MODIFIED SILICA PARTICLES, PHOTOSENSITIVE COMPOSITION CONTAINING SAME, AND PHOTOSENSITIVE LITHOGRAPHY PLATE

Title:

MODIFIED SILICA PARTICLES, PHOTOSENSITIVE COMPOSITION CONTAINING SAME, AND PHOTOSENSITIVE LITHOGRAPHY PLATE

Document Type and Number:

WIPO Patent Application WO/2006/121172

Kind Code:

A1

Abstract:

Adhesion between a photosensitive layer and a supporting body of a photosensitive lithography plate is adequately maintained after exposure to light. Modified silica particles whose surfaces are modified with an organic compound having at least one ethylenically unsaturated group, at least one hydrophilic moiety and at least one silyloxy group are blended in a photosensitive layer of a photosensitive lithography plate.

Inventors:

HAYASHI KOJI (JP)

Application Number:

PCT/JP2006/309610

Publication Date:

November 16, 2006

Filing Date:

May 08, 2006

Export Citation:

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Assignee:

EASTMAN KODAK CO (US)
HAYASHI KOJI (JP)

International Classes:

C07F7/10; C01B33/18; C09C1/28; C09C3/10; C09C3/12; C09K3/00; G03F7/00; G03F7/027; G03F7/075; G03F7/085

Foreign References:

JPH09100111A	1997-04-15
JP2003137530A	2003-05-14
JPH05269365A	1993-10-19
JPH1160235A	1999-03-02

Other References:

See also references of EP 1880978A4
None

Attorney, Agent or Firm:

Aoki, Atsushi (Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, JP)

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