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Title:
MODIFIER FOR RESIN AND RESIN COMPOSITION USING THE SAME AND FORMED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2005/078013
Kind Code:
A1
Abstract:
A modifier for a resin which has an average particle diameter of 20 μm or more, wherein particles having a particle diameter of 10 μm or less account for less than 30 mass % of the modifier, and wherein after the modifier is irradiated with a ultrasonic wave of 40 w for five minutes, particles having a particle diameter of 10 μm or less account for 30 mass % or more of the modifier; a resin composition which comprises 1 to 40 mass % of the above modifier for a resin and 99 to 60 mass % of a thermoplastic resin or a thermosetting resin the sum of the amounts of the both components is 100 mass %; and a formed article produced by forming the resin composition.

Inventors:
Wakita, Tsuneki c/o Otake, Plants (Mitsubishi Rayon Co. Ltd., 20-1, Miyuki-cho, Otake-sh, Hiroshima 93, 73906, JP)
Nakamura, Keiji c/o Otake, Plants (Mitsubishi Rayon Co. Ltd., 20-1, Miyuki-cho, Otake-sh, Hiroshima 93, 73906, JP)
Makino, Hideaki c/o Mitsubishi Rayon Co. Ltd. (6-41, Konan 1-chome, Minato-k, Tokyo 06, 10885, JP)
Osuka, Masahiro c/o Tokyo Technology and Information center (Mitsubishi Rayon Co. Ltd., 3816, Noborito, Tama-ku, Kawasaki-sh, Kanagawa 14, 21400, JP)
Miwa, Yohei c/o Toyohashi, Plants (Mitsubishi Rayon Co. Ltd., 1-2, Ushikawadori 4-chome, Toyohashi-sh, Aichi 01, 44086, JP)
Doi, Yasutaka c/o Toyohashi, Plants (Mitsubishi Rayon Co. Ltd., 1-2, Ushikawadori 4-chome, Toyohashi-sh, Aichi 01, 44086, JP)
Application Number:
PCT/JP2005/002210
Publication Date:
August 25, 2005
Filing Date:
February 15, 2005
Export Citation:
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Assignee:
MITSUBISHI RAYON CO., LTD. (6-41, Konan 1-chome Minato-k, Tokyo 06, 10885, JP)
Wakita, Tsuneki c/o Otake, Plants (Mitsubishi Rayon Co. Ltd., 20-1, Miyuki-cho, Otake-sh, Hiroshima 93, 73906, JP)
Nakamura, Keiji c/o Otake, Plants (Mitsubishi Rayon Co. Ltd., 20-1, Miyuki-cho, Otake-sh, Hiroshima 93, 73906, JP)
Makino, Hideaki c/o Mitsubishi Rayon Co. Ltd. (6-41, Konan 1-chome, Minato-k, Tokyo 06, 10885, JP)
Osuka, Masahiro c/o Tokyo Technology and Information center (Mitsubishi Rayon Co. Ltd., 3816, Noborito, Tama-ku, Kawasaki-sh, Kanagawa 14, 21400, JP)
Miwa, Yohei c/o Toyohashi, Plants (Mitsubishi Rayon Co. Ltd., 1-2, Ushikawadori 4-chome, Toyohashi-sh, Aichi 01, 44086, JP)
Doi, Yasutaka c/o Toyohashi, Plants (Mitsubishi Rayon Co. Ltd., 1-2, Ushikawadori 4-chome, Toyohashi-sh, Aichi 01, 44086, JP)
International Classes:
C08F265/04; C08F279/02; C08F283/12; C08J3/12; C08K5/00; C08L33/04; C08L51/00; C08L51/04; C08L51/08; C08L101/00; H01L23/29; (IPC1-7): C08K5/00; C08L101/00; C08J3/12; H01L23/29
Domestic Patent References:
WO2000001748A12000-01-13
WO2001088021A12001-11-22
Foreign References:
JPS641731A1989-01-06
JPH1135873A1999-02-09
JPS6222825A1987-01-31
JP2000007890A2000-01-11
JP2003002978A2003-01-08
JP2004231916A2004-08-19
JP2000007890A2000-01-11
EP0985692A22000-03-15
Other References:
See also references of EP 1724299A4
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