MODIFIER FOR RESIN, RESIN COMPOSITION, AND FILM IN WHICH SAME IS USED

Title:

MODIFIER FOR RESIN, RESIN COMPOSITION, AND FILM IN WHICH SAME IS USED

Document Type and Number:

WIPO Patent Application WO/2017/141772

Kind Code:

A1

Abstract:

Provided are: a modifier for a resin with which it is possible to attain a high balance of flexibility, transparency, and bleed resistance; a resin composition; and a film in which the same is used. This modifier for a resin comprises a random copolymer comprising structural units derived from an aliphatic dibasic acid, structural units derived from an alkylenediol, and structural units derived from a polyalkylene ether glycol, the ends of the random copolymer being hydroxyl groups or carboxyl groups. The polyalkylene ether glycol is preferably polyethylene ether glycol, and the alkylenediol is preferably at least one selected from the group consisting of ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 2-methyl-1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, and hexanediol.

Inventors:

TANAKA YUKI (JP)
FUKUMOTO YUGO (JP)
YAMAZAKI YUJI (JP)
HARADA MASASHI (JP)
NAKATOMI YUDAI (JP)

Application Number:

PCT/JP2017/004427

Publication Date:

August 24, 2017

Filing Date:

February 07, 2017

Export Citation:

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Assignee:

ADEKA CORP (JP)

International Classes:

C08G63/672; C08L1/02

Domestic Patent References:

WO2009093503A1

2009-07-30

Foreign References:

JP2006219649A	2006-08-24
JPH05155809A	1993-06-22
JP2009173740A	2009-08-06
JP2009173741A	2009-08-06
JP2006241378A	2006-09-14
JPS497354A	1974-01-23

Other References: