Title:
MODIFIED PHENOLIC RESIN, METHOD FOR PRODUCING MODIFIED PHENOLIC RESIN, MODIFIED EPOXY RESIN, METHOD FOR PRODUCING MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/171193
Kind Code:
A1
Abstract:
Provided are a modified phenolic resin and modified epoxy resin having excellent heat resistance and dielectric properties in a cured product, methods for producing these, a curable resin composition, a cured product thereof, and a printed wiring board. A modified phenolic resin characterized in having a phenolic resin structure (A), at least one aromatic nucleus (a) in the phenolic resin structure (A) having, as a substituent, a structural site (1) represented by structural formula (1) (in the formula, Ar each independently represent a structural site having one or more of one or more types of substituents selected from the group consisting of a phenyl group, a naphthyl group, or a C1-4 alkyl group, C1-4 alkoxy group, halogen atom, phenyl group, and aralkyl group on an aromatic nucleus thereof).
Inventors:
NAKAMURA TAKAMITSU (JP)
WATANABE HAJIME (JP)
HAYASHI KOJI (JP)
MURATA YOSHIAKI (JP)
WATANABE HAJIME (JP)
HAYASHI KOJI (JP)
MURATA YOSHIAKI (JP)
Application Number:
PCT/JP2014/054917
Publication Date:
October 23, 2014
Filing Date:
February 27, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/08; C08G8/28; C08G59/20; H05K1/03
Domestic Patent References:
| WO2012063636A1 | 2012-05-18 |
Foreign References:
| JP2010134437A | 2010-06-17 | |||
| JP2006113136A | 2006-04-27 | |||
| JPH0973169A | 1997-03-18 | |||
| JPH0567701A | 1993-03-19 | |||
| JPH05119452A | 1993-05-18 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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