface has a slurry coating that does not deviate by more than about 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, or about 20%, or a range (inclusive) between any two of the foregoing, from the average thickness of the applied slurry coating. [00217] A slurry coating applied adjacent to one or more surfaces of a substrate may have an average applied thickness before or after drying of about 5 µm, 10 µm, 15 µm, 20 µm, 25 µm, 30 µm, 40 µm, 50 µm, 60 µm, 70 µm, 80 µm, 90 µm, 100 µm, 150 µm, 200 µm, 250 µm, 300 µm, 400 µm, 500 µm, 600 µm, 700 µm, 800 µm, 900 µm, 1 mm, 2 mm, 5 mm, or about 1 cm, or a range (inclusive) between any two of the foregoing. A slurry coating applied adjacent to one or more surfaces of a substrate may have an average applied thickness before or after drying of at least about 5 µm, 10 µm, 15 µm, 20 µm, 25 µm, 30 µm, 40 µm, 50 µm, 60 µm, 70 µm, 80 µm, 90 µm, 100 µm, 150 µm, 200 µm, 250 µm, 300 µm, 400 µm, 500 µm, 600 µm, 700 µm, 800 µm, 900 µm, 1 mm, 2 mm, 5 mm, or about 1 cm. A slurry coating applied adjacent to one or more surfaces of a substrate may have an applied thickness before or after drying of no more than about 1 cm, 5 mm, 2 mm, 1 mm, 900 µm, 800 µm, 700 µm, 600 µm, 500 µm, 400 µm, 300 µm, 250 µm, 200 µm, 150 µm, 100 µm, 90 µm, 80 µm, 70 µm, 60 µm, 50 µm, 40 µm, 30 µm, 25 µm, 20 µm, 15 µm, 10 µm, or 5 µm or less. A slurry coating applied adjacent to one or more surfaces of a substrate may have an applied thickness before or after drying of about 5 µm to about 1 cm, about 5 µm to about 50 µm, about 50 µm to about 500 µm, about 500 µm to about 1mm, or about 1mm to about 1cm. [00218] A slurry coating applied adjacent to one or more surfaces of a substrate may cover about 25% to about 100% of the one or more surfaces of a substrate. A slurry coating may cover about 25% to about 50%, about 25% to about 75%, about 25% to about 90%, about 25% to about 100%, about 50% to about 75%, about 50% to about 90%, about 50% to about 100%, about 75% to about 90%, about 75% to about 100%, or about 90% to about 100% of the one or more surfaces of a substrate. A slurry coating may cover about 25%, about 50%, about 75%, about 90%, or about 100% of the one or more surfaces of a substrate. A slurry coating may cover at least about 25%, about 50%, about 75%, about 90%, or more of the one or more surfaces of a substrate. [00219] A slurry coating may be subjected to drying (e.g., by using a drying oven) after the slurry is coated on a surface of a substrate. A slurry coating composition is provided at an average dry film thickness of about 60 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meter) to about 100 µm. In some embodiment, the average thickness of the dry film may be about 50 µm to about 100 µm. In some embodiment, the average thickness of the dry film may be about 50 µm to about 60 µm, about 50 µm to about 65 µm, about 50 µm to about 70 µm, about 50 µm to about 75 µm, about 50 µm to about 80 µm, about 50 µm to about 85 µm, about 50 µm to about 90 µm, about 50 µm to about 95 µm, about 50 µm to about 100 µm, about 60 µm to about 65 µm, about 60 µm to about 70 µm, about 60 µm to about 75 µm, about 60 µm to about 80 µm, about 60 µm to about 85 µm, about 60 µm to about 90 µm, about 60 µm to about 95 µm, about 60 µm to about 100 µm, about 65 µm to about 70 µm, about 65 µm to about 75 µm, about 65 µm to about 80 µm, about 65 µm to about 85 µm, about 65 µm to about 90 µm, about 65 µm to about 95 µm, about 65 µm to about 100 µm, about 70 µm to about 75 µm, about 70 µm to about 80 µm, about 70 µm to about 85 µm, about 70 µm to about 90 µm, about 70 µm to about 95 µm, about 70 µm to about 100 µm, about 75 µm to about 80 µm, about 75 µm to about 85 µm, about 75 µm to about 90 µm, about 75 µm to about 95 µm, about 75 µm to about 100 µm, about 80 µm to about 85 µm, about 80 µm to about 90 µm, about 80 µm to about 95 µm, about 80 µm to about 100 µm, about 85 µm to about 90 µm, about 85 µm to about 95 µm, about 85 µm to about 100 µm, about 90 µm to about 95 µm, about 90 µm to about 100 µm, or about 95 µm to about 100 µm. In some embodiment, the average thickness of the dry film may be about 50 µm, about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 80 µm, about 85 µm, about 90 µm, about 95 µm, or about 100 µm. In some embodiment, the average thickness of the dry film may be at least about 50 µm, about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 80 µm, about 85 µm, about 90 µm, about 95 µm, about 100 µm, or more. In some embodiment, the average thickness of the dry film may be at most about 100 µm, about 95 µm, about 90 µm, about 85 µm, about 80 µm, about 75 µm, about 70 µm, about 65 µm, about 60 µm, about 55 µm, or less. In some embodiments, the average thickness of the dry film may vary with a relative standard deviation of no more than 10%. The relative standard deviation may be at most about 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, or less. The relative standard deviation may be associated with a standard deviation of the average thickness of the dry film. The standard deviation of the dry film may be no more than about 15 µm, about 14 µm, about 13 µm, about 12 µm, about 11 µm, about 10 µm, about 9 µm, about 8 µm, about 7 µm, about 6 µm, or about 5 µm. The standard deviation of the dry film may be about 5 µm to about 15 µm, about 5 µm to about 10 µm, or 8 µm to about 12 µm. [00220] An elemental species in the slurry can diffuse to or into the substrate according to a concentration gradient. For example, the concentration of the elemental species in the slurry composition can be highest on the surface of the substrate and can decrease according to a gradient along the depth of the substrate. The decrease in concentration can be linear, parabolic, Gaussian, or any combination thereof. The concentration of the elemental species in the slurry composition can be selected based on the desired thickness of the alloy layer to be formed on the substrate. [00221] An elemental species in the slurry may impact the adhesion of the slurry to the substrate. In addition, an elemental species may impact the viscosity of the slurry composition. Further, an elemental species may influence the green strength of the slurry coated substrate. Green strength generally refers to the ability of a slurry coated substrate to withstand handling or machining before the slurry coating is completely cured. Accordingly, an elemental species may be selected based on the desired degree of adhesion of the slurry coating to the substrate, the desired viscosity of the slurry coating, and the ability of an elemental species to increase the green strength of the slurry coated substrate. In addition, some metal- containing halides in a slurry composition can be corrosive to components of a roll coating assembly which applies the slurry coating to the substrate. Such corrosion may be undesirable. An elemental species may prevent the formation of Kirkendall voids at the boundary interface of the slurry coating and the substrate. Upon heating, an elemental species may decompose to an oxide. In addition, after annealing, an elemental species may become inert. The concentration of various elemental species can be variable. [00222] The substrate may be pretreated before a slurry is applied to the substrate. The substrate may be pretreated by using chemicals to modify the surface of the substrate in order to improve adhesion of the slurry coating to the surface of the substrate. Examples of such chemicals include chromates and phosphates. [00223] The surface of the substrate may be free of processing oxides. This may be achieved by conventional pickling. The surface of the substrate can be reasonably free of organic materials. The surface of the substrate may be reasonably free of organic materials after processing with commercially available cleaners. [00224] Grain pinning particles may be added, removed, or withheld from the substrate during preparation of the substrate in order to control the grain size of the substrate. For example, grain pinners may be added to the substrate in order to keep the grain size small and to form pinning points. As another example, grain pinners may be withheld from the substrate to allow the grains to grow large and to allow for motor laminations. Grain pinners may be insoluble at the annealing temperatures. [00225] Examples of grain pinning particles include an intermetallic, a nitride, a carbide, a carbonitride of titanium, aluminum, niobium, vanadium, and any combination thereof. Non-limiting examples of grain pinning particles include titanium nitride (TiN), titanium carbide (TiC), and aluminum nitride (AlN). [00226] The slurry composition can be applied or deposited adjacent to the substrate (e.g., a surface thereof) to form a wet film by roll coating, split coating, spin coating, slot coating, curtain coating, slide coating, extrusion coating, painting, spray painting, electrostatic mechanisms, printing (e.g., 2-D printing, 3-D printing, screen printing, pattern printing), vapor deposition (e.g., chemical vapor deposition), electrochemical deposition, slurry deposition, dipping, spraying, any combination thereof, or through any other suitable method. [00227] A slurry can be applied via roll coating. The roll coating process may begin by providing a substrate. Next, the coiled substrate may be subjected to unwinding (e.g., uncoiling). Next, the unwound (or uncoiled) substrate may be provided to roll coaters to be coated with a slurry composition. Next, the roll coaters may be activated such that the unwound (or uncoiled) substrate may be passed through a plurality of roll coaters to coat the substrate with a slurry composition. The substrate may be fed through the roll coaters through multiple cycles such that the slurry coating is applied to the substrate multiple times. Subsequently, a substrate may be subjected to a plurality of winding and unwinding (e.g., bending and unbending) cycles. A substrate may be subjected to at least about 5, 10, 15, 20 or more bending and unbending cycles. A substrate may be subjected to about 5, 10, 15, or 20 cycles of bending and unbending. The substrate (e.g., a slurry coated substrate, a substrate without any coating, a substrate with one or more layers of slurry coating) may be subjected to winding, flexing, bending in alternating negative and positive directions. Depending on the properties of the slurry composition, it may be desirable to apply multiple coatings to the substrate. Multiple coatings of the slurry composition can be applied to the substrate in order to achieve the desired thickness of the slurry. Different slurry compositions may be used in each of the multiple coatings. The slurry composition may be applied in a manner such that to form a pattern on the substrate. The pattern may be in the form of, for example, a grid, stripes, dots, welding marks, or any combination thereof. Multiple coatings on the same substrate may form a split coat on a substrate. [00228] A slurry composition may be configured to have a set of properties that may allow the slurry coating to be robust during the process of winding and unwinding. A slurry composition may be resistant to delamination and remain coated on the substrate during a winding and/or an unwinding process. The winding may be to form a metal coil form a substrate coated with a slurry. The winding and unwinding may be to subject a substrate coated with a slurry to a plurality of coat rollers. The slurry coating may be characterized by a green strength capable of withstanding a plurality of (e.g., at least about 5, 10, 15, or 20 times) bending and unbending cycles. Green strength generally refers to the ability of a metal- containing layer coated substrate to withstand handling or machining before the metal-containing layer is completely cured. The green strength of the slurry can be such that the slurry is able to withstand roll coating such that the slurry coated substrate is not damaged. For example, a dry film of slurry, dried after roll-coating (e.g., in a drying oven), may have a green strength that allows the film to survive a force that flexes the film (e.g., at least about 5, 10, 15, or 20 times), to an arc with a diameter of about 20 inches. The green strength of the dry film of slurry may further allow the film to pass a tape test with a small amount of powdering. In some embodiments, the dry film has a green strength suitable to survive flexing to a 20 inch diameter are 20 times (positive and negative) and pass a tape test with small amount of powdering, and/or (2) is capable of surviving a high speed roll coating process. [00229] The slurry coating may be characterized by an adhesion to the substrate capable of withstanding a plurality of (e.g., at least about 5, 10, 15, or 20 times) bending and unbending cycles. The slurry coating may be configured to survive a high speed roll coating process. A robust slurry coating may withstand winding through substantially tight bends with a small bending radius. In a nonlimiting example, the slurry coating may be capable of withstanding at least 4 cycles of bending and/or flexing, alternating in positive and negative directions, around one or more cylinders (e.g., roll coaters) of about 4 inch (in) diameter without any delamination of slurry from the surface of the substrate. In some embodiments, the substrate may be cleaned and/or cleared from any residue(s) before slurry coating. [00230] Method disclosed herein, may further comprise applying a blocking layer comprising a blocking composition to a surface of the substrate to prevent an alloying agent to diffuse into the substrate and/or alloy with the substrate. A blocking composition may comprise an inert species (e.g., an inert metal oxide). A blocking layer may be applied or deposited adjacent to the substrate (e.g., a surface thereof) by roll coating, split coating, spin coating, slot coating, curtain coating, slide coating, extrusion coating, painting, spray painting, electrostatic mechanisms, printing (e.g., 2-D printing, 3-D printing, screen printing, pattern printing), vapor deposition (e.g., chemical vapor deposition), electrochemical deposition, slurry deposition, dipping, spraying, any combination thereof, or through any other suitable method. A blocking layer may be applied before applying the slurry composition to the substrate (e.g., a surface thereof). The blocking layer may be applied in a manner such that to form a pattern on the substrate (e.g., a surface thereof). The pattern may be in the form of, for example, a grid, stripes, dots, welding marks, or any combination thereof. Multiple coatings of a blocking composition on the same substrate may form a split coat on a substrate. [00231] A slurry can be applied, deposited, or annealed adjacent to the substrate. A slurry can be deposited at a temperature of about 0 °C, 25 °C, 50 °C, 75 °C, 100 °C, 200 °C, 300 °C, 400 °C, 500 °C, 600 °C, 700 °C, 800 °C, 900 °C, or 1000 °C, or a range (inclusive) between any two of the foregoing. A slurry can be deposited at a temperature of at least about 0 °C, 25 °C, 50 °C, 75 °C, 100 °C, 200 °C, 300 °C, 400 °C, 500 °C, 600 °C, 700 °C, 800 °C, 900 °C, or 1000 °C or more. A slurry can be deposited at a temperature of no more than about 1000°C, 900 °C, 800 °C, 700 °C, 600 °C, 500 °C, 400 °C, 300 °C, 200 °C, 100 °C, 75 °C, 50 °C, 25 °C, or no more than about 0 °C or less. A slurry can be deposited at a temperature from about 0 °C to 1000 °C. A slurry can be deposited at a temperature from about 10 °C to 100 °C. A slurry can be deposited at a temperature from about 100 °C to 500°C. A slurry can be deposited at a temperature from about 500 °C to 1000 °C. [00232] Deposition of a slurry on a substrate may occur in an atmosphere with a relative humidity of about 0%, 5%, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 95%, or about 99%, or a range (inclusive) between any two of the foregoing. Deposition of a slurry on a substrate may occur in an atmosphere with a relative humidity of at least about 0%, 5%, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 95%, or at least about 99% or more. Deposition of a slurry on a substrate may occur in an atmosphere with a relative humidity of no more than about 99%, 95%, 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, or no more than about 5% or less. Deposition of a slurry on a substrate may occur in an atmosphere with a relative humidity of about 0% to about 10%, about 10% to about 99%, about 10% to about 50%, or about 50% to about 99%. Deposition of a slurry on a substrate may occur in an atmosphere with absolute levels of moisture of at least about 0.5 torr, 1 torr, 2 torr, 5 torr, 10 torr, 20 torr, 50 torr, 100 torr, 250 torr, or at least about 500 torr or more. Deposition of a slurry on a substrate may occur in an atmosphere with absolute levels of moisture of no more than about 760 torr, 500 torr, 250 torr, 100 torr, 50 torr, 20 torr, 10 torr, 5 torr, 2 torr, 1 torr, or 0.5 torr or less. Deposition of a slurry on a substrate may occur in an atmosphere with absolute levels of moisture of about 0.5 torr to about 760 torr, about 1 torr to about 200 torr, or about 10 torr to about 500 torr. In some embodiments, the relative humidity is about 50% during deposition of a slurry composition. [00233] Deposition of a slurry on a substrate may occur in an atmosphere with levels of oxygen greater than or equal to about 0.001 torr, 0.01 torr, 0.05 torr, 0.1 torr, 0.5 torr, 1 torr, 2 torr, 5 torr, 10 torr, or greater than about 20 torr or more. Deposition of a slurry on a substrate may occur in an atmosphere with levels of oxygen of no more than about 20 torr, 10 torr, 5 torr, 2 torr, 1 torr, 0.5 torr, 0.1 torr, 0.05 torr, 0.01 torr, 0.005 torr, or 0.001 torr or less. Deposition of a slurry on a substrate may occur in an atmosphere with levels of oxygen of about 0.001 torr to about 20 torr, about 0.001 torr to about 0.1 torr, about 0.1 torr to about 10 torr, about 0.01 torr to about 0.2 torr, or about 0.2 torr to about 20 torr. Drying a slurry on a substrate may occur in ambient air conditions. [00234] Annealing of the slurry on the substrate may occur in an atmosphere with low levels of oxygen, such as no more than about 0.5 torr, 0.1 torr, 0.05 torr, 0.01 torr, 0.005 torr, or 0.001 torr or less. Annealing of the slurry on the substrate may occur in an atmosphere with levels of oxygen greater than about 0.001 torr, 0.005 torr, 0.01 torr, 0.05 torr, 0.1 torr, or greater than about 0.5 torr or more. Annealing of the slurry on the substrate may occur in an atmosphere with levels of oxygen about 0.001 torr to about 0.5 torr, about 0.001 torr to about 0.01 torr, about 0.01 torr to about 0.1 torr, about 0.005 torr to about 0.05 torr, or about 0.05 torr to about 0.5 torr. [00235] Drying of a slurry coating (e.g., wet film) to form a dry film may occur in an atmosphere with levels of hydrogen greater than about 0.001 torr, 0.005 torr, 0.01 torr, 0.05 torr, or greater than or about 0.1 torr or more. Drying of a slurry coating (e.g., wet film) on a substrate may occur in an atmosphere with levels of hydrogen less than or about 0.1 torr, 0.05 torr, 0.01 torr, 0.005 torr, or 0.001 torr or less. Annealing of an alloying agent in a slurry coating on a substrate may occur in an atmosphere of pure hydrogen, pure argon, or a mixture of hydrogen and argon. [00236] After the slurry is applied to the substrate, the solvent in the slurry composition may be removed by heating, vaporization, vacuuming, or any combination thereof. After the solvent is driven off, the substrate may be recoiled. The slurry coated substrate may be incubated or stored under vacuum or atmospheric conditions after deposition and prior to annealing. This occurs prior to annealing and may be useful in removing residual contaminants from the coating, for example, solvent or binder leftover from the coating process. The incubation period may be about 10 seconds, 20 seconds, 30 seconds, 40 seconds, 50 seconds, 1 minute, 2 minutes, 3 minutes, 4 minutes, or 5 minutes. The incubation period may be at least about 10 seconds, 20 seconds, 30 seconds, 40 seconds, 50 seconds, 1 minute, 2 minutes, 3 minutes, 4 minutes, or 5 minutes or more. The incubation period may be no more than about 5 minutes, 4 minutes, 3 minutes, 2 minutes, 1 minute, 50 seconds, 40 seconds, 30 seconds, 20 seconds, or no more than about 10 seconds or less. The incubation period may be the time between coating and annealing, and may be the length of time used to transport the coated article to the heat treatment facility or equipment. For example, the incubation period may last for about 10 seconds, about 30 seconds, about 1 minute, about 2 minutes, about 3 minutes, about 4 minutes, or about 5 minutes. The incubation temperature may be about 50°C, 75°C, 100°C, 125°C, 150°C, 175°C, 200°C, 225°C, 250°C, 275°C, or about 300°C, or a range (inclusive) between any two of the foregoing. The incubation temperature may be at least about 50°C, 75°C, 100°C, 125°C, 150°C, 175°C, 200°C, 225°C, 250°C, 275°C, or at least about 300°C or more. The incubation temperature may be no more than about 300°C, 275°C, 250°C, 225°C, 200°C, 175°C, 150°C, 125°C, 100°C, 75°C, or no more than about 50°C or less. The incubation temperature may range from about 50 °C to about 300 °C. For example, the incubation temperature may be greater than about 50 °C, about 75 °C, about 100 °C, about 125 °C, about 150 °C, about 175 °C, about 200 °C, about 225 °C, about 250 °C, about 275 °C, or about 300 °C or more. The incubation temperature may be about 50°C to about 300 °C, 50°C to about 100 °C, 100°C to about 100 °C, or 100°C to about 300 °C. After incubating, and prior to annealing, the dry film of slurry on the substrate can be maintained under vacuum conditions. The coating may be dry to the touch immediately following the drying step after the roll-coating process. Absorbed water or other contaminants may be present with the coating anytime between roll coating and annealing. [00237] A spatially-segregated alloy may be deposited on the surface of a metal substrate using an alloying metal that has been generated in situ from its metal oxide utilizing a metallothermic reduction (or reducing) reaction. The metallothermic reduction reaction may occur when a thermodynamically less stable metal oxide is brought in the presence of a reducing metal agent that forms a thermodynamically more stable metal oxide. A reducing metal agent may comprise any elemental species, including iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, niobium and combinations thereof. [00238] In some embodiments, a metallothermic reduction may be initiated or enhanced by a metal transport activator. A reducing metal compound may be selected such that its Gibbs free energy of formation for its corresponding metal oxide is relatively large, e.g. aluminum to aluminum oxide. Such reducing metals may serve as effective oxygen and water scavengers, thereby eliminating oxidizing species that would hinder the forward reaction of the metal oxide with an activator compound. An example of an overall metallothermic reduction reaction may comprise the reaction of chromium oxide with aluminum metal, such as: wherein the above-described reaction may be a source for the deposition of chromium on the surface of a substrate. The utilization of metal oxides as a source material for deposition may eliminate the use of additional inert powders in the reaction that act as scaffolds for the diffusion alloying and as separators for alloying metal powders during sintering processes. The defect rate of the resultant diffusion alloyed may be reduced, for example, by including a secondary elemental powder, or alloying the reducing element with a species that increases the melting point of the reducing element to a temperature higher than that used for deposition. The resultant metal oxide from reaction of the reducing metal agent may be more easily removed by a post-thermal treatment cleaning process. The spatially-segregated alloy may comprise an alloying agent on a net shape part such as the inner diameter of metal tubes, rods, wires or other formats. [00239] A slurry composition on the surface of a substrate may comprise a alloying agent applied to the surface of the substrate. The slurry may comprise a metal oxide powder, a reducing metal agent, a metal halide precursor, or a solvent. A slurry comprising a metal oxide powder may be optimized for its chemical and rheological properties. Increased rheological control may provide more uniform coating, including the reduction of unwanted rheological effects such as ribbing, cascading, or other defects, and increased surface coverage on the surface of a substrate, and may lead to increased utilization of the metal. A slurry composition may be adjusted based at least upon the relative concentrations of components, the particle size of components, the pH, the ionic strength, reduced sedimentation, the slurry yield strength, the slurry viscosity and any other properties that may affect the performance of the slurry as a source for depositing a alloying agent on a substrate surface. [00240] Pairs of metal oxides and reducing metal agents may be selected based upon a large Gibbs free energy of formation for a metallothermic reduction reaction between the metal oxide and the reducing metal agent. In some cases, a metal oxide and a reducing metal agent may undergo a spontaneous metallothermic reduction reaction. A metallothermic reduction reaction may have a Gibbs free energy of formation of at least about -50 kJ, -100 kJ, -150 kJ, -200 kJ, -250 kJ, -300 kJ, - 350 kJ, - 400 kJ, -450 kJ, -500 kJ, -550 kJ, -600 kJ, -650 kJ, -700 kJ, - 750 kJ, -800 kJ, -850 kJ, -900 kJ, -950 kJ, - 1000 kJ, or more than about -1000 kJ. A metallothermic reduction reaction may have a Gibbs free energy of formation of no more than about -1000 kJ, -950 kJ, -900 kJ, -850 kJ, -800 kJ, - 750 kJ, -700 kJ, -650 kJ, -600 kJ, -550 kJ, -500 kJ, -450 kJ, -400 kJ, - 350 kJ, -300 kJ, -250 kJ, -200 kJ, -150 kJ, -100 kJ, - 50 kJ or less than about -50 kJ. A metallothermic reduction reaction may have a Gibbs free energy of formation of about -50 kJ to about -1000 kJ, about -50 kJ to about -500 kJ, or about -500 kJ to about - 1000 kJ. Metal Coils and Methods Related Thereto [00241] Also provided herein is a metal coil wound in a plurality of metal wraps the metal coil comprising a plurality of metal wraps with a slurry coating composition as described above, for example, the diffusion alloying composition as described above, being configured in a wrap-to-wrap spacing between a plurality of wraps thereof. In some embodiments, the metal coil is a spiral metal coil. [00242] Also provided herein is a metal coil wound in a plurality of metal wraps, and the metal coil comprises a first metal wrap, a neighboring second metal wrap thereof, and a slurry coating composition as described above, for example, the diffusion alloying composition as described above, provided between the first and second metal wraps. [00243] The present disclosure provides methods for forming a metal coil. A slurry composition can be applied or deposited adjacent to the substrate (e.g., a surface thereof) to form a metal coated substrate. The coated metal substrate may then be wound (e.g., coiled) to form a metal coil. The metal coil may be annealed to form a diffusion-alloyed metal coil. The metal coil may (e.g., a spiral metal coil) wound in a plurality of metal wraps, the metal coil may comprise a first metal wrap, a neighboring second metal wrap thereof, and a slurry coating composition (e.g., a diffusion alloying composition) provided between the first and second metal wraps. [00244] A slurry coated substrate may be subjected to winding (e.g., coiling) to form a metal coil (e.g., a spiral metal coil). The metal coil may comprise a plurality of metal wraps. FIG.6 shows an exemplary metal coil comprising a coiled substrate 601 and a slurry coating 603. The slurry coating 603 may be configured to be in a space (e.g., 602) between two wraps of the coiled substrate (e.g., 601a and 602b). The slurry coating 603 may be wrapped in between two or more wraps (e.g., 601a and 601b) of substrate in the metal coil. [00245] A wrap-to-wrap spacing in a metal coil may be a distance between two consecutive wraps of a substrate in a metal coil. For example, in FIG.6 the distance 602 between the substrate wrap 601and 601b may be an exemplary wrap-to-wrap spacing in metal coil 600. A wrap-to-wrap spacing in a metal coil may be at most about 1.5 times (e.g., less than 1.2 times) of an average dry film thickness of the slurry coating composition. The wrap-to-wrap spacing in a metal coil may be at most about 1.4 times, about 1.3 times, about 1.2 times, about 1.1 times, about 1.0 times, about 0.9 times, about 0.8 times, or about 0.7 times of the average dry film thickness of the slurry coating composition. [00246] A wrap-to-wrap spacing in a metal coil may be between about 85 µm to about 350 µm. In some embodiments, the wrap-to-wrap spacing in the metal coil may be about 85 µm to about 90 µm, about 85 µm to about 100 µm, about 85 µm to about 150 µm, about 85 µm to about 200 µm, about 85 µm to about 250 µm, about 85 µm to about 350 µm, about 90 µm to about 100 µm, about 90 µm to about 150 µm, about 90 µm to about 200 µm, about 90 µm to about 250 µm, about 90 µm to about 350 µm, about 100 µm to about 150 µm, about 100 µm to about 200 µm, about 100 µm to about 250 µm, about 100 µm to about 350 µm, about 150 µm to about 200 µm, about 150 µm to about 250 µm, about 150 µm to about 350 µm, about 200 µm to about 250 µm, about 200 µm to about 350 µm, or about 250 µm to about 350 µm. In some embodiments, the wrap-to-wrap spacing in the metal coil may be about 85 µm, about 90 µm, about 100 µm, about 150 µm, about 200 µm, about 250 µm, or about 350 µm. In some embodiments, the wrap-to-wrap spacing in the metal coil may be at least about 85 µm, about 90 µm, about 100 µm, about 150 µm, about 200 µm, about 250 µm, about 350 µm, or more. In some embodiments, the wrap-to-wrap spacing in the metal coil may be at most about 350 µm, about 250 µm, about 200 µm, about 150 µm, about 100 µm, about 90 µm, about 85 µm, or less. [00247] In some embodiments, a metal coil may comprise a plurality of metal wraps comprising a first metal wrap, a neighboring second metal wrap thereof. In some embodiments, the first metal wrap may comprise a first side surface facing towards the second metal wrap, and the second metal wrap may comprise a second side surface facing towards the first metal wrap. A spacing (e.g., an average spacing, or a shortest distance), along a radial direction of the metal coil, between the first and the second side surfaces may be of about 60 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meter) to about 120 µm. In some embodiments, the spacing may be about 60 µm to about 100 µm. In some embodiments, the spacing may be about 60 µm to about 65 µm, about 60 µm to about 70 µm, about 60 µm to about 75 µm, about 60 µm to about 80 µm, about 60 µm to about 85 µm, about 60 µm to about 90 µm, about 60 µm to about 95 µm, about 60 µm to about 100 µm, about 65 µm to about 70 µm, about 65 µm to about 75 µm, about 65 µm to about 80 µm, about 65 µm to about 85 µm, about 65 µm to about 90 µm, about 65 µm to about 95 µm, about 65 µm to about 100 µm, about 70 µm to about 75 µm, about 70 µm to about 80 µm, about 70 µm to about 85 µm, about 70 µm to about 90 µm, about 70 µm to about 95 µm, about 70 µm to about 100 µm, about 75 µm to about 80 µm, about 75 µm to about 85 µm, about 75 µm to about 90 µm, about 75 µm to about 95 µm, about 75 µm to about 100 µm, about 80 µm to about 85 µm, about 80 µm to about 90 µm, about 80 µm to about 95 µm, about 80 µm to about 100 µm, about 85 µm to about 90 µm, about 85 µm to about 95 µm, about 85 µm to about 100 µm, about 90 µm to about 95 µm, about 90 µm to about 100 µm, or about 95 µm to about 100 µm. In some embodiments, the spacing may be about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 80 µm, about 85 µm, about 90 µm, about 95 µm, or about 100 µm. In some embodiments, the spacing may be at least about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 80 µm, about 85 µm, about 90 µm, about 95 µm, about 100 µm or more. In some embodiments, the spacing may be at most about 100 µm, about 95 µm, about 90 µm, about 85 µm, about 80 µm, about 75 µm, about 70 µm, about 65 µm, about 60 µm, or less. [00248] A slurry coated substrate may be subjected to winding (e.g., coiling) at a winding temperature. The winding temperature may increase formability of the coated slurry, reduce the force necessary to wind (e.g., coil) a slurry coated substrate to form a metal coil, and/or to reduce delamination of the slurry from the surface of the substrate. A winding temperature may be between about 10 degree Celsius (°C) to about 200 °C. A winding temperature may be about 10 °C to about 30 °C, about 10 °C to about 50 °C, about 10 °C to about 70 °C, about 10 °C to about 90 °C, about 10 °C to about 110 °C, about 10 °C to about 140 °C, about 10 °C to about 170 °C, about 10 °C to about 200 °C, about 30 °C to about 50 °C, about 30 °C to about 70 °C, about 30 °C to about 90 °C, about 30 °C to about 110 °C, about 30 °C to about 140 °C, about 30 °C to about 170 °C, about 30 °C to about 200 °C, about 50 °C to about 70 °C, about 50 °C to about 90 °C, about 50 °C to about 110 °C, about 50 °C to about 140 °C, about 50 °C to about 170 °C, about 50 °C to about 200 °C, about 70 °C to about 90 °C, about 70 °C to about 110 °C, about 70 °C to about 140 °C, about 70 °C to about 170 °C, about 70 °C to about 200 °C, about 90 °C to about 110 °C, about 90 °C to about 140 °C, about 90 °C to about 170 °C, about 90 °C to about 200 °C, about 110 °C to about 140 °C, about 110 °C to about 170 °C, about 110 °C to about 200 °C, about 140 °C to about 170 °C, about 140 °C to about 200 °C, or about 170 °C to about 200 °C. A winding temperature may be of about 10 °C, about 30 °C, about 50 °C, about 70 °C, about 90 °C, about 110 °C, about 140 °C, about 170 °C, or about 200 °C. A winding temperature may be at least about 10 °C, about 30 °C, about 50 °C, about 70 °C, about 90 °C, about 110 °C, about 140 °C, about 170 °C, about 200 °C, or more. A winding temperature may be at least about 170 °C, about 140 °C, about 110 °C, about 90 °C, about 70 °C, about 50 °C, about 30 °C, about 10 °C, or less. [00249] The slurry coated substrate may have a robust coating that substantially eliminates a delamination of the slurry from the surface of the substrate. The slurry coating may have a robust coating with no substantial delamination during and after the winding to form a metal coil. The slurry coating may be robust even in relatively lower winding temperatures. [00250] A slurry coating (e.g., film) applied to a substrate may comprise a wet slurry mixture comprising a solvent (e.g., water or alcohol (e.g., C ₁ -C ₁₂ alcohol, such as C ₁ -C ₆ alcohol))). The solvent may be removed from the slurry after the slurry coating is applied to the substrate to form a dry slurry coating (e.g., dry film). In order to remove the solvent from the slurry after applying the slurry to a substrate surface, the wet slurry coating (e.g., wet film) may be subjected to drying using heat or negative pressure (e.g., vacuum) or a combination thereof. [00251] A wet film of the slurry composition applied to a substrate surface may have a thickness of about 50 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meter) to about 500 µm. A wet film may have a thickness of about 50 µm to about 450 µm, about 50 µm to about 400 µm, about 50 µm to about 350 µm, about 50 µm to about 300 µm, about 50 µm to about 300 µm, about 100 µm to about 250 µm, about 100 µm to about 500 µm, about 100 µm to about 400 µm, about 100 µm to about 300 µm, about 150 µm to about 300 µm. A wet film may have a thickness of about 50 µm to about 210 µm, about 50 µm to about 200 µm, about 50 µm to about 150 µm, about 50 µm to about 160 µm, about 50 µm to about 165 µm, about 50 µm to about 170 µm, about 50 µm to about 175 µm, about 50 µm to about 177 µm, about 50 µm to about 180 µm, about 50 µm to about 185 µm, about 50 µm to about 190 µm, about 210 µm to about 200 µm, about 210 µm to about 150 µm, about 210 µm to about 160 µm, about 210 µm to about 165 µm, about 210 µm to about 170 µm, about 210 µm to about 175 µm, about 210 µm to about 177 µm, about 210 µm to about 180 µm, about 210 µm to about 185 µm, about 210 µm to about 190 µm, about 200 µm to about 150 µm, about 200 µm to about 160 µm, about 200 µm to about 165 µm, about 200 µm to about 170 µm, about 200 µm to about 175 µm, about 200 µm to about 177 µm, about 200 µm to about 180 µm, about 200 µm to about 185 µm, about 200 µm to about 190 µm, about 150 µm to about 160 µm, about 150 µm to about 165 µm, about 150 µm to about 170 µm, about 150 µm to about 175 µm, about 150 µm to about 177 µm, about 150 µm to about 180 µm, about 150 µm to about 185 µm, about 150 µm to about 190 µm, about 160 µm to about 165 µm, about 160 µm to about 170 µm, about 160 µm to about 175 µm, about 160 µm to about 177 µm, about 160 µm to about 180 µm, about 160 µm to about 185 µm, about 160 µm to about 190 µm, about 165 µm to about 170 µm, about 165 µm to about 175 µm, about 165 µm to about 177 µm, about 165 µm to about 180 µm, about 165 µm to about 185 µm, about 165 µm to about 190 µm, about 170 µm to about 175 µm, about 170 µm to about 177 µm, about 170 µm to about 180 µm, about 170 µm to about 185 µm, about 170 µm to about 190 µm, about 175 µm to about 177 µm, about 175 µm to about 180 µm, about 175 µm to about 185 µm, about 175 µm to about 190 µm, about 177 µm to about 180 µm, about 177 µm to about 185 µm, about 177 µm to about 190 µm, about 180 µm to about 185 µm, about 180 µm to about 190 µm, or about 185 µm to about 190 µm. A wet film may have a thickness of about 50 µm, about 210 µm, about 200 µm, about 150 µm, about 160 µm, about 165 µm, about 170 µm, about 175 µm, about 177 µm, about 180 µm, about 185 µm, about 190 µm, about 300 µm, or about 500 µm. A wet film may have a thickness of at least about 50 µm, about 150 µm, about 160 µm, about 165 µm, about 170 µm, about 175 µm, about 177 µm, about 180 µm, about 185 µm, about 190 µm, about 195 µm, about 210 µm, about 200 µm, about 300 µm, about 500 µm, or more. A wet film may have a thickness of at most about 500 µm, about 300 µm, about 210 µm, about 200 µm, 195 µm, about 190 µm, about 185 µm, about 180 µm, about 177 µm, about 175 µm, about 170 µm, about 165 µm, about 160 µm, about 150 µm, about 50 µm, or less. A thickness of the wet film of the slurry composition applied to a surface of a substrate may optionally have a relative standard deviation of 10% or less (e.g., a standard deviation of about 15 µm or less, about 10 µm or less, or about 8 µm or less). [00252] A wet film of the slurry composition applied to a substrate surface may be died to form a dry film. A thickness of the dry film on a substrate may be between about 50 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meter) to about 250 µm. a thickness of the dry film on a substrate may be between about 50 µm to about 150 µm, about 60 µm to about 100 µm, about 50 µm to about 60 µm, about 50 µm to about 65 µm, about 50 µm to about 70 µm, about 50 µm to about 75 µm, about 50 µm to about 77 µm, about 50 µm to about 80 µm, about 50 µm to about 83 µm, about 50 µm to about 85 µm, about 50 µm to about 90 µm, about 50 µm to about 95 µm, about 50 µm to about 150 µm, about 60 µm to about 65 µm, about 60 µm to about 70 µm, about 60 µm to about 75 µm, about 60 µm to about 77 µm, about 60 µm to about 80 µm, about 60 µm to about 83 µm, about 60 µm to about 85 µm, about 60 µm to about 90 µm, about 60 µm to about 95 µm, about 60 µm to about 150 µm, about 65 µm to about 70 µm, about 65 µm to about 75 µm, about 65 µm to about 77 µm, about 65 µm to about 80 µm, about 65 µm to about 83 µm, about 65 µm to about 85 µm, about 65 µm to about 90 µm, about 65 µm to about 95 µm, about 65 µm to about 150 µm, about 70 µm to about 75 µm, about 70 µm to about 77 µm, about 70 µm to about 80 µm, about 70 µm to about 83 µm, about 70 µm to about 85 µm, about 70 µm to about 90 µm, about 70 µm to about 95 µm, about 70 µm to about 150 µm, about 75 µm to about 77 µm, about 75 µm to about 80 µm, about 75 µm to about 83 µm, about 75 µm to about 85 µm, about 75 µm to about 90 µm, about 75 µm to about 95 µm, about 75 µm to about 150 µm, about 77 µm to about 80 µm, about 77 µm to about 83 µm, about 77 µm to about 85 µm, about 77 µm to about 90 µm, about 77 µm to about 95 µm, about 77 µm to about 150 µm, about 80 µm to about 83 µm, about 80 µm to about 85 µm, about 80 µm to about 90 µm, about 80 µm to about 95 µm, about 80 µm to about 150 µm, about 83 µm to about 85 µm, about 83 µm to about 90 µm, about 83 µm to about 95 µm, about 83 µm to about 150 µm, about 85 µm to about 90 µm, about 85 µm to about 95 µm, about 85 µm to about 150 µm, about 90 µm to about 95 µm, about 90 µm to about 150 µm, or about 95 µm to about 150 µm. A thickness of the dry film on a substrate may be about 50 µm, about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 77 µm, about 80 µm, about 83 µm, about 85 µm, about 90 µm, about 95 µm, about 150 µm, about 200 µm, or about 250 µm. A thickness of the dry film on a substrate may be at least about 50 µm, about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 77 µm, about 80 µm, about 83 µm, about 85 µm, about 90 µm, about 95 µm, about 150 µm, about 200 µm, about 250 µm. A thickness of the dry film on a substrate may be at most about 250 µm, about 200 µm, about 150 µm, about 95 µm, about 90 µm, about 85 µm, about 83 µm, about 80 µm, about 77 µm, about 75 µm, about 70 µm, about 65 µm, about 60 µm, about 50 µm, or less. A thickness of the dry film on a substrate may optionally have a relative standard deviation of 10% or less (e.g., a standard deviation of about 15 µm or less, about 10 µm or less, or about 8 µm or less). A thickness of the dry film on a substrate may optionally have a relative standard deviation of at most 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, or less. A thickness of the dry film on a substrate may optionally have a standard deviation of at most about 15 µm, 14 µm, 12 µm, 10 µm, 98 µm, 76 µm, 54 µm, 3 µm, 2 µm, 1 µm, or less. [00253] Also provided is a method for forming the metal coil described above, and the method comprises: (a) contacting or coating a metal substrate as described above with the slurry composition as described above to provide a coated metal substrate, which coated metal substrate comprising a slurry coating (such as a film) in contact with and at least partially covering a surface of the metal substrate, and the slurry composition and coating comprising the alloying agent as described above; and (b) winding the coated metal substrate at a winding to form the metal coil comprising a plurality of metal wraps with the slurry coating being configured between a plurality of wraps. In some embodiments, the winding comprises coiling, bending, flexing, and rewinding. In some embodiments, winding is performed at a temperature of about 10 °C to about 200 °C, about 10 °C to about 100 °C, or about 100 °C to about 200 °C. In some embodiments of the method for forming the metal coil, step (b) comprises passing the coated metal substrate through a plurality of rolls that (e.g., collectively) subject the coated metal substrate to a plurality of bending and unbending cycles. In some embodiments, the coated metal substrate is subject to at least about 5, 10, 15, or 20 times of bending and unbending cycles. [00254] In some embodiments, the method for forming the metal coil further comprises subjecting the metal coil to conditions in an alloying atmosphere that the alloying agent diffuses into and alloys with two neighboring metal wraps of the plurality of metal wraps to form a diffusion-alloyed metal coil. Diffusion Alloying [00255] The present disclosure provides methods for forming a diffusion-alloyed metal coil by subjecting a metal coil comprising a slurry coated substrate to annealing conditions sufficient to diffuse an alloying agent (e.g., element(s), or elemental species) from the slurry into the substrate. The annealing conditions may comprise an annealing temperature (or alloying temperature) and/or an annealing atmosphere (or alloying atmosphere) (e.g., comprising a reducing gas, such as hydrogen). [00256] An alloying agent (e.g., element), which alloying element is capable of diffusion into and alloying with a first and second metal wraps to form (i) a first diffusion layer metallurgically bonded to at least a portion of the first metal wrap and (ii) a second diffusion layer metallurgically bonded to at least a portion of the second metal wrap. [00257] A slurry coated substrate may be recoiled prior to annealing as described herein. The slurry coated substrate may be placed in a retort and subjected to a controlled atmosphere during heat treatment. Water may be removed. The vacuum may be pulled to force hydrogen between wraps. The annealing process may be via tight coil or loose coil annealing. Annealing the slurry layer coated substrate can allow the elemental species in the slurry to diffuse into or through the substrate. Less than about 100 wt%, 90 wt%, 80 wt%, 70 wt%, 60 wt%, 50 wt%, 40 wt%, 30 wt%, 20 wt%, 10 wt%, or 5 wt% or less of the elemental species may diffuse to or into the substrate upon annealing. At least about 5 wt%, 10 wt%, 20 wt%, 30 wt%, 40 wt%, 50 wt%, 60 wt%, 70 wt%, 80 wt%, or at least about 90 wt% or more of the elemental species may diffuse to or into the substrate upon annealing. Certain process conditions may afford about 1-5% of the elemental species diffusing from the coating into the substrate. Diffusion of the elemental species to the substrate may be aided by a component in the slurry layer. The annealing process may be a continuous annealing process. The annealing process may be a non-continuous annealing process. A slurry-coated substrate may undergo more than one annealing process to increase the utilization of an elemental species or alter the concentration gradient of an elemental species in the diffusion layer adjacent to the substrate. [00258] The substrate may be heated at a rate of greater than about 0.01 °C per second, 0.1 °C per second, 1 °C per second, 5 °C per second, 10 °C per second, 15 °C per second, 20 °C per second, 25 °C per second, or 30 °C per second or more. The substrate may be heated at a rate of greater than about 0.01 °C per minute, 0.1 °C per minute, 1 °C per minute, 5 °C per minute, 10 °C per minute, 15 °C per minute, 20 °C per minute, 25 °C per minute, or 30 °C per minute or more. The substrate may be heated at a rate of less than about 30 °C per minute, 25°C per minute, 20°C per minute, 15°C per minute, 10°C per minute, 5°C per minute, 1°C per minute, 0.1°C per minute, or less than about 0.01°C per minute or less. The substrate may be heated at a rate of less than about 30°C per second, 25°C per second, 20°C per second, 15°C per second, 10°C per second, 5°C per second, 1°C per second, 0.1°C per second, or less than about 0.01°C per second or less. The substrate that has been coated with a slurry can be annealed at a temperature of at least about 0 °C, 25 °C, 50 °C, 75 °C, 100 °C, 200 °C, 300 °C, 400 °C, 500 °C, 600 °C, 700 °C, 800 °C, 900 °C, 1000 °C, 1100 °C, 1200 °C, or 1300 °C or more. The annealing temperature may be no more than about 1300°C, 1200°C, 1100°C, 1000°C, 900°C, 800°C, 700°C, 600°C, 500°C, 400°C, 300°C, 200°C, 100°C, 75°C, 50°C, 25°C, or no more than about 0°C or less. The annealing temperature may be about 800 °C, 900 °C, 1000 °C, 1100 °C, 1200 °C, or 1300 °C. The heating temperature during annealing can be from about 800 °C to about 1300 °C, such as from about 900 °C to about 1000 °C. The annealing temperature can be about 900 °C, 925 °C, 950 °C or 1000°C. [00259] During heating, iron in a substrate or a slurry coating on the substrate may transition from ferrite to austenite. The temperature at which the transition occurs may be referred to as the ferrite- austenite transition temperature. The ferrite-austenite transition temperature of a substrate or a slurry composition may be no more than about 1600°C, 1500°C, 1400°C, 1300°C, 1200°C, 1100°C, 1000°C, 900°C, 800°C, 700°C, 600°C, or no more than about 500°C or less. The ferrite-austenite transition temperature of a substrate or slurry composition layer may be greater than about 500 °C, 600 °C, 700 °C, 800 °C, 900 °C, 1000 °C, 1100 °C, 1200 °C, 1300 °C, 1400 °C, 1500 °C, or 1600 °C or more. The ferrite- austenite transition temperature of a substrate may be about 900 °C, 1000 °C, 1100 °C, 1200 °C, or 1300 °C. The ferrite-austenite transition temperature of a substrate can be from about 900 °C to about 1300 °C, about 1000 °C to about 1200 °C, or about 1100 °C to about 1200 °C. [00260] The total annealing time may be about 5 hours, 10 hours, 20 hours, 40 hours, 60 hours, 80 hours, 100 hours, 120 hours, 140 hours, 160 hours, 180 hours, or about 200 hours. The total annealing time may be at least about 5 hours, 10 hours, 20 hours, 40 hours, 60 hours, 80 hours, 100 hours, 120 hours, 140 hours, 160 hours, 180 hours, or about 200 hours or more. The total annealing time may be less than about 200 hours, 180 hours, 160 hours, 140 hours, 120 hours, 100 hours, 80 hours, 60 hours, 40 hours, 20 hours, 10 hours, or less than about 5 hours or less. The total annealing time, including heating, can range from about 5 hours to about 200 hours. For example, the total annealing time can be more than about 5 hours, about 20 hours, about 40 hours, about 60 hours, about 80 hours, about 100 hours, about 120 hours, about 140 hours, about 160 hours, about 180 hours, or about 200 hours or more. The maximum temperature during the annealing process may be reached in about 1 hour to 100 hours. For example, the maximum temperature during the annealing process may be reached in about 1 hour, 10 hours, 20 hours, 30 hours, 40 hours, 50 hours, 60 hours, 70 hours, 80 hours, 90 hours, or 100 hours. The maximum temperature during the annealing process may be reached in at least about 1 hour, 10 hours, 20 hours, 30 hours, 40 hours, 50 hours, 60 hours, 70 hours, 80 hours, 90 hours, or at least about 100 hours or more. The maximum temperature during the annealing process may be reached in no more than about 100 hours, 90 hours, 80 hours, 70 hours, 60 hours, 50 hours, 40 hours, 30 hours, 20 hours, 10 hours, or no more than about 1 hour or less. In some cases, a substrate may be annealed at about 950 °C for at least about 5 hours. In some cases, a substrate may be annealed at about 950 °C for at least about 20 hours. In some cases, a substrate may be annealed at about 950 °C for at least about 40 hours. In some cases, a substrate may be annealed at about 900 °C for at least about 20 hours. In some cases, a substrate may be annealed at about 900 °C for at least about 40 hours. In some cases, a substrate may be annealed at about 900 °C for at least about 60 hours. In some cases, a substrate may be annealed at about 900 °C for at least about 80 hours. [00261] The annealing atmosphere may comprise a gaseous species such as an inert or reactive gas, for example, hydrogen, helium, methane, ethylene, nitrogen, or argon. The annealing atmosphere may comprise a mixture of gases. The annealing atmosphere can be a vacuum. To prevent loss of an elemental species during annealing, hydrochloric acid may be added to the annealing gas. Minimizing the partial pressure of a component in the slurry composition in the reactor at high temperatures may maintain a low deposition rate that is essential for minimizing or stopping the formation of Kirkendall pores. Adding too much of an acidic component in the slurry composition may also cause corrosion of the coating equipment or the substrate. [00262] After annealing, the diffusion alloyed metal coated substrate may be dried. The drying of the diffusion alloyed metal coated substrate may occur in a vacuum or near-vacuum atmosphere. The drying of the diffusion alloyed metal coated substrate may occur in an atmosphere of an inert gas. Examples of inert gas include hydrogen, helium, argon, nitrogen, or any combination thereof. [00263] The substrate may be cooled for a period of time after annealing. The cooling time can range from about 1 hour to about 100 hours. For example, the cooling time can be at least about 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, 10 hours, 15 hours, 20 hours, 25 hours, 30 hours, 35 hours, 40 hours, 50 hours, 60 hours, 70 hours, 80 hours, 90 hours, or at least about 100 hours or more. The cooling time can be less than about 100 hours, 90 hours, 80 hours, 70 hours, 60 hours, 50 hours, 40 hours, 35 hours, 25 hours, 20 hours, 15 hours, 10 hours, 9 hours, 8 hours, 7 hours, 6 hours, 5 hours, 4 hours, 3 hours, 2 hours, or less than about 1 hour or less. For example, the cooling time can be from about 1 hour to about 100 hours, from about 5 hours to about 50 hours, or from about 10 hours to about 20 hours. [00264] Large articles may have hot spots or cold spots during thermal treatment, where an article may be coated evenly but heated unevenly. Hot spots or cold spots may be indicated to control the diffusion of alloying element into the article as uniformly as possible. [00265] A slurry may comprise an alloying agent (e.g., a metal oxide). A metal oxide may comprise, but is not limited to, Al ₂ O ₃ , MgO, CaO, Cr ₂ O ₃ , TiO ₂ , FeCr ₂ O ₄ , SiO ₂ , Ta ₂ O ₅ , or MgCr ₂ O ₄ , or a combination thereof. A metal oxide may be formed in the diffusion layer by a metallothermic reduction reaction between an elemental metal and a thermodynamically less-stable metal oxide. Suitable pairs of elemental metals and thermodynamically less-stable metal oxides may be chosen from pairs whose Gibbs free energy of formation is reduced by an oxidation of the elemental metal by the metal oxide. The reduced metal oxide (e.g., alloying agent (e.g., chromium) may then be oxidized (e.g., to form a metal halide) in an acidic environment. The oxidized metal may then react with substrate or a component thereof to form an alloy (e.g., a ferroalloy (e.g., ferrochrome FeCr). An example of the reaction for generating an alloy may comprise the reaction of chromium with a substrate (e.g., iron), such as: [00266] The diffusion-alloyed metal coil formed by annealing an alloying agent and a substrate can be subjected to unwinding to uncoil the diffusion-alloyed metal coil. The diffusion-alloyed metal coil may comprise a first metal diffusion layer, a metal sheet, and/or a second metal diffusion layer. The metal sheet may be a substrate after being subjected to the annealing conditions. The first metal diffusion layer may be metallurgically bonded to a first side of the metal sheet. The second metal diffusion layer may be metallurgically bonded to a second side of the metal sheet. The first side of the metal sheet may be opposite to the second side of the metal sheet relative to the largest plain of the metal sheet. [00267] In some embodiments, a substrate or a surface thereof may be partially coated with a blocking layer comprising inert element(s). A slurry coating may be in contact with the blocking layer on the surface of the substrate. The blocking layer may be configured to be in between the slurry coating and the substrate. In some embodiments, the blocking layer may comprise a metal oxide. The blocking layer may prevent a slurry composition to anneal with the substrate. [00268] The metal coil may comprise a first blocking layer and a second blocking layer. In some embodiments, the first blocking layer may be provided between the slurry coating composition and one of the two neighboring metal wraps, or provided between the slurry coating composition and one of the first and second metal wraps. In some cases, the first blocking layer may be provided between the slurry coating composition and one of the first and second side surfaces. In some cases, the first blocking layer may be provided between the first and second side surfaces. In some embodiments, the second blocking layer may be provided between the slurry coating composition and the other one of the two neighboring metal wraps, or provided between the slurry coating composition and the other one of the first and/or second metal wraps. In some cases, the second blocking layer may be provided between the slurry coating composition and the other one of the first and second side surfaces. In some cases, the second blocking layer may be provided between the first and second side surfaces. [00269] A slurry coating may comprise an alloying agent (e.g., chromium or aluminum). In some embodiments, the slurry coating composition may comprise chromium (Cr) at a concentration of about 5% to about 50% by weight percentage (wt%) of the slurry coating composition. The chromium concentration may be about 5 wt% to about 45 wt% of the slurry coating composition. The chromium concentration may be about 5 wt% to about 7 wt%, about 5 wt% to about 10 wt%, about 5 wt% to about 12 wt%, about 5 wt% to about 15 wt%, about 5 wt% to about 20 wt%, about 5 wt% to about 25 wt%, about 5 wt% to about 30 wt%, about 5 wt% to about 35 wt%, about 5 wt% to about 40 wt%, about 5 wt% to about 45 wt%, about 7 wt% to about 10 wt%, about 7 wt% to about 12 wt%, about 7 wt% to about 15 wt%, about 7 wt% to about 20 wt%, about 7 wt% to about 25 wt%, about 7 wt% to about 30 wt%, about 7 wt% to about 35 wt%, about 7 wt% to about 40 wt%, about 7 wt% to about 45 wt%, about 10 wt% to about 12 wt%, about 10 wt% to about 15 wt%, about 10 wt% to about 20 wt%, about 10 wt% to about 25 wt%, about 10 wt% to about 30 wt%, about 10 wt% to about 35 wt%, about 10 wt% to about 40 wt%, about 10 wt% to about 45 wt%, about 12 wt% to about 15 wt%, about 12 wt% to about 20 wt%, about 12 wt% to about 25 wt%, about 12 wt% to about 30 wt%, about 12 wt% to about 35 wt%, about 12 wt% to about 40 wt%, about 12 wt% to about 45 wt%, about 15 wt% to about 20 wt%, about 15 wt% to about 25 wt%, about 15 wt% to about 30 wt%, about 15 wt% to about 35 wt%, about 15 wt% to about 40 wt%, about 15 wt% to about 45 wt%, about 20 wt% to about 25 wt%, about 20 wt% to about 30 wt%, about 20 wt% to about 35 wt%, about 20 wt% to about 40 wt%, about 20 wt% to about 45 wt%, about 25 wt% to about 30 wt%, about 25 wt% to about 35 wt%, about 25 wt% to about 40 wt%, about 25 wt% to about 45 wt%, about 30 wt% to about 35 wt%, about 30 wt% to about 40 wt%, about 30 wt% to about 45 wt%, about 35 wt% to about 40 wt%, about 35 wt% to about 45 wt%, or about 40 wt% to about 45 wt% of the slurry coating composition. The chromium concentration may be about 5 wt%, about 7 wt%, about 10 wt%, about 12 wt%, about 15 wt%, about 20 wt%, about 25 wt%, about 30 wt%, about 35 wt%, about 40 wt%, or about 45 wt% of the slurry coating composition. The chromium concentration may be more than about 5 wt%, about 7 wt%, about 10 wt%, about 12 wt%, about 15 wt%, about 20 wt%, about 25 wt%, about 30 wt%, about 35 wt%, about 40 wt%, or about 45 wt% of the slurry coating composition. The chromium concentration may be less than 45 wt%, about 40 wt%, about 35 wt%, about 30 wt%, about 25 wt%, about 20 wt%, about 15 wt%, about 12 wt%, about 10 wt%, about 7 wt%, or about 5 wt% of the slurry coating composition. In some embodiments, the slurry coating composition may comprise chromium (Cr) at a concentration of about 5% to about 50% (e.g., about 10% to about 45%, or about 12% to about 45%) by weight of the slurry coating composition. [00270] An alloying agent in a slurry may be configured to diffuse to the two neighboring metal wraps (e.g., 601a and 601b in FIG.6). The alloying agent may be configured to partially transport into at least one of the neighboring metal wraps. The alloying agent may be configured for transport into and alloying with the two neighboring metal wraps under an alloying condition comprising an alloying temperature (e.g., of about 750 degree Celsius diffusion-alloyed metal) to about 1100 °C) and an alloying atmosphere (e.g., comprising a reducing gas, such as hydrogen). [00271] In some embodiments, about 10 wt% to about 100 wt% of an alloying agent (e.g. chromium or aluminum) in a slurry may be configured for transport into and alloying with the two neighboring metal wraps, with the slurry in between the two metal wraps. In some embodiments, about 10 wt% to about 20 wt%, about 10 wt% to about 30 wt%, about 10 wt% to about 40 wt%, about 10 wt% to about 50 wt%, about 10 wt% to about 60 wt%, about 10 wt% to about 70 wt%, about 10 wt% to about 80 wt%, about 10 wt% to about 90 wt%, about 10 wt% to about 100 wt%, about 20 wt% to about 30 wt%, about 20 wt% to about 40 wt%, about 20 wt% to about 50 wt%, about 20 wt% to about 60 wt%, about 20 wt% to about 70 wt%, about 20 wt% to about 80 wt%, about 20 wt% to about 90 wt%, about 20 wt% to about 100 wt%, about 30 wt% to about 40 wt%, about 30 wt% to about 50 wt%, about 30 wt% to about 60 wt%, about 30 wt% to about 70 wt%, about 30 wt% to about 80 wt%, about 30 wt% to about 90 wt%, about 30 wt% to about 100 wt%, about 40 wt% to about 50 wt%, about 40 wt% to about 60 wt%, about 40 wt% to about 70 wt%, about 40 wt% to about 80 wt%, about 40 wt% to about 90 wt%, about 40 wt% to about 100 wt%, about 50 wt% to about 60 wt%, about 50 wt% to about 70 wt%, about 50 wt% to about 80 wt%, about 50 wt% to about 90 wt%, about 50 wt% to about 100 wt%, about 60 wt% to about 70 wt%, about 60 wt% to about 80 wt%, about 60 wt% to about 90 wt%, about 60 wt% to about 100 wt%, about 70 wt% to about 80 wt%, about 70 wt% to about 90 wt%, about 70 wt% to about 100 wt%, about 80 wt% to about 90 wt%, about 80 wt% to about 100 wt%, or about 90 wt% to about 100 wt%. In some embodiments, about 10 wt%, about 20 wt%, about 30 wt%, about 40 wt%, about 50 wt%, about 60 wt%, about 70 wt%, about 80 wt%, about 90 wt%, or about 100 wt% of an alloying agent in a slurry may be configured for transport into and alloying with the two neighboring metal wraps. In some embodiments, at least about 10 wt%, about 20 wt%, about 30 wt%, about 40 wt%, about 50 wt%, about 60 wt%, about 70 wt%, about 80 wt%, 90 wt%, or about 100 wt% of an alloying agent in a slurry may be configured for transport into and alloying with the two neighboring metal wraps. In some embodiments, at most about 100 wt%, about 90 wt%, about 80 wt%, about 70 wt%, about 60 wt%, about 50 wt%, about 40 wt%, about 30 wt%, about 20 wt%, about 10 wt%, or less of an alloying agent in a slurry may be configured for transport into and alloying with the two neighboring metal wraps. [00272] A slurry coating may comprise a metal chloride species. A metal chloride species comprises a species selected from the group consisting of magnesium chloride (MgCl2), iron (II) chloride (FeCl2), calcium chloride (CaCl2), zirconium (IV) chloride (ZrCl4), titanium (IV) chloride (TiCl4), niobium (V) chloride (NbCl5), titanium (III) chloride (TiCl3), silicon tetrachloride (SiCl4), vanadium (III) chloride (VCl3), chromium (III) chloride (CrCl3), trichlorosilance (SiHCl3), manganese (II) chloride (MnCl2), chromium (II) chloride (CrCl2), cobalt (II) chloride (CoCl2), copper (II) chloride (CuCl2), nickel (II) chloride (NiCl2), vanadium (II) chloride (VCl2), ammonium chloride (NH4Cl), sodium chloride (NaCl), potassium chloride (KCl), bismuth oxychloride (BiOCl), copper hydroxychloride, manganese hydroxychloride, antimony oxychloride, and molybdenum trichloride, and combinations thereof. [00273] A metal coil formed by winding (e.g., coiling) a slurry coated substrate, may comprise an inner diameter, an outer diameter, a width, and/or a thickness. FIG.6 illustrates an exemplary metal coil with an inner diameter 606, an outer diameter 607, a width 608, and a thickness 609. [00274] In some embodiment, the metal coil may have an average inner diameter of about 100 millimeters (mm) to about 700 mm. In some embodiment, the metal coil may have an average inner diameter of about 100 mm to about 150 mm, about 100 mm to about 200 mm, about 100 mm to about 250 mm, about 100 mm to about 300 mm, about 100 mm to about 350 mm, about 100 mm to about 400 mm, about 100 mm to about 450 mm, about 100 mm to about 500 mm, about 100 mm to about 600 mm, about 100 mm to about 700 mm, about 150 mm to about 200 mm, about 150 mm to about 250 mm, about 150 mm to about 300 mm, about 150 mm to about 350 mm, about 150 mm to about 400 mm, about 150 mm to about 450 mm, about 150 mm to about 500 mm, about 150 mm to about 600 mm, about 150 mm to about 700 mm, about 200 mm to about 250 mm, about 200 mm to about 300 mm, about 200 mm to about 350 mm, about 200 mm to about 400 mm, about 200 mm to about 450 mm, about 200 mm to about 500 mm, about 200 mm to about 600 mm, about 200 mm to about 700 mm, about 250 mm to about 300 mm, about 250 mm to about 350 mm, about 250 mm to about 400 mm, about 250 mm to about 450 mm, about 250 mm to about 500 mm, about 250 mm to about 600 mm, about 250 mm to about 700 mm, about 300 mm to about 350 mm, about 300 mm to about 400 mm, about 300 mm to about 450 mm, about 300 mm to about 500 mm, about 300 mm to about 600 mm, about 300 mm to about 700 mm, about 350 mm to about 400 mm, about 350 mm to about 450 mm, about 350 mm to about 500 mm, about 350 mm to about 600 mm, about 350 mm to about 700 mm, about 400 mm to about 450 mm, about 400 mm to about 500 mm, about 400 mm to about 600 mm, about 400 mm to about 700 mm, about 450 mm to about 500 mm, about 450 mm to about 600 mm, about 450 mm to about 700 mm, about 500 mm to about 600 mm, about 500 mm to about 700 mm, or about 600 mm to about 700 mm. In some embodiment, the metal coil may have an average inner diameter of about 100 mm, about 150 mm, about 200 mm, about 250 mm, about 300 mm, about 350 mm, about 400 mm, about 450 mm, about 500 mm, about 600 mm, or about 700 mm. In some embodiment, the metal coil may have an average inner diameter of at least about 100 mm, about 150 mm, about 200 mm, about 250 mm, about 300 mm, about 350 mm, about 400 mm, about 450 mm, about 500 mm, about 600 mm, about 700 mm, or more. In some embodiment, the metal coil may have an average inner diameter of at most about 700 mm, about 600 mm, about 500 mm, about 450 mm, about 400 mm, about 350 mm, about 300 mm, about 250 mm, about 200 mm, about 150 mm, about 100 mm, or less. [00275] In some embodiment, the metal coil may have an average outer diameter of about 0.5 meters (m) to about 10 m. In some embodiment, the metal coil may have an average outer diameter of about 0.5 m to about 1 m, about 0.5 m to about 1.5 m, about 0.5 m to about 2 m, about 0.5 m to about 2.5 m, about 0.5 m to about 3 m, about 0.5 m to about 3.5 m, about 0.5 m to about 4 m, about 0.5 m to about 4.5 m, about 0.5 m to about 5 m, about 0.5 m to about 7 m, about 0.5 m to about 10 m, about 1 m to about 1.5 m, about 1 m to about 2 m, about 1 m to about 2.5 m, about 1 m to about 3 m, about 1 m to about 3.5 m, about 1 m to about 4 m, about 1 m to about 4.5 m, about 1 m to about 5 m, about 1 m to about 7 m, about 1 m to about 10 m, about 1.5 m to about 2 m, about 1.5 m to about 2.5 m, about 1.5 m to about 3 m, about 1.5 m to about 3.5 m, about 1.5 m to about 4 m, about 1.5 m to about 4.5 m, about 1.5 m to about 5 m, about 1.5 m to about 7 m, about 1.5 m to about 10 m, about 2 m to about 2.5 m, about 2 m to about 3 m, about 2 m to about 3.5 m, about 2 m to about 4 m, about 2 m to about 4.5 m, about 2 m to about 5 m, about 2 m to about 7 m, about 2 m to about 10 m, about 2.5 m to about 3 m, about 2.5 m to about 3.5 m, about 2.5 m to about 4 m, about 2.5 m to about 4.5 m, about 2.5 m to about 5 m, about 2.5 m to about 7 m, about 2.5 m to about 10 m, about 3 m to about 3.5 m, about 3 m to about 4 m, about 3 m to about 4.5 m, about 3 m to about 5 m, about 3 m to about 7 m, about 3 m to about 10 m, about 3.5 m to about 4 m, about 3.5 m to about 4.5 m, about 3.5 m to about 5 m, about 3.5 m to about 7 m, about 3.5 m to about 10 m, about 4 m to about 4.5 m, about 4 m to about 5 m, about 4 m to about 7 m, about 4 m to about 10 m, about 4.5 m to about 5 m, about 4.5 m to about 7 m, about 4.5 m to about 10 m, about 5 m to about 7 m, about 5 m to about 10 m, or about 7 m to about 10 m. In some embodiment, the metal coil may have an average outer diameter of about 0.5 m, about 1 m, about 1.5 m, about 2 m, about 2.5 m, about 3 m, about 3.5 m, about 4 m, about 4.5 m, about 5 m, about 7 m, or about 10 m. In some embodiment, the metal coil may have an average outer diameter of at least about 0.5 m, about 1 m, about 1.5 m, about 2 m, about 2.5 m, about 3 m, about 3.5 m, about 4 m, about 4.5 m, about 5 m, about 7 m, about 10 m or more. In some embodiment, the metal coil may have an average outer diameter of at most about 10 m, about 7 m, about 5 m, about 4 m, about 3.5 m, about 3 m, about 2.5 m, about 2 m, about 1.5 m, about 1 m, about 0.5 m, or less. [00276] In some embodiment, the metal coil may an average width of about 200 millimeters (mm) to about 2,000 mm. In some embodiment, the metal coil may an average width of about 200 mm to about 400 mm, about 200 mm to about 800 mm, about 200 mm to about 1,000 mm, about 200 mm to about 1,200 mm, about 200 mm to about 1,500 mm, about 200 mm to about 1,700 mm, about 200 mm to about 2,000 mm, about 400 mm to about 800 mm, about 400 mm to about 1,000 mm, about 400 mm to about 1,200 mm, about 400 mm to about 1,500 mm, about 400 mm to about 1,700 mm, about 400 mm to about 2,000 mm, about 800 mm to about 1,000 mm, about 800 mm to about 1,200 mm, about 800 mm to about 1,500 mm, about 800 mm to about 1,700 mm, about 800 mm to about 2,000 mm, about 1,000 mm to about 1,200 mm, about 1,000 mm to about 1,500 mm, about 1,000 mm to about 1,700 mm, about 1,000 mm to about 2,000 mm, about 1,200 mm to about 1,500 mm, about 1,200 mm to about 1,700 mm, about 1,200 mm to about 2,000 mm, about 1,500 mm to about 1,700 mm, about 1,500 mm to about 2,000 mm, or about 1,700 mm to about 2,000 mm. In some embodiment, the metal coil may an average width of about 200 mm, about 400 mm, about 800 mm, about 1,000 mm, about 1,200 mm, about 1,500 mm, about 1,700 mm, or about 2,000 mm. In some embodiment, the metal coil may an average width of at least about 200 mm, about 400 mm, about 800 mm, about 1,000 mm, about 1,200 mm, about 1,500 mm, about 1,700 mm, about 2,000 mm, or more. In some embodiment, the metal coil may an average width of at most about 400 mm, about 800 mm, about 1,000 mm, about 1,200 mm, about 1,500 mm, about 1,700 mm, or about 2,000 mm. [00277] In some embodiment, the metal coil may an average width of about 0.001 inch (in) (i.e., 1 inch = 2.54 centimeters) to about 10 in. In some embodiment, the metal coil may an average width of about 0.001 in to about 0.01 in, about 0.001 in to about 0.1 in, about 0.001 in to about 1 in, about 0.001 in to about 10 in, about 0.01 in to about 0.1 in, about 0.01 in to about 1 in, about 0.01 in to about 10 in, about 0.1 in to about 1 in, about 0.1 in to about 10 in, or about 1 in to about 10 in. In some embodiment, the metal coil may an average width of about 0.001 in, about 0.01 in, about 0.1 in, about 1 in, or about 10 in. In some embodiment, the metal coil may an average width of at least about 0.001 in, about 0.01 in, about 0.1 in, about 1 in, about 10 in or more. In some embodiment, the metal coil may an average width of at most about 10 in, about 1 in, about 0.1 in, about 0.01 in, or more. [00278] The metal coil may comprise a plurality of metal wraps. Each metal wrap in the plurality of metal wraps may have a thickness (e.g., an average thickness or average gauge thickness). In some embodiments, a metal wrap may have a thickness (e.g., an average thickness or average gauge thickness) of about 0.0005 inch (in) (i.e., 1 inch = 2.54 centimeters) to about 0.250 in. In some embodiments, a metal wrap may have a thickness of about 0.0005 in to about 0.25 in. In some embodiments, a metal wrap may have a thickness of about 0.0005 in to about 0.001 in, about 0.0005 in to about 0.005 in, about 0.0005 in to about 0.01 in, about 0.0005 in to about 0.05 in, about 0.0005 in to about 0.1 in, about 0.0005 in to about 0.2 in, about 0.0005 in to about 0.25 in, about 0.001 in to about 0.005 in, about 0.001 in to about 0.01 in, about 0.001 in to about 0.05 in, about 0.001 in to about 0.1 in, about 0.001 in to about 0.2 in, about 0.001 in to about 0.25 in, about 0.005 in to about 0.01 in, about 0.005 in to about 0.05 in, about 0.005 in to about 0.1 in, about 0.005 in to about 0.2 in, about 0.005 in to about 0.25 in, about 0.01 in to about 0.05 in, about 0.01 in to about 0.1 in, about 0.01 in to about 0.2 in, about 0.01 in to about 0.25 in, about 0.05 in to about 0.1 in, about 0.05 in to about 0.2 in, about 0.05 in to about 0.25 in, about 0.1 in to about 0.2 in, about 0.1 in to about 0.25 in, or about 0.2 in to about 0.25 in. In some embodiments, a metal wrap may have a thickness of about 0.0005 in, about 0.001 in, about 0.005 in, about 0.01 in, about 0.05 in, about 0.1 in, about 0.2 in, or about 0.25 in. In some embodiments, a metal wrap may have a thickness of at least about 0.0005 in, about 0.001 in, about 0.005 in, about 0.01 in, about 0.05 in, about 0.1 in, about 0.2 in, about 0.25 in or more. In some embodiments, a metal wrap may have a thickness of at most about 0.25 in, about 0.2 in, about 0.1 in, about 0.05 in, about 0.01 in, about 0.005 in, about 0.001 in, about 0.0005 in or less. Post-Treatment [00279] A diffusion-alloyed metal coil, formed by annealing an alloying agent with the substrate metal in a metal coil, may be subjected to unwinding (e.g., uncoiling, leveling or flattening) to uncoil the diffusion-alloyed metal coil (e.g., a diffusion-alloyed metal). [00280] A residue may remain on the substrate after the annealing process. Certain components in the diffusion-alloyed metal coil may be consumed or removed (e.g., deposited on the walls of the retort), or a concentration of certain components may reduce due to its diffusion to or into the substrate. However, after annealing, other residue in the form of, e.g., a powder, may remain on the substrate. The residue may comprise the inert material from the diffusion-alloyed layer. This residue may be removed prior to further processing. The reaction can be purged with HCl gas to halt the reaction. The purging with HCl gas can allow for the formation of a flat profile. In some embodiments, a plurality of sintered particles (e.g., surface-sintered particles) may remain on the surface of a metal diffusion layer(s). Any residues(s) (e.g., powder or surface-sintered particles) formed through and after the annealing may be removed using mechanical treatments (e.g., polishing). Chemical treatments ay be used to polish the surface of the metal diffusion layer(s) (or the surface layer). Metal material and method related thereto [00281] The present disclosure provides a metal material (e.g., diffusion alloyed metal) comprising a metal diffusion layer metallurgically bonded with a core layer (or a substrate). The metal diffusion layer may comprise diffusion a frontier boundary and a core layer. The metal material may further comprise a surface layer metallurgically bonded with the core layer through the metal diffusion layer. The metal diffusion layer may be formed using the methods described herein for forming a diffusion alloyed metal coil. The diffusion frontier boundary may be formed proximate thereto with the core layer (or the substrate). The metal material may be characterized by measuring or testing a plurality of properties of the material. In some embodiments, a yield, a tensile strength, an elongation, an r-value, or an n-value of the metal material may be characterized. In some embodiments, at least one, two, three, four, or at least five of these properties may be used to characterize the metal material. In some embodiments, a metal material may be characterized by at least a tensile strength, an r-value, or both. [00282] A set of properties of a metal material (e.g., diffusion alloyed metal) after annealing may be measured. These properties may include, for example, a chemical composition, a yield strength, a tensile strength (e.g., ultimate tensile strength), an elongation, an n-value, and/or an r-value. [00283] After annealing a metal diffusion layer to metallurgically bond with a core layer (or substrate), the core layer (or substrate) may have a measurable grain size. Grain size may be measured and recorded in accordance to the American Society of the International Association for Testing and Materials (ASTM) standard. The substrate may have a grain size of about ASTM 000, 00, 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 39, or 30. The substrate (or core layer) may have a grain size greater than about ASTM 000, 00, 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 39, or 30 or more. The substrate may have a grain size of no more than about 30, 29, 28, 27, 26, 25, 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0, 00, or no more than about 000 or less. In some cases, a substrate may have a grain size from about ASTM 000 to about ASTM 30, from about ASTM 5 to about ASTM 16, from about ASTM 6 to about ASTM 14, or from about ASTM 8 to about ASTM 12. A substrate may have a grain size from about ASTM 7 to ASTM 9. A substrate may have a grain size about ASTM 7. Using the methods described herein, a metal material thicker than 50 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meter) may be formed while still retaining fine grains (>7 ASTM grain size) in the substrate (or core layer). The grades developed and presented above are grades that may not be standard grades. The grades may be useful for high temperature annealing or high temperature applications not pertaining to metallizing processes. [00284] A metal diffusion layer in a metal material may comprise columnar grains. A percentage of the volume of the columnar grains relative to the volume of the metal diffusion layer (vol%) may be determined using microscopy (e.g., scanning electron microscopy (SEM) or optical microscopy (OM)). In some embodiments, at least about 80% by volume (vol%) of the metal diffusion layer may be columnar grains. In some embodiments, at least about 85 vol% of the metal diffusion layer may be columnar grains. In some embodiments, at least about 90 vol% of the metal diffusion layer may be columnar grains. In some embodiments, at least about 95 vol% of the metal diffusion layer may be columnar grains. In some embodiments, at least about 99 vol% of the metal diffusion layer may be columnar grains. In some embodiments, a vol% of the columnar grains, described herein, in a metal diffusion layer may be at a temperature of about 1 degree Celsius (°C) to about 50 °C. In some embodiments, a vol% of the columnar grains, described herein, in a metal diffusion layer may be at a temperature of about 5 °C to about 45 °C, about 10 °C to about 40 °C, about 15 °C to about 35 °C, or about 20 °C to about 30 °C. [00285] A core layer (or substrate) in a metal material may comprise equiaxed grains. A size of the equiaxed grains in the core layer and/or a percentage of the volume of the equiaxed grains relative to the volume of the core layer (or substrate) (vol%) may be determined using microscopy (e.g., scanning electron microscopy (SEM) or optical microscopy (OM)). In some embodiments, at least about 80% by volume (vol%) of the core layer (or substrate) may be equiaxed grains. In some embodiments, at least about 85 vol% of the core layer (or substrate) may be equiaxed grains. In some embodiments, at least about 90 vol% of the core layer (or substrate) may be equiaxed grains. In some embodiments, at least about 95 vol% of the core layer (or substrate) may be equiaxed grains. In some embodiments, at least about 99 vol% of the core layer (or substrate) may be equiaxed grains. In some embodiments, a vol% of the equiaxed grains in a core layer may be determined at a temperature of about 1 degree Celsius (°C) to about 50 °C. In some embodiments, a vol% of the equiaxed grains in a core layer, as described herein, may be at a temperature of about 750 °C to about 1100 °C, 800 °C to about 1050 °C, about 850 °C to about 1000°C, or about 900 °C to about 950 °C. The equiaxed grains in the core layer determined using methods and conditions described herein may have an average American Society for Testing and Materials (ASTM) grain size of at most about ASTM 7, ASTM 6, ASTM 5, ASTM 4, ASTM 3, ASTM 2, ASTM 1, ASTM 0, ASTM 00, or ASTM 000. [00286] A metal diffusion layer may comprise a diffusion frontier boundary. The columnar grains in the metal diffusion layer may be oriented relative to a diffusion frontier boundary. The orientation of the columnar grains in the metal diffusion layer may be determined using microscopy (e.g., electron microscopy (SEM) or optical microscopy (OM)). The columnar grains in the metal diffusion layer may be oriented substantially perpendicular or substantially normal to the surface of the diffusion frontier boundary. The columnar grains in the metal diffusion layer may be oriented relative to a diffusion frontier boundary at an angle between about 80 degrees (°) to about 100°. In some embodiments, the columnar grains in the metal diffusion layer may be oriented relative to a diffusion frontier boundary at an angle between about 85° to about 95°, about 87° to about 93°, about 89° to about 91°. In some embodiments, the columnar grains in the metal diffusion layer may be oriented relative to a diffusion frontier boundary at an angle of about 90° (or perpendicular). Optionally, the columnar grains may have an orientation relative to one another, for example a first columnar grain may be oriented relative to a second columnar grain at an angle of about 10° or less. In some embodiments, a difference between orientation(s) of two columnar grains may be at most about 10°, 9°, 8°, 7°, 6°, 5°, 4°, 3°, 2°, 1°, or less. [00287] The columnar grains in the metal diffusion layer may be ferritic at a temperature. In some embodiments, the columnar grains in the metal diffusion layer may be ferritic at a temperature of about 1 degree Celsius (°C) to about 50 °C. In some embodiments, the columnar grains in the metal diffusion layer may be ferritic at a temperature of about 5 °C to about 45 °C, about 10 °C to about 40 °C, about 15 °C to about 35 °C, or about 20 °C to about 30 °C. In some embodiments, the columnar grains may be ferritic at a temperature of about 750 degree Celsius (°C) to about 1100 °C. In some embodiments, the columnar grains may be ferritic at a temperature of about 800 °C to about 1050 °C, about 850 °C to about 1000°C, or about 900 °C to about 950 °C. [00288] An equiaxed grain in a metal material (e.g., in a core layer) may have a grain dimension (e.g., an average grain length or an average grain width) that can be determined using scanning electron microscopy (SEM) or optical microscopy (OM). In some embodiments, the equiaxed grains may have a grain dimension of about 2 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meter) to about 200 µm. In some embodiments, the equiaxed grains may have a grain dimension of about 2 µm to about 10 µm, about 2 µm to about 20 µm, about 2 µm to about 50 µm, about 2 µm to about 100 µm, about 2 µm to about 150 µm, about 2 µm to about 200 µm, about 10 µm to about 20 µm, about 10 µm to about 50 µm, about 10 µm to about 100 µm, about 10 µm to about 150 µm, about 10 µm to about 200 µm, about 20 µm to about 50 µm, about 20 µm to about 100 µm, about 20 µm to about 150 µm, about 20 µm to about 200 µm, about 50 µm to about 100 µm, about 50 µm to about 150 µm, about 50 µm to about 200 µm, about 100 µm to about 150 µm, about 100 µm to about 200 µm, or about 150 µm to about 200 µm. In some embodiments, the equiaxed grains may have a grain dimension of about 2 µm, about 10 µm, about 20 µm, about 50 µm, about 100 µm, about 150 µm, or about 200 µm. In some embodiments, the equiaxed grains may have a grain dimension of at least about 2 µm, about 10 µm, about 20 µm, about 50 µm, about 100 µm, about 150 µm, about 200 µm or more. In some embodiments, the equiaxed grains may have a grain dimension of at most about 200 µm, about 150 µm, about 100 µm, about 50 µm, about 20 µm, about 10 µm, about 2 µm, or less. [00289] In some embodiments, the equiaxed grains in the core layer (or substrate) may have any arbitrary orientation. In some embodiments, the equiaxed grains in the core layer (or substrate) may not have a preferred orientation. The orientation of the equiaxed grains in the core layer (or substrate) may be determined using scanning electron microscopy (SEM) or optical microscopy (OM). [00290] The equiaxed grains in the core layer (or substrate) may be ferritic at a temperature of about 1 degree Celsius (°C) to about 50 °C. In some embodiments, the equiaxed grains in the core layer (or substrate) may be ferritic at a temperature of about 5 °C to about 45 °C, about 10 °C to about 40 °C, about 15 °C to about 35 °C, or about 20 °C to about 30 °C. [00291] Optionally, the equiaxed grains in the core layer (or substrate) may be austenitic at a temperature of about 750 degree Celsius (°C) to about 1100 °C. In some embodiments, the equiaxed grains in the core layer (or substrate) may be austenitic at a temperature of about 800 °C to about 1050 °C, about 850 °C to about 1000°C, or about 900 °C to about 950 °C. [00292] A metal material may comprise a surface layer metallurgically bonded with a core layer through a metal diffusion layer. The surface layer may, optionally, comprise chromium (Cr) at a concentration determined as weight percentage (wt %) by using scanning electron microscopy-energy dispersive X-Ray spectroscopy (SEM-EDS), X-ray fluorescence (XRF), or glow discharge mass spectrometry (GDMS). In some embodiments, the chromium concentration in the surface layer may be about 20 wt% to about 45 wt%. In some embodiments, the chromium concentration in the surface layer may be about 30 wt% to about 45 wt%. In some embodiments, the chromium concentration in the surface layer may be about 20 wt% to about 25 wt%, about 20 wt% to about 30 wt%, about 20 wt% to about 35 wt%, about 20 wt% to about 40 wt%, about 20 wt% to about 45 wt%, about 25 wt% to about 30 wt%, about 25 wt% to about 35 wt%, about 25 wt% to about 40 wt%, about 25 wt% to about 45 wt%, about 30 wt% to about 35 wt%, about 30 wt% to about 40 wt%, about 30 wt% to about 45 wt%, about 35 wt% to about 40 wt%, about 35 wt% to about 45 wt%, or about 40 wt% to about 45 wt%. In some embodiments, the chromium concentration in the surface layer may be about 20 wt%, about 25 wt%, about 30 wt%, about 35 wt%, about 40 wt%, or about 45 wt%. In some embodiments, the chromium concentration in the surface layer may be at least about 20 wt%, about 25 wt%, about 30 wt%, about 35 wt%, about 40 wt%, about 45 wt%, or more. In some embodiments, the chromium concentration in the surface layer may be at most about 45 wt%, 40 wt%, 35 wt%, 30 wt%, 25 wt%, 20 wt%, or less. [00293] The concentration of the chromium in the surface layer may vary across the surface of the surface layer. In some embodiments, the chromium concentration may vary across the surface of the surface layer by less than about 10%. In some embodiments, the chromium concentration may vary across the surface of the surface layer by less than about 5%. In some embodiments, the chromium concentration may vary across the surface of the surface layer by less than about 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, or less. [00294] A metal diffusion layer in the metal material may comprise chromium at a concentration determined as weight percentage (wt %) by using scanning electron microscopy-energy dispersive X-Ray spectroscopy (SEM-EDS), X-ray fluorescence (XRF), or glow discharge mass spectrometry (GDMS). In some embodiments, the chromium concentration in the metal diffusion layer may be about 12 wt% to about 45 wt%. In some embodiments, the chromium concentration in the surface layer may be about 12 wt% to about 15 wt%, about 12 wt% to about 20 wt%, about 12 wt% to about 25 wt%, about 12 wt% to about 30 wt%, about 12 wt% to about 35 wt%, about 12 wt% to about 40 wt%, about 12 wt% to about 45 wt%, about 15 wt% to about 20 wt%, about 15 wt% to about 25 wt%, about 15 wt% to about 30 wt%, about 15 wt% to about 35 wt%, about 15 wt% to about 40 wt%, about 15 wt% to about 45 wt%, about 20 wt% to about 25 wt%, about 20 wt% to about 30 wt%, about 20 wt% to about 35 wt%, about 20 wt% to about 40 wt%, about 20 wt% to about 45 wt%, about 25 wt% to about 30 wt%, about 25 wt% to about 35 wt%, about 25 wt% to about 40 wt%, about 25 wt% to about 45 wt%, about 30 wt% to about 35 wt%, about 30 wt% to about 40 wt%, about 30 wt% to about 45 wt%, about 35 wt% to about 40 wt%, about 35 wt% to about 45 wt%, or about 40 wt% to about 45 wt%. In some embodiments, the chromium concentration in the metal diffusion layer may be about 12 wt%, about 15 wt%, 20 wt%, about 25 wt%, about 30 wt%, about 35 wt%, about 40 wt%, or about 45 wt%. In some embodiments, the chromium concentration in the metal diffusion layer may be at least about 12 wt%, about 15 wt%, 20 wt%, about 25 wt%, about 30 wt%, about 35 wt%, about 40 wt%, about 45 wt%, or more. In some embodiments, the chromium concentration in the metal diffusion layer may be at most about 45 wt%, 40 wt%, 35 wt%, 30 wt%, 25 wt%, 20 wt%, 15 wt%, 12 wt%, or less. [00295] The concentration of the chromium in the metal diffusion layer may vary along a direction from the surface layer towards the diffusion frontier boundary. In some embodiments, the chromium concentration may vary along a direction from the surface layer towards the diffusion frontier boundary by less than about 5%. In some embodiments, the chromium concentration may vary along a direction from the surface layer towards the diffusion frontier boundary by less than about 4%, 3%, 2%, 1%, or less. [00296] A metal material may have a pitting potential measured by applying current to the metal material. Pitting potential can refer to a minimum positive current and/or voltage at which a pit(s) develops or grow on a metal material surface layer. This may be an electrochemical potential in a given environment above which a corrosion pit may initiate on the surface layer. The pitting potential of a metal material may be determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., G61). A pit may refer to a form of extremely localized corrosion that may lead to the creation of small holes in the metal. In some embodiments, the metal material may have a pitting potential of about 50 mV to about 800 mV. In some embodiments, the metal material may have a pitting potential of about 50 mV to about 100 mV, about 50 mV to about 150 mV, about 50 mV to about 200 mV, about 50 mV to about 250 mV, about 50 mV to about 300 mV, about 50 mV to about 350 mV, about 50 mV to about 400 mV, about 50 mV to about 500 mV, about 50 mV to about 600 mV, about 50 mV to about 700 mV, about 50 mV to about 800 mV, about 100 mV to about 150 mV, about 100 mV to about 200 mV, about 100 mV to about 250 mV, about 100 mV to about 300 mV, about 100 mV to about 350 mV, about 100 mV to about 400 mV, about 100 mV to about 500 mV, about 100 mV to about 600 mV, about 100 mV to about 700 mV, about 100 mV to about 800 mV, about 150 mV to about 200 mV, about 150 mV to about 250 mV, about 150 mV to about 300 mV, about 150 mV to about 350 mV, about 150 mV to about 400 mV, about 150 mV to about 500 mV, about 150 mV to about 600 mV, about 150 mV to about 700 mV, about 150 mV to about 800 mV, about 200 mV to about 250 mV, about 200 mV to about 300 mV, about 200 mV to about 350 mV, about 200 mV to about 400 mV, about 200 mV to about 500 mV, about 200 mV to about 600 mV, about 200 mV to about 700 mV, about 200 mV to about 800 mV, about 250 mV to about 300 mV, about 250 mV to about 350 mV, about 250 mV to about 400 mV, about 250 mV to about 500 mV, about 250 mV to about 600 mV, about 250 mV to about 700 mV, about 250 mV to about 800 mV, about 300 mV to about 350 mV, about 300 mV to about 400 mV, about 300 mV to about 500 mV, about 300 mV to about 600 mV, about 300 mV to about 700 mV, about 300 mV to about 800 mV, about 350 mV to about 400 mV, about 350 mV to about 500 mV, about 350 mV to about 600 mV, about 350 mV to about 700 mV, about 350 mV to about 800 mV, about 400 mV to about 500 mV, about 400 mV to about 600 mV, about 400 mV to about 700 mV, about 400 mV to about 800 mV, about 500 mV to about 600 mV, about 500 mV to about 700 mV, about 500 mV to about 800 mV, about 600 mV to about 700 mV, about 600 mV to about 800 mV, or about 700 mV to about 800 mV. In some embodiments, the metal material may have a pitting potential of about 50 mV, about 100 mV, about 150 mV, about 200 mV, about 250 mV, about 300 mV, about 350 mV, about 400 mV, about 500 mV, about 600 mV, about 700 mV, or about 800 mV. In some embodiments, the metal material may have a pitting potential of at least about 50 mV, about 100 mV, about 150 mV, about 200 mV, about 250 mV, about 300 mV, about 350 mV, about 400 mV, about 500 mV, about 600 mV, about 700 mV, about 800 mV, or more. In some embodiments, the metal material may have a pitting potential of at most about 800 mV, about 700 mV, about 600 mV, about 500 mV, about 400 mV, about 350 mV, about 300 mV, about 250 mV, about 200 mV, about 150 mV, about 100 mV, about 50 mV, or less. [00297] A metal material comprising a core layer (or substrate), a diffusion layer, and/or a surface layer, as described herein, may have a thickness (e.g., an average thickness or average gauge thickness) of about 0.0005 inch (in) (i.e.) (1 inch = 2.54 centimeters) to about 0.250 in. In some embodiments, the metal material may have a thickness of about 0.0005 in to about 0.25 in. In some embodiments, the metal material may have a thickness of about 0.0005 in to about 0.001 in, about 0.0005 in to about 0.005 in, about 0.0005 in to about 0.01 in, about 0.0005 in to about 0.05 in, about 0.0005 in to about 0.1 in, about 0.0005 in to about 0.2 in, about 0.0005 in to about 0.25 in, about 0.001 in to about 0.005 in, about 0.001 in to about 0.01 in, about 0.001 in to about 0.05 in, about 0.001 in to about 0.1 in, about 0.001 in to about 0.2 in, about 0.001 in to about 0.25 in, about 0.005 in to about 0.01 in, about 0.005 in to about 0.05 in, about 0.005 in to about 0.1 in, about 0.005 in to about 0.2 in, about 0.005 in to about 0.25 in, about 0.01 in to about 0.05 in, about 0.01 in to about 0.1 in, about 0.01 in to about 0.2 in, about 0.01 in to about 0.25 in, about 0.05 in to about 0.1 in, about 0.05 in to about 0.2 in, about 0.05 in to about 0.25 in, about 0.1 in to about 0.2 in, about 0.1 in to about 0.25 in, or about 0.2 in to about 0.25 in. In some embodiments, the metal material may have a thickness of about 0.0005 in, about 0.001 in, about 0.005 in, about 0.01 in, about 0.05 in, about 0.1 in, about 0.2 in, or about 0.25 in. In some embodiments, the metal material may have a thickness of at least about 0.0005 in, about 0.001 in, about 0.005 in, about 0.01 in, about 0.05 in, about 0.1 in, about 0.2 in, about 0.25 in or more. In some embodiments, the metal material may have a thickness of at most about 0.25 in, about 0.2 in, about 0.1 in, about 0.05 in, about 0.01 in, about 0.005 in, about 0.001 in, about 0.0005 in or less. [00298] A metal diffusion layer may have a thickness of about 50 micrometers (µm) (i.e., 1 micrometer = 10 ^-6 meters) to about 100 µm. n some embodiments, the metal diffusion layer may have a thickness of about 50 µm to about 100 µm. In some embodiments, the metal diffusion layer may have a thickness of about 50 µm to about 55 µm, about 50 µm to about 60 µm, about 50 µm to about 65 µm, about 50 µm to about 70 µm, about 50 µm to about 75 µm, about 50 µm to about 80 µm, about 50 µm to about 85 µm, about 50 µm to about 90 µm, about 50 µm to about 95 µm, about 50 µm to about 100 µm, about 55 µm to about 60 µm, about 55 µm to about 65 µm, about 55 µm to about 70 µm, about 55 µm to about 75 µm, about 55 µm to about 80 µm, about 55 µm to about 85 µm, about 55 µm to about 90 µm, about 55 µm to about 95 µm, about 55 µm to about 100 µm, about 60 µm to about 65 µm, about 60 µm to about 70 µm, about 60 µm to about 75 µm, about 60 µm to about 80 µm, about 60 µm to about 85 µm, about 60 µm to about 90 µm, about 60 µm to about 95 µm, about 60 µm to about 100 µm, about 65 µm to about 70 µm, about 65 µm to about 75 µm, about 65 µm to about 80 µm, about 65 µm to about 85 µm, about 65 µm to about 90 µm, about 65 µm to about 95 µm, about 65 µm to about 100 µm, about 70 µm to about 75 µm, about 70 µm to about 80 µm, about 70 µm to about 85 µm, about 70 µm to about 90 µm, about 70 µm to about 95 µm, about 70 µm to about 100 µm, about 75 µm to about 80 µm, about 75 µm to about 85 µm, about 75 µm to about 90 µm, about 75 µm to about 95 µm, about 75 µm to about 100 µm, about 80 µm to about 85 µm, about 80 µm to about 90 µm, about 80 µm to about 95 µm, about 80 µm to about 100 µm, about 85 µm to about 90 µm, about 85 µm to about 95 µm, about 85 µm to about 100 µm, about 90 µm to about 95 µm, about 90 µm to about 100 µm, or about 95 µm to about 100 µm. In some embodiments, the metal diffusion layer may have a thickness of about 50 µm, about 55 µm, about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 80 µm, about 85 µm, about 90 µm, about 95 µm, or about 100 µm. In some embodiments, the metal diffusion layer may have a thickness of at least about 50 µm, about 55 µm, about 60 µm, about 65 µm, about 70 µm, about 75 µm, about 80 µm, about 85 µm, about 90 µm, about 95 µm, about 100 µm or more. In some embodiments, the metal diffusion layer may have a thickness of at most about 100 µm, about 95 µm, about 90 µm, about 85 µm, about 80 µm, about 75 µm, about 70 µm, about 65 µm, about 60 µm, about 55 µm, about 50 µm, or less. [00299] In some embodiments, a thickness ration of the metal diffusion layer to the metal material may be between about 70:500 to about 70:3000. In some embodiments the thickness ratio may be about 70:500 to about 70:2500, e.g., about 70:500 to about 70:2200. [00300] A metal material may be a metal sheet. A metal sheet may have a predefined width (e.g., an average width), a length (e.g., an average length) and a thickness. In some embodiments, the metal sheet may have a width (e.g., an average width) of 1 inch (in) (i.e., 1 inch = 2.54 centimeters) to about 100 in. In some embodiments, the metal sheet may have a width (e.g., an average width) of about 1 in to about 5 in, about 1 in to about 10 in, about 1 in to about 20 in, about 1 in to about 30 in, about 1 in to about 40 in, about 1 in to about 50 in, about 1 in to about 60 in, about 1 in to about 70 in, about 1 in to about 80 in, about 1 in to about 90 in, about 1 in to about 100 in, about 5 in to about 10 in, about 5 in to about 20 in, about 5 in to about 30 in, about 5 in to about 40 in, about 5 in to about 50 in, about 5 in to about 60 in, about 5 in to about 70 in, about 5 in to about 80 in, about 5 in to about 90 in, about 5 in to about 100 in, about 10 in to about 20 in, about 10 in to about 30 in, about 10 in to about 40 in, about 10 in to about 50 in, about 10 in to about 60 in, about 10 in to about 70 in, about 10 in to about 80 in, about 10 in to about 90 in, about 10 in to about 100 in, about 20 in to about 30 in, about 20 in to about 40 in, about 20 in to about 50 in, about 20 in to about 60 in, about 20 in to about 70 in, about 20 in to about 80 in, about 20 in to about 90 in, about 20 in to about 100 in, about 30 in to about 40 in, about 30 in to about 50 in, about 30 in to about 60 in, about 30 in to about 70 in, about 30 in to about 80 in, about 30 in to about 90 in, about 30 in to about 100 in, about 40 in to about 50 in, about 40 in to about 60 in, about 40 in to about 70 in, about 40 in to about 80 in, about 40 in to about 90 in, about 40 in to about 100 in, about 50 in to about 60 in, about 50 in to about 70 in, about 50 in to about 80 in, about 50 in to about 90 in, about 50 in to about 100 in, about 60 in to about 70 in, about 60 in to about 80 in, about 60 in to about 90 in, about 60 in to about 100 in, about 70 in to about 80 in, about 70 in to about 90 in, about 70 in to about 100 in, about 80 in to about 90 in, about 80 in to about 100 in, or about 90 in to about 100 in. In some embodiments, the metal sheet may have a width (e.g., an average width) of about 1 in, about 5 in, about 10 in, about 20 in, about 30 in, about 40 in, about 50 in, about 60 in, about 70 in, about 80 in, about 90 in, or about 100 in. In some embodiments, the metal sheet may have a width (e.g., an average width) of at least about 1 in, about 5 in, about 10 in, about 20 in, about 30 in, about 40 in, about 50 in, about 60 in, about 70 in, about 80 in, about 90 in, about 100 in or more. In some embodiments, the metal sheet may have a width (e.g., an average width) of at most about 100 in, about 90 in, about 80 in, about 70 in, about 60 in, about 50 in, about 40 in, about 30 in, about 20 in, about 10 in, about 5 in, about 1 in or less. [00301] In some embodiments, the metal sheet may have a length (e.g., an average length) of about 500 feet (ft) (i.e., 1 foot = 0.3048 meter) to about 20,000 ft. In some embodiments, the metal sheet may have a length (e.g., an average length) of about 500 ft to about 1,000 ft, about 500 ft to about 5,000 ft, about 500 ft to about 10,000 ft, about 500 ft to about 15,000 ft, about 500 ft to about 20,000 ft, about 1,000 ft to about 5,000 ft, about 1,000 ft to about 10,000 ft, about 1,000 ft to about 15,000 ft, about 1,000 ft to about 20,000 ft, about 5,000 ft to about 10,000 ft, about 5,000 ft to about 15,000 ft, about 5,000 ft to about 20,000 ft, about 10,000 ft to about 15,000 ft, about 10,000 ft to about 20,000 ft, or about 15,000 ft to about 20,000 ft. In some embodiments, the metal sheet may have a length (e.g., an average length) of about 500 ft, about 1,000 ft, about 5,000 ft, about 10,000 ft, about 15,000 ft, or about 20,000 ft. In some embodiments, the metal sheet may have a length (e.g., an average length) of at least about 500 ft, about 1,000 ft, about 5,000 ft, about 10,000 ft, about 15,000 ft, about 20,000 ft or more. In some embodiments, the metal sheet may have a length (e.g., an average length) of at most about 20,000 ft, about 15,000 ft, about 10,000 ft, about 5,000 ft, about 1,000 ft, about 500 ft, or less. [00302] A metal material may comprise a surface layer comprising a carbide (e.g., chromium carbide). A concentration of the carbide in the surface layer may be about 0.01 percent weight (wt%). In some embodiments, the concentration of the carbide in the surface layer may be at most about 0.01 wt%. In some embodiments, the concentration of the carbide in the surface layer may be at most about 0.001 wt%, at most about 0.0005 wt%, or at most about 0.0001 wt%. [00303] A metal material may comprise a metal diffusion layer (e.g., interstices between grains of the metal diffusion layer) comprising a carbide (e.g., chromium carbide). A concentration of the carbide in the metal diffusion layer may be about 0.1 percent weight (wt%). In some embodiments, the concentration of the carbide in the metal diffusion layer may be at most about 0.1 wt%. In some embodiments, the concentration of the carbide in the metal diffusion layer may be at most about 0.01 wt%, at most about 0.001 wt%, at most about 0.0005 wt%, or at most about 0.0001 wt%. [00304] An elemental species in the slurry may lower the transition temperature of austenite to ferrite. An elemental species in the substrate may lower the transition temperature of austenite to ferrite. An elemental species may not substantially change the transition temperature of austenite to ferrite. In some cases, an elemental species may raise the transition temperature of austenite to ferrite. An elemental species that may lower the transition temperature of austenite to ferrite can be manganese, nitrogen, copper or gold. [00305] The grain size of austenite and the grain size of ferrite may be measured. A ratio of austenite grain size to ferrite grain size may be greater than about 0.1, 0.5, 1, 2, 5, or 10 or more. A ratio of austenite grain size to ferrite grain size may be less than about 10, 5, 2, 10.5, or 0.1 or less. A ratio of austenite grain size to ferrite grain size may be about 0.1, 0.5, 1, 2, 5, or 10. A ratio of austenite grain size to ferrite grain size may be about 1. The ratio of grain size of austenite to grain size of ferrite may be calculated according to the following equation: Dγ /Dα =1+(0.0026 + 0.053wt%C + 0.006wt%Mn + 0.009wt%Nb + 4.23wt%V*N - 0.081wt%Ti)*(1.5+α ^1/2 )*D _γ wherein D _γ is the grain size of austenite in µm, D _α is the grain size of ferrite in µm, α is the cooling rate in °C/s. [00306] The amount of titanium equivalents stabilization may be calculated according to the following equation: Ti equivalents stabilization = wt%Ti – 3.42*wt%N – 1.49 wt%S – 4wt%C + 0.516wt%Nb. [00307] Without wishing to be bound by theory, a certain amount of titanium (Ti) equivalents stabilization in a metal layer that may give rise to a layer that is more resistant to grain boundary precipitation. A metal layer may comprise at least about 0.001 Ti equivalents, 0.005 Ti equivalents, 0.01 Ti equivalents, 0.015 Ti equivalents, 0.017 Ti equivalents, 0.02 Ti equivalents, 0.03 Ti equivalents, 0.04 Ti equivalents, 0.05 Ti equivalents, 0.06 Ti equivalents, 0.07 Ti equivalents, 0.08 Ti equivalents, 0.09 Ti equivalents, or more. A metal layer may comprise less than about 0.09 Ti equivalents, 0.08 Ti equivalents, 0.07 Ti equivalents, 0.06 Ti equivalents, 0.05 Ti equivalents, 0.04 Ti equivalents, 0.03 Ti equivalents, 0.02 Ti equivalents, 0.017 Ti equivalents, 0.015 Ti equivalents, 0.01 Ti equivalents, 0.005 Ti equivalents, or less than about 0.001 Ti equivalents or less. [00308] Properties of a substrate, prior to coating with a metal layer or after coating with a metal layer, may be determined by various techniques and instruments. Techniques and instruments include, for example, grain size calculations, scanning electron microscope (SEM), scanning electron microscope/ energy dispersive spectroscopy (SEM/EDS), microprobe analysis, and potentiostat measurements. [00309] The substrate can be substantially free of Kirkendall voids after annealing. The layer can impart characteristics on the substrate which the substrate did not previously contain. For example, the layer may make the substrate harder, more wear resistant, more aesthetically pleasing, more electrically resistive, less electrically resistive, more thermally conductive, less thermally conductive, or any combination thereof. In addition, the layer may cause the speed of sound in the substrate to be faster or slower. [00310] A yield (or yield strength) may be used to characterize a metal material. The yield in a metal material may be defined as an amount of stress a metal material (e.g., a diffusion alloyed metal) can withstand without permanent deformation. Yield strength may be the stress which can cause a permanent deformation of at least about 0.2% relative to an original dimension of the material before the stress was applied. The yield (or yield strength) of a substrate may be greater than about 100 psi, 1 ksi (kilopound per square inch (i.e.) (1 ksi = 6.8947572932 megapascal (MPa))), 2 ksi, 5 ksi, 10 ksi, 15 ksi, 19 ksi, 20 ksi, 21 ksi, 22 ksi, 23 ksi, 24 ksi, 25 ksi, 26 ksi, 27 ksi, 28 ksi, 29 ksi, 30 ksi, 31 ksi, 32 ksi, 33 ksi, 34 ksi, 35 ksi, 36 ksi, 37 ksi, 38 ksi, 39 ksi, or greater than about 40 ksi or more. The yield strength of a substrate may be less than or equal to about 40 ksi, 39 ksi, 38 ksi, 37 ksi, 36 ksi, 35 ksi, 34 ksi, 33 ksi, 32 ksi, 31 ksi, 30 ksi, 29 ksi, 28 ksi, 27 ksi, 26 ksi, 25 ksi, 24 ksi, 23 ksi, 22 ksi, 21 ksi, 20 ksi, 15 ksi, 10 ksi, 5 ksi, 2 ksi, 1 ksi, or less than or equal to about 100 psi or less. The yield strength of a substrate may be about 20 ksi, 21 ksi, 22 ksi, 23 ksi, 24 ksi, 25 ksi, 26 ksi, 27 ksi, 28 ksi, 29 ksi, 30 ksi, 31 ksi, 32 ksi, 33 ksi, 34 ksi, 35 ksi, 36 ksi, 37 ksi, 38 ksi, 39 ksi, 40 ksi, 45 ksi, or about 50 ksi. [00311] A tensile strength (or ultimate tensile strength) may be used to characterize a metal material. The tensile strength (or ultimate tensile strength) in a metal material may be defined as a maximum amount of tensile stress that the material can take before failure (e.g., breakage or fracture). The tensile strength may be defined as a metal material’s resistance to failure under tensile loading. The tensile strength (or ultimate tensile strength) of a metal material (e.g., a diffusion alloyed metal) may be greater than or equal to about 30 kilopounds per square inch (ksi) (i.e., 1 ksi = 6.8947572932 megapascal (MPa)), 35 ksi, 40 ksi, 42 ksi, 45 ksi, 46 ksi, 47 ksi, 48 ksi, 49 ksi, 50 ksi, 51 ksi, 52 ksi, 53 ksi, 54 ksi, 55 ksi, 56 ksi, 57 ksi, 58 ksi, 59 ksi, 60 ksi, 61 ksi, 62 ksi, 63 ksi, 64 ksi, 65 ksi, 66 ksi, 67 ksi, 68 ksi, 69 ksi, 70 ksi, 80 ksi, 90 ksi, 100 ksi, or more. The tensile strength (or ultimate tensile strength) of a metal material may be less than or equal to about 100 ksi, 90 ksi, 80 ksi, 70 ksi, 60 ksi, 59 ksi, 58 ksi, 57 ksi, 56 ksi, 55 ksi, 54 ksi, 53 ksi, 52 ksi, 51 ksi, 50 ksi, 49 ksi, 48 ksi, 47 ksi, 46 ksi, 45 ksi, 44 ksi, 43 ksi, 42 ksi, 41 ksi, 40 ksi, 35 ksi, or less than or equal to about 30 ksi. The tensile strength (or ultimate tensile strength) of a metal material may be about 30 ksi, 35 ksi, 40 ksi, 45 ksi, 46 ksi, 47 ksi, 48 ksi, 49 ksi, 50 ksi, 51 ksi, 52 ksi, 53 ksi, 54 ksi, 55 ksi, 56 ksi, 57 ksi, 58 ksi, 59 ksi, 60 ksi, 61 ksi, 62 ksi, 63 ksi, 64 ksi, 65 ksi, 66 ksi, 67 ksi, 68 ksi, 69 ksi, 70 ksi, 80 ksi, 90 ksi, 100 ksi, or more. [00312] A metal material may exhibit an elongation (or a percent elongation) defined as a maximum elongation of the gage divided by the original gage length, or the difference in distance prior to fracture before and after alloying and/or annealing. The percent elongation may be about 5%, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or 100%. In some cases, the percent elongation may be about 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%. In some cases, the percent elongation may be greater than about 5%, 10%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 60%,70%, 80%, 90%, or greater than about 100% or more. In some cases, the percent elongation may be less than about 100%, 90%, 80%, 70%, 60%, 50%, 44%, 40%, 39%, 38%, 37%, 36%, 35%, 34%, 33%, 32%, 31%, 30%, 29%, 28%, 27%, 26%, 25%, 24%, 23%, 22%, 21%, 20%, 10%, or less than about 5% or less. [00313] A parameter that may be measured to test the forming properties and performance of the metal material (e.g., a metal alloy) when drawn, stretched, or both is a strain hardening exponent or, herein referred to as n-value. The n-value may show a metal material’s (e.g., metal alloy) response to cold working. Cold working (e.g., cold reduction) is the plastic deformation of metal (e.g., metal alloy) below its recrystallization temperature and this is used in many manufacturing processes, such as wire drawing, forging and winding/coiling. As a ductile metal (e.g., metal alloy) is plastically deformed during cold working, it may become harder and stronger while its ductility decreases. The strain hardening exponent or n-value may show an indication of how much the metal (e.g., metal alloy) may harden or become stronger as it is plastically deformed. The n-value (n) may be calculated using a flow stress equation S = Ke ⁿ , which may approximate the relation between a true stress, S, and a true strain, e, during plastic deformation of a metal material. A metal material with a large n-value responds well to cold working. The n-value can play an important role for example in sheet metal forming. The larger the n value, the more the material can be elongated before necking. Thus, as the n-value increases, the metal material's resistance to necking increases, and the material can be stretched farther before necking starts. The n- value may be determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., E8, E18, E19, or a combination thereof). In some embodiments, the n-value may be about 0.21 to about 0.32. In some embodiments, the n-value may be about 0.2 to about 0.21, about 0.2 to about 0.23, about 0.2 to about 0.25, about 0.2 to about 0.27, about 0.2 to about 0.29, about 0.2 to about 0.3, about 0.2 to about 0.31, about 0.2 to about 0.32, about 0.2 to about 0.33, about 0.21 to about 0.23, about 0.21 to about 0.25, about 0.21 to about 0.27, about 0.21 to about 0.29, about 0.21 to about 0.3, about 0.21 to about 0.31, about 0.21 to about 0.32, about 0.21 to about 0.33, about 0.23 to about 0.25, about 0.23 to about 0.27, about 0.23 to about 0.29, about 0.23 to about 0.3, about 0.23 to about 0.31, about 0.23 to about 0.32, about 0.23 to about 0.33, about 0.25 to about 0.27, about 0.25 to about 0.29, about 0.25 to about 0.3, about 0.25 to about 0.31, about 0.25 to about 0.32, about 0.25 to about 0.33, about 0.27 to about 0.29, about 0.27 to about 0.3, about 0.27 to about 0.31, about 0.27 to about 0.32, about 0.27 to about 0.33, about 0.29 to about 0.3, about 0.29 to about 0.31, about 0.29 to about 0.32, about 0.29 to about 0.33, about 0.3 to about 0.31, about 0.3 to about 0.32, about 0.3 to about 0.33, about 0.31 to about 0.32, about 0.31 to about 0.33, or about 0.32 to about 0.33. In some embodiments, the n- value may be about 0.2, about 0.21, about 0.23, about 0.25, about 0.27, about 0.29, about 0.3, about 0.31, about 0.32, or about 0.33. In some embodiments, the n-value may be at least about 0.2, about 0.21, about 0.23, about 0.25, about 0.27, about 0.29, about 0.3, about 0.31, or more. In some embodiments, the n- value may be at most about 0.32, about 0.31, about 0.30, about 0.29, about 0.27, about 025, about 0.23, about 0.21, about 0.21, or less. [00314] A metal material may be characterized using forming properties and performance of the material (e.g., a metal alloy) when drawn, stretched, or both. The formability of a metal material (e.g., a steel) may be measured by the plastic strain ratio, often called the Lankford coefficient, r-bar, rm, or, herein referred to as the r-value. The r-value may be defined as the ratio of plastic strain in the plane of a sheet to the plastic strain of the gauge or thickness of the sheet. The r-value may be calculated as: wherein R0, R45 and R90 are the plastic strain ratio relative to the direction of the sheet. The r-value and/or n-value of a metal material (e.g., a steel) may be altered by the manipulation of the metal material chemistry and composition to create a highly formable metal material. A common, interstitial-free steel may have an r-value between about 1.4 and 1.8. An r-value may be determined according to an average American Society for Testing and Materials (ASTM) standard method (e.g., E8, E18, E19, or a combination thereof). An altered metal material (e.g., alloyed steel) may have an r-value exceeding about 2. In some embodiments, a metal material may have an r-value of about 1.8 to about 3. In some embodiments, a metal material may have an r-value of about 1.8 to about 1.9, about 1.8 to about 2, about 1.8 to about 2.1, about 1.8 to about 2.3, about 1.8 to about 2.5, about 1.8 to about 2.7, about 1.8 to about 2.9, about 1.8 to about 3, about 1.9 to about 2, about 1.9 to about 2.1, about 1.9 to about 2.3, about 1.9 to about 2.5, about 1.9 to about 2.7, about 1.9 to about 2.9, about 1.9 to about 3, about 2 to about 2.1, about 2 to about 2.3, about 2 to about 2.5, about 2 to about 2.7, about 2 to about 2.9, about 2 to about 3, about 2.1 to about 2.3, about 2.1 to about 2.5, about 2.1 to about 2.7, about 2.1 to about 2.9, about 2.1 to about 3, about 2.3 to about 2.5, about 2.3 to about 2.7, about 2.3 to about 2.9, about 2.3 to about 3, about 2.5 to about 2.7, about 2.5 to about 2.9, about 2.5 to about 3, about 2.7 to about 2.9, about 2.7 to about 3, or about 2.9 to about 3. In some embodiments, a metal material may have an r-value of about 1.8, about 1.9, about 2, about 2.1, about 2.3, about 2.5, about 2.7, about 2.9, or about 3. In some embodiments, a metal material may have an r-value of at least about 1.8, about 1.9, about 2, about 2.1, about 2.3, about 2.5, about 2.7, about 2.9, about 3.0 or more. In some embodiments, a metal material may have an r-value of at most about 3.0, about 2.9, about 2.7, about 2.5, about 2.3, about 2.1, about 2.0, about 1.9, about 1.8, or less. [00315] A substrate may exhibit a Ti/Nb stability. In some cases, the Ti/Nb stability may be greater than or equal to about 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.007, 0.008, 0.009, 0.010, 0.011, 0.012, 0.013, 0.014, 0.015, 0.016, 0.017, 0.018, 0.019, 0.020, 0.021, 0.022, 0.023, 0.024, 0.025, 0.026, 0.027, 0.028, 0.029, 0.030, 0.040 or more. In some cases, the Ti/Nb stability may be less than or equal to about 0.040, 0.030, 0.029, 0.028, 0.027, 0.026, 0.025, 0.024, 0.023, 0.022, 0.021, 0.020, 0.019, 0.018, 0.017, 0.016, 0.015, 0.014, 0.013, 0.012, 0.011, 0.010, 0.009, 0.008, 0.007, 0.006, 0.005, 0.004, 0.003, 0.002, 0.001, or less. In some cases, the Ti/Nb stability may be about 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.007, 0.008, 0.009, 0.010, 0.011, 0.012, 0.013, 0.014, 0.015, 0.016, 0.017, 0.018, 0.019, 0.020, 0.021, 0.022, 0.023, 0.024, 0.025, 0.026, 0.027, 0.028, 0.029, 0.030, 0.040, or more. [00316] Any suitable analytical techniques may be used to measure the composition of a substrate, slurry, slurry component, metal diffusion layer, or a surface layer. Measurements may include amounts, concentrations, or weight percentage, thicknesses or other dimensions, changes of composition and/or structures with depth, and grain size. Exemplary analytical techniques may include, without limitation, glow discharge mass spectrometry, microprobe analysis, potentiostat measurements, scanning electron microscopy, transmission electron microscopy, X-ray photoelectron spectroscopy, energy-dispersive x- ray spectroscopy, and electron energy loss spectroscopy may be used to measure such change in amount, concentration, or wt% with depth. [00317] Other properties of metal materials may be as described in, for example, U.S. Patent Publication No.2013/0171471; U.S. Patent Publication No.2013/0309410; U.S. Patent Publication No. 2013/0252022; U.S. Patent Publication No.2015/0167131; U.S. Patent Publication No.2015/0345041, U.S. Patent Publication No.2015/0345041, U.S. Patent Publication No.2016/0230284, each of which is incorporated herein by reference in its entirety. [00318] A method for creating a highly formable metal material composition may comprise several intermediate processes. A metal material may be composed according to an above-described chemistry. A metal (e.g., an interstitial-free steel) may undergo fine-grain practices to generate small prior grains. A cold reduction may be utilized to obtain a smooth finish and control grain sizes. After a cold reduction, a subsequent processing step may comprise a high-temperature annealing method. The high-temperature annealing may comprise annealing at a temperature above about 900°C. The annealing temperature may exceed about 950°C, 1000°C, 1050°C, 1100°C, 1150°C, 1200°C, 1250°C, 1300°C, 1350°C, 1400°C, 1500°C, or greater. The annealing temperature may be no more than about 1500°C, 1450°C, 1400°C, 1350°C, 1300°C, 1250°C, 1200°C, 1150°C, 1100°C, 1050°C, 1000°C, or no more than about 950°C or less. The annealing temperature may permit a transition of the metal (e.g., steel) from a ferritic phase to an austenitic phase. The selected composition of metal (e.g., an interstitial-free steel) may prevent grain growth. The stabilized grades may prevent strain aging and may improve the formability of the metal for further processing. [00319] A highly formable metal (e.g., steel) composition may have a measurable grain size. Grain size may be measured and recorded in accordance to the American Society of the International Association for Testing and Materials (ASTM) standard. The substrate may have a grain size greater than about ASTM 000, 00, 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 39, or 30 or more. A highly formable metal (e.g., steel) composition may have a grain size greater than about ASTM 000, 00, 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 39, or 30 or more. A highly formable metal (e.g., steel) composition may have a grain size of no more than about 30, 29, 28, 27, 26, 25, 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0, 00, or no more than about 000 or less. In some embodiments, a metal diffusion layer may have a grain size from about ASTM 000 to about ASTM 10, about ASTM 000 to about ASTM 15, about ASTM 000 to about ASTM 20, about ASTM 000 to about ASTM 25, about ASTM 000 to about ASTM 30, from about ASTM 5 to about ASTM 16, about ASTM 5 to about ASTM 18, ASTM 5 to about ASTM 20, about ASTM 5 to about ASTM 22, about ASTM 5 to about ASTM 24, about ASTM 5 to about ASTM 26, about ASTM 5 to about ASTM 28, about ASTM 5 to about ASTM 30, about ASTM 6 to about ASTM 16, about ASTM 6 to about ASTM 18, about ASTM 6 to about ASTM 20, about ASTM 6 to about ASTM 22, about ASTM 6 to about ASTM 24, about ASTM 6 to about ASTM 26, about ASTM 6 to about ASTM 28, about ASTM 6 to about ASTM 30, about ASTM 7 to about ASTM 16, about ASTM 7 to about ASTM 18, about ASTM 7 to about ASTM 20, about ASTM 7 to about ASTM 22, ASTM 7 to about ASTM 24, about ASTM 7 to about ASTM 26, about ASTM 7 to about ASTM 28, about ASTM 7 to about ASTM 30, about ASTM 8 to about ASTM 16, about ASTM 8 to about ASTM 18, about ASTM 8 to about ASTM 20, about ASTM 8 to about ASTM 22, about ASTM 8 to about ASTM 24, about ASTM 8 to about ASTM 26, about ASTM 8 to about ASTM 28, about ASTM 8 to about ASTM 30, about ASTM 9 to about ASTM 16, about ASTM 9 to about ASTM 18, about ASTM 9 to about ASTM 20, about ASTM 9 to about ASTM 22, about ASTM 9 to about ASTM 24, about ASTM 9 to about ASTM 26, about ASTM 9 to about ASTM 28, about ASTM 9 to about ASTM 30, about ASTM 10 to about ASTM 16, about ASTM 10 to about ASTM 18, about ASTM 10 to about ASTM 20, about ASTM 10 to about ASTM 22, about ASTM 10 to about ASTM 24, about ASTM 10 to about ASTM 26, about ASTM 10 to about ASTM 28, about ASTM 10 to about ASTM 30, about ASTM 15 to about ASTM 20, about ASTM 15 to about ASTM 25, about ASTM 15 to about ASTM 30, or ASTM 20 to about ASTM 30. A highly formable metal material composition may have a grain size from about ASTM 7 to ASTM 9, from about ASTM 6 to about ASTM 14, or from about ASTM 8 to about ASTM 12. A highly formable metal (e.g., steel) composition may have a grain size of about ASTM 7, about ASTM 8, about ASTM 9, about ASTM 10, about ASTM 11, about ASTM 12, about ASTM 13, about ASTM 14, about ASTM 15, about ASTM 16, about ASTM 17, about ASTM 18, about ASTM 19, about ASTM 20, about ASTM 21, about ASTM 22, about ASTM 23, about ASTM 24, about ASTM 25, about ASTM 26, about ASTM 27, about ASTM 28, about ASTM 29, or about ASTM 30. The substrates compositions comprising an alloying agent described herein may be utilized in any processing method or series of processing methods. The substrates compositions comprising an alloying agent may be utilized in additional processing methods before, during, and/or after the deposition of a slurry composition on a substrate. The substrates compositions comprising an alloying agent may be utilized in additional processing methods before, during, and/or after annealing of the alloying agent with the substrate. A composition comprising a alloying agent (e.g., an alloying element, an alloying metal) may enhance one or more properties (e.g., formability, workability, improved thermal conductivity) of the substrate and /or the slurry for subsequent processing steps. A composition and /or substrate with enhanced properties after formation of a diffused alloy comprising the alloying agent may be advantageous for a variety of applications, such as electrical alloys, electronic alloys, high-temperature alloys, high-strength alloys, corrosion-resistant alloys, construction alloys, structural alloys, consumer goods alloys, appliance-grade alloys, industrial alloys, biomedical-grade alloys, military-grade alloys, maritime-grade alloys, aviation- grade alloys, transportation grade alloys, aesthetic alloys and automotive-grade alloys. [00320] A substrate, a slurry composition, or a metal material may undergo any processing methods before, during and/or after the annealing process. Illustrative processes may comprise, without limitation, forming, soft or hard tooling, fastening, and seam or cut edge protection. Illustrative forming, soft or hard tooling processes may comprise stretch or draw forming, re-striking, crash forming, spin forming, roll forming, hydro-forming, CNC forming, flanging, crimping, hemming, hot stamping, extrusion, and forging. Illustrative fastening processes may comprise toggle locking, toxlocking, spot welding, soldering, stick-welding, electric arc welding, MIG welding, TIG welding, acetylene gas welding, electric resistance welding, ultra-sonic welding, friction welding, laser welding, plasma welding, lock seaming, riveting, hot forging, and chemical adhesion (e.g., glue or epoxy joining). Illustrative seam or cut-edge protection processes may comprise hot dip galvanizing, electro-galvanizing, aluminum or aluminizing, alumino-siliconizing, cold spraying (e.g., Al, stainless steel of all grades, zinc, galvanize, nickel), hot spraying or plasma spray coating (e.g., Al, stainless steel of all grades, zinc, galvanize, nickel, copper, bronze), cladding, and liquid applied coatings (e.g., paints, UV cured, polymer paints). [00321] A substrate or metal material may be formed into one or more parts, pieces, or components. A part, piece, or component comprising a metal material described herein may be used in any suitable application including, without limitation, automotive, aviation, transportation, maritime, appliance, construction, industrial, electrical, biomedical, military, consumer, aesthetic, electronic, and structural applications. Automotive applications may comprise automotive fuel tanks, exposed body panels (e.g., doors, hoods, and fenders), exhaust components (e.g., mufflers, catalytic converter housings, exhaust tubing, heat shielding), and unexposed body panels (e.g., dash panels, door inners, wheel house inners). Appliance applications may comprise exposed panels (e.g., door outers, vent hoods, splash guards) and unexposed panels (e.g., dishwasher inner panels, water heater tanks). Construction and structural applications may comprise architectural paneling, flow tubing, piping, beams, hinges, plates, and fasteners. Electrical applications may comprise electrical motor laminations, electric generator laminations, and electrical transformer core laminations. [00322] In another aspect, provided is a method for preparing the metal material, for example alloy, steel, as described above, and the method comprises: (a) providing the substrate as described above in the “substrate” section or anywhere else herein comprising the metal composition as described above in the “metal composition” section or anywhere else herein; (b) providing a diffusion alloying composition such as the slurry composition as described above configured on and at least partially covering a surface of the substrate; and thermally treating the substrate and the diffusion alloying composition to produce the alloy, for example, via diffusion alloying. In some embodiments, the diffusion alloying composition covers at least 25% at least 50%, at least 75%, at least 90% of the surface, or two surfaces of the substrate. Computer Systems [00323] The present disclosure provides computer systems that are programmed to implement methods of the disclosure. FIG.4 shows a computer control system 401 that is programmed or otherwise configured to produce the slurry and/or apply a coating of the slurry to a substrate. The computer control system 401 can regulate various aspects of the methods of the present disclosure, such as, for example, methods of producing the slurry and methods of applying a coating of the slurry to the substrate. The computer control system 401 can be implemented on an electronic device of a user or a computer system that is remotely located with respect to the electronic device. The electronic device can be a mobile electronic device. [00324] The computer system 401 includes a central processing unit (CPU, also “processor” and “computer processor” herein) 405, which can be a single core or multi core processor, or a plurality of processors for parallel processing. The computer control system 401 also includes memory or memory location 410 (e.g., random-access memory, read-only memory, flash memory), electronic storage unit 415 (e.g., hard disk), communication interface 420 (e.g., network adapter) for communicating with one or more other systems, and peripheral devices 425, such as cache, other memory, data storage and/or electronic display adapters. The memory 410, storage unit 415, interface 420 and peripheral devices 425 are in communication with the CPU 405 through a communication bus (solid lines), such as a motherboard. The storage unit 415 can be a data storage unit (or data repository) for storing data. The computer control system 401 can be operatively coupled to a computer network (“network”) 430 with the aid of the communication interface 420. The network 430 can be the Internet, an internet and/or extranet, or an intranet and/or extranet that is in communication with the Internet. The network 430 in some cases is a telecommunication and/or data network. The network 430 can include one or more computer servers, which can enable distributed computing, such as cloud computing. The network 430, in some cases with the aid of the computer system 401, can implement a peer-to-peer network, which may enable devices coupled to the computer system 401 to behave as a client or a server. [00325] The CPU 405 can execute a sequence of machine-readable instructions, which can be embodied in a program or software. The instructions may be stored in a memory location, such as the memory 410. The instructions can be directed to the CPU 405, which can subsequently program or otherwise configure the CPU 405 to implement methods of the present disclosure. Examples of operations performed by the CPU 405 can include fetch, decode, execute, and writeback. [00326] The CPU 405 can be part of a circuit, such as an integrated circuit. One or more other components of the system 401 can be included in the circuit. In some cases, the circuit is an application specific integrated circuit (ASIC). [00327] The storage unit 415 can store files, such as drivers, libraries and saved programs. The storage unit 415 can store user data, e.g., user preferences and user programs. The computer system 401 in some cases can include one or more additional data storage units that are external to the computer system 401, such as located on a remote server that is in communication with the computer system 401 through an intranet or the Internet. [00328] The computer system 401 can communicate with one or more remote computer systems through the network 430. For instance, the computer system 401 can communicate with a remote computer system of a user (e.g., a user controlling the manufacture of a slurry coated substrate). Examples of remote computer systems include personal computers (e.g., portable PC), slate or tablet PC’s (e.g., Apple® iPad, Samsung® Galaxy Tab), telephones, Smart phones (e.g., Apple® iPhone, Android- enabled device, Blackberry®), or personal digital assistants. The user can access the computer system 401 via the network 430. [00329] Methods as described herein can be implemented by way of machine (e.g., computer processor) executable code stored on an electronic storage location of the computer system 401, such as, for example, on the memory 410 or electronic storage unit 415. The machine executable or machine readable code can be provided in the form of software. During use, the code can be executed by the processor 405. In some cases, the code can be retrieved from the storage unit 415 and stored on the memory 410 for ready access by the processor 405. In some situations, the electronic storage unit 415 can be precluded, and machine-executable instructions are stored on memory 410. [00330] The code can be pre-compiled and configured for use with a machine having a processer adapted to execute the code, or can be compiled during runtime. The code can be supplied in a programming language that can be selected to enable the code to execute in a pre-compiled or as- compiled fashion. [00331] Aspects of the systems and methods provided herein, such as the computer system 401, can be embodied in programming. Various aspects of the technology may be thought of as “products” or “articles of manufacture” typically in the form of machine (or processor) executable code and/or associated data that is carried on or embodied in a type of machine readable medium. Machine- executable code can be stored on an electronic storage unit, such as memory (e.g., read-only memory, random-access memory, flash memory) or a hard disk. “Storage” type media can include any or all of the tangible memory of the computers, processors or the like, or associated modules thereof, such as various semiconductor memories, tape drives, disk drives and the like, which may provide non-transitory storage at any time for the software programming. All or portions of the software may at times be communicated through the Internet or various other telecommunication networks. Such communications, for example, may enable loading of the software from one computer or processor into another, for example, from a management server or host computer into the computer platform of an application server. Thus, another type of media that may bear the software elements includes optical, electrical and electromagnetic waves, such as used across physical interfaces between local devices, through wired and optical landline networks and over various air-links. The physical elements that carry such waves, such as wired or wireless links, optical links or the like, also may be considered as media bearing the software. As used herein, unless restricted to non-transitory, tangible “storage” media, terms such as computer or machine “readable medium” refer to any medium that participates in providing instructions to a processor for execution. [00332] Hence, a machine readable medium, such as computer-executable code, may take many forms, including but not limited to, a tangible storage medium, a carrier wave medium or physical transmission medium. Non-volatile storage media include, for example, optical or magnetic disks, such as any of the storage devices in any computer(s) or the like, such as may be used to implement the databases, etc. shown in the drawings. Volatile storage media include dynamic memory, such as main memory of such a computer platform. Tangible transmission media include coaxial cables; copper wire and fiber optics, including the wires that comprise a bus within a computer system. Carrier-wave transmission media may take the form of electric or electromagnetic signals, or acoustic or light waves such as those generated during radio frequency (RF) and infrared (IR) data communications. Common forms of computer-readable media therefore include for example: a floppy disk, a flexible disk, hard disk, magnetic tape, any other magnetic medium, a CD-ROM, DVD or DVD-ROM, any other optical medium, punch cards paper tape, any other physical storage medium with patterns of holes, a RAM, a ROM, a PROM and EPROM, a FLASH-EPROM, any other memory chip or cartridge, a carrier wave transporting data or instructions, cables or links transporting such a carrier wave, or any other medium from which a computer may read programming code and/or data. Many of these forms of computer readable media may be involved in carrying one or more sequences of one or more instructions to a processor for execution. [00333] The computer system 401 can include or be in communication with an electronic display 435 that comprises a user interface (UI) 440 for providing, for example, parameters for producing the slurry and/or applying the slurry to a substrate. Examples of UI’s include, without limitation, a graphical user interface (GUI) and web-based user interface. [00334] Methods and systems of the present disclosure can be implemented by way of one or more algorithms. An algorithm can be implemented by way of software upon execution by the central processing unit 405. The algorithm can, for example, regulate the mixing shear rate of the slurry, the amount of each ingredient added to the slurry composition of a slurry mixture, and the order in which the ingredients are added to the slurry composition of a slurry mixture. As another example, the algorithm can regulate the speed at which the slurry is applied to the substrate and the number of coatings of slurry applied to the substrate. EXAMPLES Example 1 [00335] In an example, a slurry is formed by addition to a mixing chamber while mixing a resulting solution. The amount of water added to the slurry is varied to form a number of slurries, and the resulting effect on properties of the slurries is recorded. Next, the slurry is applied to a substrate via a roll coating process. The slurry is then annealed at about 200 °C for about 2 hours. The slurry is then dried to completeness from about 2 hours to about 100 hours or longer. The atmosphere near the chromized article’s surface may be below about -20 °F dew point. Example 2 [00336] In another example, a substrate is heated at a rate of about 10 °C/min to about 500 °C. The temperature is held constant for about 2 hours, during which time a slurry composition is deposited adjacent the substrate. The substrate is then heated at a rate of about 10 °C/min to about 950 °C. The temperature is held constant during the annealing process. After about 30 hours, the substrate is cooled at a rate of approximately about 5 °C/min to room temperature. A flow of argon is constant during the entire process. Example 3 [00337] In another example, a substrate undergoes a thermal cycle protocol. A substrate is heated at a rate of about 10 °C/min to about 500 °C. The temperature is held constant for about 2 hours, during which time a slurry composition is deposited adjacent to the substrate. The substrate is then heated at a rate of about 10 °C/min to about 925 °C, and the temperature is held constant for about 30 minutes. The substrate is cooled at a rate of about 5 °C/min to about 500 °C, where the temperature is held constant for about 30 minutes. The substrate is heated again, at a rate of about 5 °C/min to about 925 °C, held at a constant temperature for about 30 minutes, then cooled at a rate of about 5 °C/min to about 500 °C and held constant for about 30 minutes. The substrate is heated and cooled one more time in another cycle. The substrate is heated to about 925 °C, then the substrate is cooled at a rate of approximately about 5 °C/min to room temperature. A flow of argon is constant during the entire process. Example 4 [00338] In another example, substrates were provided, comprising carbon, silicon, manganese, titanium, vanadium, aluminum, and nitrogen. In an example, substrates have the components, in wt %, as illustrated in Table A: Table A. Exemplary metal compositions (e.g., substrate compositions) as described herein: Example 5 [00339] In another example, substrates were provided, comprising carbon, silicon, manganese, titanium, vanadium, aluminum, and nitrogen. In an example, substrates have the components, in wt %, as illustrated in Table B: Table B. Exemplary metal compositions (e.g., substrate compositions) as described herein: Substrate MC-25 had about 0.089 wt% niobium. The resulting alloy layer had little observed grain boundary precipitation, as illustrated in FIG.3. Fewer formation of pores were observed with this alloy layer. This stainless steel alloy layer had improved corrosion resistance, a desired effect of the substrate. Example 6 [00340] In another example, substrates formed according a method described herein exhibited properties as illustrated in Table C: Table C. Exemplary properties of the metal materials (e.g., ) described herein Example 7 [00341] In another example, substrates were formed and exhibited the properties as illustrated in Table D: C-25 C Mn P S Si Cu Ni Cr Mo [00342] The niobium weight percent of the alloy was calculated as: Nb wt% = (0.017- (Ti wt% - 3.42*N wt% - 1.49*S wt% - 4*C wt% ))/0.516 [00343] The substrate chemistry was selected such that it has a calculated stabilization of 0.017 or greater, wherein stabilization was calculated as: Stabilization = Ti wt% - 3.42*N wt% - 1.49*S wt% - 4*C wt% + 0.516*Nb wt%. Example 8 [00344] In another example, substrates were formed and exhibited the following compositions of constituent metals and other elements, as measured in wt %: Table E. Exemplary metal compositions (e.g., substrate compositions) as described herein: Example 9 [00345] In another example, the substrates listed in Example 8 were thermo-mechanically tested to determine their r-values. The test results are as follows (Table F): Table F. Example 10 [00346] In another example, a slurry suspension is created by mixing MgCr ₂ O ₄ powder and MgCl ₂ powder together in water. The MgCr ₂ O ₄ powder and MgCl ₂ powder are both screened to have a particle size between about 0.1 and 10 µm. The dry weight percentages of MgCr ₂ O ₄ powder and MgCl ₂ powder are about 95% and 5% respectively. Four hours after mixing the MgCr ₂ O ₄ powder and MgCl ₂ powder, aluminum powder is added to the suspension. The aluminum powder has been sieved such that it passes through a 325 mesh screen. The aluminum is mixed into the slurry powder such that it has an atomic ratio of about 1.0 to oxide powder. The slurry composition of a slurry mixture containing the aluminum powder is immediately roll-coated on to the surface of a metal sheet. The substrate is then heated at a rate of about 10 °C/min to about 950 °C. The temperature is held constant during the annealing process. After about 30 hours, the substrate is cooled at a rate of approximately 5 °C/min to room temperature. A flow of argon is constant during the entire process. After annealing, the metal substrate undergoes a cleaning process to remove Al ₂ O ₃ from the substrate surface. Example 11 [00347] In another example, substrates were composed to exhibit a higher yield strength by as much as 80%, and a higher tensile strength by as much as 50%. In some cases, substrates were formed and exhibited the following compositions of constituent metals and other elements, as measured in wt %: Table 1. Substrate Chemical Composition Example 12 [00348] In another example, the substrates listed in Example 11 were thermo-mechanically tested to determine their Ti/Nb stability, yield strength, ultimate tensile strength and elongation. The test results are as follows: Table 2. Substrate Thermomechanical Test Example 13: Substrate Chemistry Composition [00349] This example illustrates chemical compositions (or substrate chemistry) of substrates formed using the methods described herein or for use in the methods described herein. A substrate used in the present disclosure may exhibit the following compositions of constituent metals (and optionally other elements), as measured in wt %: Table 3. Exemplary metal compositions (e.g., substrate compositions) as described herein: [00350] Materials, devices, systems and methods herein, including material compositions (e.g., material layers), can be combined with or modified by other materials, devices, systems and methods, including material compositions, such as, for example, those described in U.S. Patent Publication No. 2013/0171471; U.S. Patent Publication No.2013/0309410; U.S. Patent Publication No.2013/0252022; U.S. Patent Publication No.2015/0167131; U.S. Patent Publication No.2015/0345041; and Patent Cooperation Treaty Application No. PCT/US2016/017155, each of which is incorporated herein by reference in its entirety. Example 14: Cold Reduction to Form Fine Grains in a Substrate [00351] This example illustrates fine grain practice performed on substrate(s) in the methods as described herein. Exemplary grain morphology in a substrate (e.g., a substrate from a hot mill using thermomechanical processing) are shown in FIGs.5A-5B. FIGs.5C-5F illustrates exemplary grain morphology of a substrate that has been subjected to cold reduction to various extents, e.g., at 10%, 30%, 50%, and 70% relative to the substrate thickness. FIGs.5D-5F shows fine grains achieved using cold reduction (e.g., of at least 30% prior to coating) using methods described herein. Example 15: Substrate Surface Roughness [00352] This example illustrates the effect(s) of surface roughness of substrates on slurry delamination. FIG.7A illustrates that slurry delamination generally tends to increase with an increase in gauge thickness or an increase in surface roughness (e.g., exceeding 55 µin (e.g., exceeding 35 µin)) (or when both conditions are met). FIG.7B illustrates that lighter gauge reduced surface roughness generally result in less coating delamination. In general, an increase in surface roughness may further lead to a decrease in corrosion performance. Example 16: Alloy Formation Chemical Reaction [00353] This example illustrates a chemical reaction between slurry components with substrate components that leads to an alloy formation. Example 17: Diffusion Alloying Process of a Metal Coil [00354] This exam illustrate diffusion alloying process of a metal coil. A metal substrate is coated with a slurry comprising an alloying agent (e.g., element), a metal oxide and/or a metal transport activator. The slurry coated metal substrate is then wound (or coiled) up to form a metal coil. Coiling is performed at a temperature of about 10 degrees Celsius (°C) to 200 °C. The slurry contacts the other surface of the substrate as the slurry coated surface is coiled. Subsequently, the metal coil is subjected to annealing at the temperature of about 750 °C to 1100 °C in an alloying atmosphere comprising a reducing gas such as hydrogen. The alloying agent in the slurry diffuses into and alloys with two neighboring layers of the metal substrate to form a diffusion-alloyed metal coil. Example 18: Uncoiling a Metal Coil [00355] This example illustrates uncoiling a metal coil formed using the methods described herein. The diffusion-alloyed metal coil formed by annealing according to the example 17 is subjected to an uncoiling process (e.g., leveling or flattening). Example 19: Polishing a Diffusion-Alloyed Metal [00356] This example illustrates post alloying surface treatment of a metal coil formed using the methods described herein. The diffusion-alloyed metal coil formed by annealing according to the example 17 and/or the unwound (or uncoiled) metal coil as described in the example 18 are mechanically treated (e.g., by polishing). The mechanical treatment (e.g., polishing) is performed to remove, for example, any sintered (e.g., surface-sintered) particles formed on the surface of the diffusion-alloyed metal through the methods described herein. Example 20: Chromium Concentration Across Metal Diffusion Layer [00357] This example illustrates chromium concentration profile(s) across metal diffusion layer(s) as determined using linescans of chromium (Cr). FIGs.8A and 8B show concentration profile of chromium (Cr) across different depths of metal diffusion layer(s); the Cr concentration can be measured by glow discharge mass spectrometry (GDMS). Example 21: Diffusion Alloyed Metal Material Chemical Composition [00358] This example, as shown in FIGs.9A and 9B, illustrates exemplary chemical composition(s) of diffusion alloyed metal material(s) at the alloy layer. Example 22: Alloyed Metal Material Microstructure [00359] This example illustrates microstructure(s) of alloyed metal material(s). FIG.10B illustrates an example image of the microstructures of the diffusion layer in a metal material formed using he methods described herein, compared to a reference metal material shown in FIG.10A. Columnar grains 801 are formed in the metal material in FIG.10B due to transformation to ferrite at the annealing temperatures described in the methods herein. Type of coating(s) (e.g., coating’s chemical composition), annealing temperature(s), and substrate chemistry impacts the depth of the columnar grains. The metal material in FIG.10B also shows superior corrosion performance compared to the material in FIG.10A; this is at least partially due to an absence of carbide formation in the metal material formed using the methods described herein (FIG.10B). Grain boundary carbides are present in the material in FIG.10A that leads to inferior corrosion performance of the material. [00360] FIG.10D illustrates an image of the microstructures in two exemplary metal materials formed using he methods described herein, compared to three reference metal materials shown in FIG. 10C. Core microstructure(s) in the metal material shown in FIG.10D possess fine, equiaxed grains at least partially due to austenite phase at temperature(s) used in the methods described herein as well as the chemical compositions in the substrate and the coating used. Fig.10C shows low elongation due to large grains, while the metal material in FIG.10D shows superior elongation due at least partially to the fine, equiaxed grains in the core layer 802. Example 23: Pitting Potentials of Metal Materials [00361] This example illustrates pitting potentials (vs saturated silver chloride reference half-cell) of SODA composites formed and/or used in the methods described herein as a function of surface chromium concentration(s) (wt%) and the extent of interstitial stabilization. Results of pitting potentials are shown in FIG.11. Results show that the SODA composites have very high pitting resistance. Example 24: Salt Spray Performance of Cr-SODA [00362] This example illustrates salt spray performance of Cr-SODA with 25 wt% Cr at the surface after having the surface actively deformed from impact and scratch. The two top left images show one- foot by four-foot sections after 120 hours in B117 salt spray testing. The gouged surface sample images shown in FIG.12 were collected after 144 hours of salt spray testing (e.g. ASTM B117 testing). Results shown in FIG.12 illustrate that large amounts of deformation can be applied to the material without disruption of corrosion resistance (e.g.20 lbs force on a point with a razor 1001). Even the 5 lbs. razor scratch 1002 demonstrate deformation (which is difficult to see in the photo), and that the alloy layer is capable of surviving substantial damage before being breached as shown in the results. Example 25: Chromium Uniformity and Corrosion [00363] This example illustrates the effect of chromium concentration variation on a surface of a metal material formed using the methods described herein. Corrosion as shown in FIG.13 is highly dependent on local concentration variation or uniformity of chromium. Example 26: Reduction effect(s) on Chromium Uniformity [00364] This example illustrates defects generated by uniform deformation of the substrate in the form of cold reduction; these defects are susceptible to corrosive environments. The microstructure of a Cr-SODA composite that has been reduced from 0.02 inch to 0.002 inch is shown in FIG.14A, and the pitting potential (vs saturated silver chloride reference half-cell) of the Cr-SODA is plotted against elongation (%) from cold reduction in FIG.14B. A 95% confidence interval and a 95% prediction interval are shown for the pitting potential as a function of elongation (%). FIG.14A demonstrates the impact on the alloy layer after substantial level of reduction (90%), but FIG.14B shows that gauge reduction through a single stand temper mill does not appreciably impact the pitting potential of the Cr- SODA alloy until more than 30% percent elongation is achieved. Example 27: Sintered Particles [00365] This example illustrates the effect(s) of sintered particles on surface performance of metal materials. The sintered particles are generated while forming the metal materials using the methods described herein. The sintered particles create weak points that can lead to corrosion and must be avoided or controlled for in the process of forming the metal materials. Exemplary images of sintered particles are shown in FIG.15. Example 28: Mechanical properties of Cr-SODA [00366] This example illustrates unexpected and superior mechanical properties of Cr-SODA formed in the methods described herein. Mechanical properties (e.g., yield, tensile, elongation, n-value and r-bar) are measured for the Cr-SODA and three other steel products (e.g., 439 stainless steel (SS), 304L SS, deep draw steel (DDS)) for comparison purposes. Forming limit diagrams at room temperature were generated for different materials at a gauge of 0.0394″ (FIG.16). A comparison between Cr-SODA and other products show that Cr-SODA has r-bar values that are unexpectedly high, and superior compared to the reference products, while tensile properties of Cr-SODA are soft and pliable. The observed high values in r-bar and n-value indicate a superior resistance to local thinning compared to 439 SS and DDS when considering the n-value, and superior deep-drawability due to the high r-bar value. Example 29: Physical Properties of Cr-SODA This example further illustrates the physical properties of Cr-SODA composites formed using the methods described herein. Tensile strength, yield strength, and elongation measurements are shown in FIGs.17A, 17B and 17C, respectively. Four different gauges of Cr-SODA composites 0.03″ (1501a, 1501b and 1501c), 0.055″ (1502a, 1502b and 1502c), 0.063″ (1503a, 1503b and 1503c), and 0.113 (1504a, 1504b and 1504c) were used for these measurements. The chromium alloy layer is 50 μm deep in all the samples with different gauges used for this example. The behavior of the different gauges indicates that the mechanical properties of the composite is an amalgamation of the two phases: high Cr alloy, and interstitial free core. The heavier gauge material is softer (both yield and tensile strength) and has a greater elongation to failure in almost all of the elongation extent conditions. Example 30: Slurry Coating Robustness This example illustrates a test to determine the robustness of a slurry coating to withstand a coating process (e.g., using roll coaters). A slurry coating may be applied to a small portion of a substrate (e.g., by hand, without the roll coaters). The slurry may be in form of a powder (e.g., after drying a wet film to form a dry film of slurry coating on a substrate). An operator wearing a nitrile glove wipes across a slurry coated surface of the substrate. The number of nitrile gloved finger wipes sufficient to remove a coating substantially completely can be used as an indication of the coating robustness. If the slurry is substantially completely removed in under 10 wipes with minimal pressure, the slurry may not be able to withstand the coating process (e.g., roll coating). The slurry coatings used in methods described herein demonstrate upwards of 100 gloved finger wipes. [00367] While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. It is not intended that the invention be limited by the specific examples provided within the specification. While the invention has been described with reference to the aforementioned specification, the descriptions and illustrations of the embodiments herein are not meant to be construed in a limiting sense. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. Furthermore, it shall be understood that all aspects of the invention are not limited to the specific depictions, configurations or relative proportions set forth herein which depend upon a variety of conditions and variables. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is therefore contemplated that the invention shall also cover any such alternatives, modifications, variations or equivalents. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.