Title:
MODIFIED POLYPHENYLENE OXIDE, AND COPPER-CLAD LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/046956
Kind Code:
A1
Abstract:
The present invention relates to a modified polyphenylene oxide which has low dielectric properties while having excellent compatibility and processability with epoxy resin; a thermosetting resin composition which comprises the modified polyphenylene oxide, thereby exhibiting excellent processability and low dielectric properties; a prepreg having excellent processability while implementing low dielectric properties by applying the modified polyphenylene oxide; and a copper-clad laminate comprising the prepreg.
Inventors:
SEO HYEON JIN (KR)
KIM INWOOK (KR)
HAN GAYOUNG (KR)
KIM HANSANG (KR)
HWANG YONGJAE (KR)
LEE HYESUN (KR)
KIM INWOOK (KR)
HAN GAYOUNG (KR)
KIM HANSANG (KR)
HWANG YONGJAE (KR)
LEE HYESUN (KR)
Application Number:
PCT/KR2014/009034
Publication Date:
April 02, 2015
Filing Date:
September 26, 2014
Export Citation:
Assignee:
DOOSAN CORP (KR)
International Classes:
C08G65/48; B32B15/08; C08J5/24; C08L71/12
Domestic Patent References:
| WO2001062828A1 | 2001-08-30 |
Foreign References:
| JPH09291148A | 1997-11-11 | |||
| JPH073053A | 1995-01-06 | |||
| JP2007231228A | 2007-09-13 |
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (KR)
특허법인 한벗 (KR)
특허법인 한벗 (KR)
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