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Patent Searching and Data


Title:
MODIFIED PHENOLIC RESOLE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2016/159218
Kind Code:
A1
Abstract:
The present invention provides a modified phenolic resole resin composition including a modified phenolic resole resin that has structural units A, which are represented by general formula (1) and are modified using a dimethylphenol, and structural units B, which are represented by general formula (2). (In formula (1), m is an integer of 1 or greater. When m is 1, R is a methylol group. When m is 2 or greater, R independently are a hydrogen atom or methylol group, and at least one R is a methylol group) (In formula (2), n is an integer of 1 or greater. When n is 1, R is a methylol group. When n is 2 or greater, R independently are a hydrogen atom or methylol group, and at least one R is a methylol group).

Inventors:
MIFUKA HAJIME (JP)
Application Number:
PCT/JP2016/060632
Publication Date:
October 06, 2016
Filing Date:
March 31, 2016
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L61/04; C08G8/08; C08L9/02; C08L9/06; C08L61/14; C08L63/00; C09J11/06; C09J109/02; C09J109/06; C09J129/14; C09J161/10; C09J163/00
Foreign References:
JPH09118730A1997-05-06
US20140378626A12014-12-25
JPH11131039A1999-05-18
JP2001106753A2001-04-17
JP2011526634A2011-10-13
JPS4816352B11973-05-21
JP2013166945A2013-08-29
Attorney, Agent or Firm:
HAYAMI SHINJI (JP)
Shinji Hayami (JP)
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